IP Library Granted Patent US 12,401,093
Granted Patent B2
US 12,401,093 · App. 18/650,823 · Granted Aug 26, 2025

Assembly manufacturing equipment and method for electrode assembly

Inventors: Se Hyun Yoon (Daejeon, KR); Chun Ho Kwon (Daejeon, KR); Beomsu Kim (Daejeon, KR); Haksoo Lee (Daejeon, KR); Hyeon Woo Jang (Daejeon, KR); Yong Nam Kim (Daejeon, KR); Dong Hyeuk Park (Daejeon, KR)
Assignee: LG Energy Solution, Ltd.
H01M50/46H01M4/043H01M4/0471H01M10/0404H01M10/0431H01M10/045H01M10/0459H01M10/0468H01M10/0583H01M50/463H01M50/466H01M10/0525
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,401,093
App. No.
18/650,823
Granted
Aug 26, 2025
Kind
B2
Abstract

An electrode assembly manufacturing apparatus includes a stack table, a separator supply unit, first and second electrode supply units, and a side sealing device. A stack of a first electrode, a second electrode, and a separator between the first and the second electrode are stackable on the stack table. The separator supply unit is configured for supplying the separator to the stack table. The first electrode supply unit is configured for stacking the first electrode on a section of the separator on the stack table. The second electrode supply unit stacks the second electrode on a further section of the separator on the first electrode. A side sealing device heats at least one side surface of the stack.

Claims (38)

1. An electrode assembly manufacturing apparatus for preparing a stack comprising a first electrode, a second electrode, and a section of a first separator between the first and the second electrodes, the apparatus comprising:

a press unit configured for compressing opposing upper and lower surfaces of the stack; and

a side sealing device configured for heating at least one side surface of the stack extending between the upper and the lower surfaces of the stack to bond either a portion of the first separator separate from the section of the separator and covering a portion of the side surface of the stack or a portion of a second separator covering the side surface of the stack to the side surface of the stack.

2. The electrode assembly manufacturing apparatus of claim 1 , wherein the side sealing device is further configured for compressing the side surface of the stack and the one of the portion of the first separator or the portion of the second separator.

3. The electrode assembly manufacturing apparatus of claim 2 , wherein the bond of the side surface of the stack to the one of the portion of the first separator or the portion of the second separator to the side surface of the stack has an adhesive force in a range from 40 gf/25 mm to 70 gf/25 mm.

4. The electrode assembly manufacturing apparatus of claim 1 , wherein the side sealing device includes a pair of heating bars, and the pair of heating bars are moveable in directions towards each other to compress the side surface of the stack.

5. The electrode assembly manufacturing apparatus of claim 1 , wherein the pair of heating bars are configured for being heated to a temperature of 100° C. to 200° C.

6. The electrode assembly manufacturing apparatus of claim 1 , wherein the pair of heating bars are configured to be pressed against the one of the portion of the first separator or the portion of the second separator for a time of 10 seconds or less while the heating bards are at a temperature of 100° C. to 200° C.

7. The electrode assembly manufacturing apparatus of claim 1 , wherein the press unit is further configured for heating the stack while compressing the stack.

8. The electrode assembly manufacturing apparatus of claim 1 , wherein the press unit is further configured for compressing the upper surface of the stack in a direction along which the stack is stacked.

9. The electrode assembly manufacturing apparatus of claim 1 , wherein the press unit includes a pair of pressing blocks, and wherein the pair of the pressing blocks are configured for movement towards each other to compress the upper and the lower surfaces of the stack.

10. The electrode assembly manufacturing apparatus of claim 9 , wherein each of the pair of the pressing blocks includes a pressing surface, and wherein the pressing surfaces are configured for contacting respective ones of the upper and the lower surfaces of the stack to compress the upper and the lower surfaces such that the upper and the lower surfaces each define a plane.

11. The electrode assembly manufacturing apparatus of claim 9 , wherein the press unit includes a press heater configured for heating the pair of the pressing blocks.

12. The electrode assembly manufacturing apparatus of claim 9 , wherein each of the pair of the pressing blocks of the press unit includes a pressing surface that defines a plane, and wherein the pressing surfaces of the pressing blocks have either one of or both a width that is longer than a width of the stack and a length that is longer than a length of the stack.

13. The electrode assembly manufacturing apparatus of claim 1 , wherein the stack is movable to the side sealing device while supported by the press unit.

