Method and system for imprinting unique identifiers on semiconductor dies
Various systems and methods for imprinting a unique identifier on a semiconductor die are disclosed herein. Example embodiments involve receiving a substrate at a photolithography station, the substrate including a photosensitive layer and an area for forming semiconductor dies, forming circuits on the substrate using a photolithography mask, imprinting a unique identifier on each semiconductor die on the substrate using a digital photomask and removing the substrate containing the semiconductor dies containing the circuits and the unique identifiers from the photolithography station. In some embodiments, each unique identifier is associated with a unique record for recording characteristics of the substrate, of the semiconductor die and of the unique identifier. In some embodiments, the digital photomask includes dynamically-controlled pixels, controllable to define a unique pattern for each unique identifier. In some embodiments, the unique identifier is a two-dimensional code.
1. A method for imprinting a unique identifier on a semiconductor die at a photolithography station, the method comprising:
receiving the substrate at the photolithography station, the substrate comprising a photosensitive layer and an area for forming a plurality of semiconductor dies;
forming, by a projector of the photolithography station, a plurality of circuits on the substrate using at least one photolithography mask, each circuit corresponding to a semiconductor die;
providing, by a processor in communication with the photolithography station, a unique identifier for each die;
imprinting, by the projector, the unique identifier on each semiconductor die on the substrate using at least one digital photomask, the at least one digital photomask comprising dynamically controlled pixels controllable to define a unique pattern for the unique identifier; and
removing the substrate comprising the plurality of semiconductor dies from the photolithography station, each semiconductor die comprising the circuit and the unique identifier; wherein each unique identifier is stored in a record of a database for subsequent retrieval, each record comprising at least said unique identifier and information unique to the semiconductor die.
2. The method of claim 1 , further comprising determining one or more of a position and a size of the unique identifier based on one or more of a position of the circuit and a pattern of the circuit for each of the semiconductor die.
3. The method of claim 1 , wherein imprinting the unique identifier on each semiconductor die comprises imprinting the unique identifier on an outer periphery of the semiconductor die.
4. The method of claim 1 , wherein the record comprises one or more of: an origin of the substrate, a lot of the semiconductor die, a lot of the substrate, a batch for the semiconductor die, a batch for the substrate, a position of the semiconductor die on the substrate, a size of the die, one or more dimensions for the unique identifier, a position of the unique identifier on the semiconductor die, a thickness of the unique identifier, a type of material for the unique identifier, and a fabrication history of the semiconductor die.
5. The method of claim 1 , wherein imprinting the unique identifier comprises imprinting a unique two-dimensional code.
6. The method of claim 5 , wherein the unique two-dimensional code is one of a data matrix code, a QR code, an Aztec code, a flashcode and a Semacode.
7. The method of claim 1 , wherein imprinting the unique identifier comprises imprinting the unique identifier on a thin film comprising at least a portion of the circuit.
8. A system for imprinting a unique identifier on a semiconductor die, the system comprising:
a processor operable to determine the unique identifier on the semiconductor die;
a database in communication with the processor for storing a record associated with the unique identifier;
a photolithography station in communication with the processor, the photolithography station configured to:
receive a substrate comprising a photosensitive layer and an area for forming a plurality of semiconductor dies;
form, by a projector, a plurality of circuits on the substrate using at least one photolithography mask, each circuit corresponding to a semiconductor die;
providing, by a processor in communication with the photolithography station, a unique identifier for each die;
imprint, by the projector, the unique identifier on each semiconductor die on the substrate using at least one digital photomask, the at least one digital photomask comprising dynamically controlled pixels wherein the processor is operable to control the pixels of the digital photomask to define a unique pattern for the unique identifier; and
remove the substrate comprising the plurality of semiconductor dies from the photolithography station, each semiconductor die comprising the circuit and the unique identifier; wherein each unique identifier is stored in a record of a database for subsequent retrieval, each record comprising at least said unique identifier and information unique to the semiconductor die.
9. The system of claim 8 , wherein the processor is further operable to determine one or more of a position and a size of the unique identifier based on one or more of a position of the circuit and a pattern of the circuit for each of the semiconductor dies.
10. The system of claim 8 , wherein imprinting the unique identifier on each semiconductor die comprises imprinting the unique identifier on an outer periphery of the semiconductor die.
11. The system of claim 8 , wherein the record comprises one or more of: an origin of the substrate, a lot of the semiconductor die, a lot of the substrate, a batch for the semiconductor die, a batch for the substrate, a position of the semiconductor die on the substrate, a size of the die, one or more dimensions for the unique identifier, a position of the unique identifier on the semiconductor die, a thickness of the unique identifier, a type of material for the unique identifier, and a fabrication history of the semiconductor die.