14. The electrode assembly manufacturing apparatus of claim 1 , further comprising a stack table configured for supporting the stack, wherein the stack is movable to the side sealing device while supported by the stack table.

15. The electrode assembly manufacturing apparatus of claim 1 , further comprising the stack.

16. The electrode assembly manufacturing apparatus of claim 15 , further comprising the one of the portion of the first separator or the portion of the second separator covering the side surface of the stack, wherein the one of the portion of the first separator or the portion of the second separator is wound around the stack, and wherein the press unit is configured for heating and compressing the one of the portion of the first separator or the portion of the second separator.

17. The electrode assembly manufacturing apparatus of claim 15 , further comprising the one of the portion of the first separator or the portion of the second separator, wherein the one of the portion of the first separator or the portion of the second separator is wound around the stack, and wherein the side sealing device is configured for heating and compressing the one of the portion of the first separator or the portion of the second separator.

18. The electrode assembly manufacturing apparatus of claim 1 , wherein the stack comprises a plurality of first electrodes including the first electrode and a plurality of second electrodes including the second electrode, and the first separator comprises a plurality of sections including the section of the first separator, each section of the first separator extending between adjacent ones of the first and second electrodes,

wherein the first separator comprises a plurality of portions separate from the sections of the first separator including the portion of the first separator, each portion of the first separator covering a respective portion of the side surface of the stack, and

wherein the side sealing device is configured for heating at least one side surface of the stack extending between the upper and the lower surfaces of the stack to bond either two or more of the portions of the first separator or the portion of the second separator to the side surface of the stack.

19. The electrode assembly manufacturing apparatus of claim 1 , wherein the two or more of the portions of the first separator is all of the portions of the first separator separate from the sections of the first separator and covering the respective portions of the side surface of the stack.

20. An electrode assembly manufacturing apparatus for preparing a stack comprising a first electrode, a second electrode, and a first section of a first separator between the first and the second electrodes, the apparatus comprising:

the stack;

either a portion of the first separator separate from the first section of the separator and covering a portion of the side surface of the stack or a portion of a second separator covering the side surface of the stack; and

a side sealing device configured for heating at least one side surface of the stack to bond the one of the portion of the first separator or the portion of the second separator to the side surface of the stack.

21. The electrode assembly manufacturing apparatus of claim 20 , wherein the side sealing device is further configured for compressing the side surface of the stack and the one of the portion of the first separator or the portion of the second separator.

22. The electrode assembly manufacturing apparatus of claim 21 , wherein the bond of the side surface of the stack to the one of the portion of the first separator or the portion of the second separator to the side surface of the stack has an adhesive force in a range from 40 gf/25 mm to 70 gf/25 mm.

23. The electrode assembly manufacturing method of claim 20 , wherein the stack further comprises a second section of the first separator, the second section forming a portion of the side surface of the stack.

24. An electrode assembly manufacturing method for manufacturing a stack, the stack comprising first and second electrodes with a section or sections of a first separator disposed between the first and the second electrodes, the method comprising:

heating at least one side surface of the stack extending between opposing upper and lower surfaces of the stack to bond either a portion of the first separator separate from the section or sections of the separator disposed between the first and the second electrodes and covering the side surface of the stack or a portion of a second separator covering the side surface of the stack to the side surface of the stack.

25. The electrode assembly manufacturing method of claim 24 , further comprising: compressing the upper and the lower surfaces of the stack.

26. The electrode assembly manufacturing method of claim 24 , wherein the heating step results in a bond of the portion of the first separator or the portion of the second separator to the side surface of the stack with an adhesive force in a range from 40 gf/25 mm to 70 gf/25 mm.

27. An electrode assembly fabricated by the electrode assembly manufacturing method of claim 24 .

28. The electrode assembly manufacturing apparatus of claim 1 , wherein the side surface of the stack comprises adjacent bonded side sections of the first separator that extend beyond peripheral edges of the first and second electrodes.

29. The electrode assembly manufacturing apparatus of claim 20 , wherein the side surface of the stack comprises adjacent bonded side sections of the first separator that extend beyond peripheral edges of the first and second electrodes.

30. The electrode assembly manufacturing method of claim 24 , wherein the side surface of the stack comprises adjacent bonded side sections of the first separator that extend beyond peripheral edges of the first and second electrodes.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2024
From: YOON, SE HYUN; KWON, CHUN HO; KIM, BEOMSU; LEE, HAKSOO; JANG, HYEON WOO; KIM, YONG NAM; PARK, DONG HYEUK
To: LG ENERGY SOLUTION, LTD.
Reel/Frame 067280/0264 →
Priority Claims (10)
KR 10-2021-0090588 · Jul 9, 2021 · national
KR 10-2021-0090589 · Jul 9, 2021 · national
KR 10-2021-0090590 · Jul 9, 2021 · national
KR 10-2021-0090591 · Jul 9, 2021 · national
KR 10-2021-0090592 · Jul 9, 2021 · national
KR 10-2021-0090596 · Jul 9, 2021 · national
KR 10-2021-0090597 · Jul 9, 2021 · national
KR 10-2021-0090598 · Jul 9, 2021 · national
KR 10-2021-0090600 · Jul 9, 2021 · national
KR 10-2021-0090601 · Jul 9, 2021 · national
Continuity (2)
Continuation 17860688 · Jul 8, 2022
Related Publication 20240283093A1 · Aug 22, 2024
References Cited (174)
US 9209491B2 · Kim et al. · 2015 [cited by applicant]
US 9793535B2 · Yu et al. · 2017 [cited by applicant]
US 10333126B2 · Joo et al. · 2019 [cited by applicant]
US 10985356B2 · Joo et al. · 2021 [cited by applicant]
US 20040180250A1 · Nanaumi et al. · 2004 [cited by applicant]
US 20050186479A1 · Totsuka et al. · 2005 [cited by applicant]
US 20060019154A1 · Imachi et al. · 2006 [cited by applicant]
US 20070202394A1 · Viavattine · 2007 [cited by applicant]
US 20080280208A1 · Naoi et al. · 2008 [cited by applicant]
US 20090029259A1 · Okazaki et al. · 2009 [cited by applicant]
US 20090136844A1 · Watanabe et al. · 2009 [cited by applicant]
US 20100167176A1 · Kawai · 2010 [cited by applicant]
US 20110052964A1 · Kim et al. · 2011 [cited by applicant]
US 20110104550A1 · Ahn et al. · 2011 [cited by applicant]
US 20130306237A1 · Nagasaka et al. · 2013 [cited by applicant]
US 20140050958A1 · Kwon et al. · 2014 [cited by applicant]
US 20140205879A1 · Jang et al. · 2014 [cited by applicant]
US 20150033527A1 · Park et al. · 2015 [cited by applicant]
US 20150162638A1 · Bernini et al. · 2015 [cited by applicant]
US 20150180082A1 · Jung et al. · 2015 [cited by applicant]
US 20150188108A1 · Miyazawa et al. · 2015 [cited by applicant]
US 20160006072A1 · Cho et al. · 2016 [cited by applicant]
US 20160028064A1 · Choi et al. · 2016 [cited by applicant]
US 20160036087A1 · Na et al. · 2016 [cited by applicant]
US 20160285062A1 · Jo et al. · 2016 [cited by applicant]
US 20160380301A1 · Kosaka et al. · 2016 [cited by applicant]
US 20170125794A1 · Zhao et al. · 2017 [cited by applicant]
US 20180076424A1 · Kato · 2018 [cited by applicant]
US 20180090787A1 · Makino et al. · 2018 [cited by applicant]
US 20180102568A1 · Otohata · 2018 [cited by applicant]
US 20180205109A1 · Cho et al. · 2018 [cited by applicant]
US 20180226623A1 · Cho et al. · 2018 [cited by applicant]
US 20180233725A1 · Yasuda et al. · 2018 [cited by applicant]
US 20180233752A1 · Herrmann et al. · 2018 [cited by applicant]
US 20180248219A1 · Kim et al. · 2018 [cited by applicant]
US 20180294509A1 · Liu et al. · 2018 [cited by applicant]
US 20180342722A1 · Zeng et al. · 2018 [cited by applicant]
US 20190020009A1 · Watanabe et al. · 2019 [cited by applicant]
US 20190044177A1 · Lee et al. · 2019 [cited by applicant]
US 20190051924A1 · Kim et al. · 2019 [cited by applicant]
US 20200006733A1 · Cho et al. · 2020 [cited by applicant]