12. The system of claim 8 , wherein imprinting the unique identifier comprises imprinting a unique two-dimensional code.
13. The system of claim 12 , wherein the unique two-dimensional code is one of a data matrix code, a QR code, an Aztec code, a flashcode and a Semacode.
14. The system of claim 8 , wherein imprinting the unique identifier comprises imprinting the unique identifier on a thin film comprising at least a portion of the circuit.
15. A method for imprinting a unique identifier on a semiconductor die at a lithography station, the method comprising:
receiving the substrate at the photolithography station, the substrate comprising a photosensitive layer and an area for forming a plurality of semiconductor dies;
providing, by a processor in communication with the photolithography station, the unique identifier for each die;
imprinting, by a projector of the photolithography station, a pattern onto the substrate using at least one digital photomask, the pattern defining a circuit for each semiconductor die and a unique identifier for each semiconductor die and the at least one digital photomask comprising dynamically controlled pixels, controllable to define a unique pattern for the unique identifier; and
removing the substrate from the photolithography station, the substrate comprising the plurality of semiconductor dies, each semiconductor die comprising the circuit and the unique identifier; wherein each unique identifier is stored in a record of a database for subsequent retrieval, each record comprising at least said unique identifier and information unique to the semiconductor die.
16. The method of claim 15 , wherein the at least one digital photomask further comprises at least one region defining a static pattern of pixels.
17. The method of claim 15 , further comprising determining one or more of a position and a size of the unique identifier based on one or more of a position of the circuit and a pattern of the circuit for each of the semiconductor dies.
18. The method of claim 15 , wherein imprinting the pattern comprising the circuit and the unique identifier comprises imprinting the unique identifier on an outer periphery of the semiconductor die.
19. The method of claim 15 , wherein the record comprises one or more of: an origin of the substrate, a lot of the semiconductor die, a lot of the substrate, a batch for the semiconductor die, a batch for the substrate, a position of the semiconductor die on the substrate, a size of the die, one or more dimensions for the unique identifier, a thickness of the unique identifier, a position of the unique identifier on the semiconductor die, a type of material for the unique identifier, and a fabrication history of the semiconductor die.
20. The method of claim 15 , wherein the unique identifier is a unique two-dimensional code.
21. The method of claim 20 , wherein the unique two-dimensional code is one of a data matrix code, a QR code, an Aztec code, a flashcode and a Semacode.
22. A system for imprinting a unique identifier on a semiconductor die, the system comprising:
a processor operable to determine the unique identifier on the semiconductor die;
a database in communication with the processor for storing a record associated with the unique identifier; and
a photolithography station in communication with the processor, the photolithography station configured to:
receive the substrate, the substrate comprising a photosensitive layer and an area for forming a plurality of semiconductor dies;
imprint, by a projector of the photolithography station, a pattern onto the substrate using at least one digital photomask, the pattern defining a circuit for each semiconductor die and a unique identifier for each semiconductor die; and the at least one digital photomask comprising dynamically-controlled pixels, wherein the processor is operable to control the pixels to define a unique pattern for the unique identifier; and
remove the substrate from the photolithography station, the substrate comprising the plurality of semiconductor dies, each semiconductor die comprising the circuit and the unique identifier; wherein each unique identifier is stored in a record of a database for subsequent retrieval, each record comprising at least said unique identifier and information unique to the semiconductor die.
23. The system of claim 22 , wherein the at least one digital photomask further comprises at least one region defining a static pattern of pixels.
24. The system of claim 22 , wherein the processor is further operable to determine one or more of a position and a size of the unique identifier based on one or more of a position of the circuit and a pattern of the circuit for each of the semiconductor dies.
25. The system of claim 22 , wherein imprinting the pattern defining the circuit and the unique identifier comprises imprinting the unique identifier on an outer periphery of the semiconductor die.
26. The system of claim 22 , wherein the record comprises one or more of: an origin of the substrate, a lot of the semiconductor die, a lot of the substrate, a batch for the semiconductor die, a batch for the substrate, a position of the semiconductor die on the substrate, a size of the die, one or more dimensions for the unique identifier, a thickness of the unique identifier, a position of the unique identifier on the semiconductor die, a type of material for the unique identifier, and a fabrication history of the semiconductor die.
27. The system of claim 22 , wherein the unique identifier is a unique two-dimensional code.
28. The system of claim 27 , wherein the unique two-dimensional code is one of a data matrix code, a QR code, an Aztec code, a flashcode and a Semacode.