US 20200127334A1 · Pyo et al. · 2020 [cited by applicant]
US 20200185753A1 · Kwon · 2020 [cited by applicant]
US 20200227787A1 · Kang et al. · 2020 [cited by applicant]
US 20200227788A1 · Chun et al. · 2020 [cited by applicant]
US 20200235434A1 · Lee et al. · 2020 [cited by applicant]
US 20200335813A1 · Oh et al. · 2020 [cited by applicant]
US 20210050616A1 · Taguchi et al. · 2021 [cited by applicant]
US 20210104775A1 · Ono et al. · 2021 [cited by applicant]
US 20210351431A1 · Hwang · 2021 [cited by applicant]
US 20220006161A1 · Kim et al. · 2022 [cited by applicant]
US 20220029246A1 · Watanabe et al. · 2022 [cited by applicant]
US 20220393225A1 · Kim et al. · 2022 [cited by applicant]
US 20230006262A1 · Maruhashi et al. · 2023 [cited by applicant]
US 20230028439A1 · Yoon · 2023 [cited by examiner]
US 20230036396A1 · Hosokawa et al. · 2023 [cited by applicant]
CN 002763997Y · 2006 [cited by applicant]
CN 210403945U · 2020 [cited by applicant]
EP 2856552B1 · 2016 [cited by applicant]
EP 3905417A1 · 2021 [cited by applicant]
EP 3985778A1 · 2022 [cited by applicant]
EP 4027421A1 · 2022 [cited by applicant]
JP S45005056Y1 · 1970 [cited by applicant]
JP h02046663A · 1990 [cited by applicant]
JP H08138722A · 1996 [cited by applicant]
JP 2002208442A · 2002 [cited by applicant]
JP 2002367628A · 2002 [cited by applicant]
JP 2003151615A · 2003 [cited by applicant]
JP 2003201352A · 2003 [cited by applicant]
JP 2005243455A · 2005 [cited by applicant]
JP 2006032246A · 2006 [cited by applicant]
JP 2008091192A · 2008 [cited by applicant]
JP 2008282739A · 2008 [cited by applicant]
JP 2009218105A · 2009 [cited by applicant]
JP 2009259719A · 2009 [cited by applicant]
JP 2010199281A · 2010 [cited by applicant]
JP 2012033275A · 2012 [cited by applicant]
JP 2013149477A · 2013 [cited by applicant]
JP 2013254629A · 2013 [cited by applicant]
JP 2015141791A · 2015 [cited by applicant]
JP 2015531989A · 2015 [cited by applicant]
JP 2015532766A · 2015 [cited by applicant]
JP 2016103425A · 2016 [cited by applicant]
JP 2017016946A · 2017 [cited by applicant]
JP 2018018712A · 2018 [cited by applicant]
JP 201841703A · 2018 [cited by applicant]
JP 2018510472A · 2018 [cited by applicant]
JP 2018532240A · 2018 [cited by applicant]
JP 2018181843A · 2018 [cited by applicant]
JP 2019153427A · 2019 [cited by applicant]
JP 2019199028A · 2019 [cited by applicant]
JP 2020145123A · 2020 [cited by applicant]
JP 6844476B2 · 2021 [cited by applicant]
KR 20080063523A · 2008 [cited by applicant]
KR 20100051353A · 2010 [cited by applicant]
KR 20110048132A · 2011 [cited by applicant]
KR 101058786B1 · 2011 [cited by applicant]
KR 101209010B1 · 2012 [cited by applicant]
KR 20130132230A · 2013 [cited by applicant]
KR 20140002718A · 2014 [cited by applicant]
KR 20140022447A · 2014 [cited by applicant]
KR 20140060797A · 2014 [cited by applicant]
KR 20140062761A · 2014 [cited by applicant]
KR 20140064405A · 2014 [cited by applicant]
KR 20150016671A · 2015 [cited by applicant]
KR 20150020667A · 2015 [cited by applicant]
KR 20150022264A · 2015 [cited by applicant]
KR 20150035079A · 2015 [cited by applicant]
KR 20150034944A · 2015 [cited by applicant]
KR 20150049892A · 2015 [cited by applicant]
KR 20150050505A · 2015 [cited by applicant]
KR 101531234B1 · 2015 [cited by applicant]
KR 20150144183A · 2015 [cited by applicant]
KR 101595621B1 · 2016 [cited by applicant]
KR 20160054219A · 2016 [cited by applicant]
KR 101643593B1 · 2016 [cited by applicant]
KR 20160108116A · 2016 [cited by applicant]
KR 101704759B1 · 2017 [cited by applicant]
KR 101761720B1 · 2017 [cited by applicant]
KR 101784033B1 · 2017 [cited by applicant]
KR 20170124336A · 2017 [cited by applicant]
KR 20180006324A · 2018 [cited by applicant]
KR 101826894B1 · 2018 [cited by applicant]
KR 101838350B1 · 2018 [cited by applicant]
KR 20180037847A · 2018 [cited by applicant]
KR 20180061872A · 2018 [cited by applicant]
KR 20180128770A · 2018 [cited by applicant]
KR 101941144B1 · 2019 [cited by applicant]
KR 101963313B1 · 2019 [cited by applicant]
KR 20190054491A · 2019 [cited by applicant]
KR 20190056812A · 2019 [cited by applicant]
KR 20190064977A · 2019 [cited by applicant]
KR 101995038B1 · 2019 [cited by applicant]
KR 102044363B1 · 2019 [cited by applicant]
KR 20200023852A · 2020 [cited by applicant]
KR 20200023853A · 2020 [cited by applicant]
KR 20200023854A · 2020 [cited by applicant]
KR 20200036641A · 2020 [cited by applicant]
KR 20200061033A · 2020 [cited by applicant]
KR 20200067575A · 2020 [cited by applicant]
KR 20200069171A · 2020 [cited by applicant]
KR 20200094325A · 2020 [cited by applicant]
KR 20200095896A · 2020 [cited by applicant]
KR 102164576B1 · 2020 [cited by applicant]
KR 20200145375A · 2020 [cited by applicant]
KR 20210033327A · 2021 [cited by applicant]
KR 102253132B1 · 2021 [cited by applicant]
KR 20210049297A · 2021 [cited by applicant]
KR 20210051155A · 2021 [cited by applicant]
KR 20210051164A · 2021 [cited by applicant]
KR 20210074026A · 2021 [cited by applicant]
KR 102256438B1 · 2021 [cited by applicant]
KR 102265741B1 · 2021 [cited by applicant]
KR 20210135861A · 2021 [cited by applicant]
WO 2006120959A1 · 2006 [cited by applicant]
WO 2016152922A1 · 2016 [cited by applicant]
WO 2017018456A1 · 2017 [cited by applicant]
WO 2017149991A1 · 2017 [cited by applicant]
WO 2018116295A1 · 2018 [cited by applicant]
WO 2019188719A1 · 2019 [cited by applicant]
WO 2021131879A1 · 2021 [cited by applicant]
International Search Report for Application No. PCT/KR2022/010001 mailed Nov. 8, 2022, pp. 1-3. [cited by applicant]
International Search Report for Application No. PCT/KR2022/010005 mailed Nov. 8, 2022, pp. 1-3. [cited by applicant]
International Search Report for Application No. PCT/KR2022/010006 mailed Nov. 4, 2022, pp. 1-3. [cited by applicant]
International Search Report for Application No. PCT/KR2022/010007 mailed Oct. 28, 2022, pp. 1-3. [cited by applicant]
International Search Report for Application No. PCT/KR2022/010008 mailed Nov. 4, 2022, pp. 1-3. [cited by applicant]
International Search Report for Application No. PCT/KR2022/010009 mailed Nov. 4, 2022, pp. 1-3. [cited by applicant]
International Search Report for Application No. PCT/KR2022/010010 mailed Oct. 28, 2022, pp. 1-3. [cited by applicant]
Notice of Preliminary Rejection for Korean Application No. 10-2022-0084662 dated Jan. 1, 2023. 8 pgs. [cited by applicant]
Written Opinion of the ISA for PCT/KR2022/010000 mailed Oct. 26, 2022. 4 pgs. [cited by applicant]
Written Opinion of the ISA for PCT/KR2022/010003 mailed Nov. 2, 2022. 3 pgs. [cited by applicant]
Written Opinion of the ISA for PCT/KR2022/010004 mailed Oct. 26, 2022. 4 pgs. [cited by applicant]
Extended European Search Report including Written Opinion for Application No. 22838071.3 dated Jun. 24, 2024, pp. 1-8. [cited by applicant]
Extended European Search Report for Application No. 22838066.3 dated Aug. 5, 2024, pp. 1-5. [cited by applicant]