Pattern inspection apparatus and pattern inspection method inspecting a pattern using an image corrected using offset amount based upon dark noise levels
A pattern inspection apparatus includes an illumination optical system to illuminate an inspection substrate on which a pattern is formed, an offset calculation circuit to calculate an offset amount which depends on an image accumulation time of each of a plurality of photo sensor elements arrayed two-dimensionally, a time delay integration (TDI) sensor to include the plurality of photo sensor elements, to acquire an image of the inspection substrate by receiving a transmitted light or a reflected light from the inspection substrate by the plurality of photo sensor elements, to correct, using the offset amount, a pixel value of optical image data of an acquired image, and to output the optical image data having been corrected, and a comparison circuit to compare an optical image formed by the optical image data output from the TDI sensor with a reference image.
1 . A pattern inspection apparatus comprising:
an illumination optical system configured to illuminate an inspection substrate on which a pattern is formed;
an offset calculation circuit configured to calculate an offset amount based on a difference between a dark noise level Dr 1 at an image accumulation time t 1 of each of a plurality of photo sensor elements arrayed two-dimensionally and a dark noise level Dr 2 in a case that the image accumulation time t 1 is switched to an image accumulation time t 2 different from the image accumulation time t 1 ;
a time delay integration (TDI) sensor configured to include the plurality of photo sensor elements, to acquire an image of the inspection substrate by receiving one of a transmitted light and a reflected light from the inspection substrate by the plurality of photo sensor elements, to correct, using the offset amount, a pixel value of optical image data of the acquired image, and to output the optical image data having been corrected; and
a comparison circuit configured to compare an optical image formed by the optical image data output from the TDI sensor with a reference image, wherein
the offset calculation circuit calculates the offset amount according to an image acquisition timing from the time when the image accumulation time is switched until the dark noise level Dr 2 is stabilized, and
the TDI sensor corrects, for each image acquisition timing, the optical image data by using the offset amount corresponding to the image acquisition timing concerned.
2 . The apparatus according to claim 1 , wherein the offset amount is a change amount of an inspection signal corresponding to a change amount of a dark noise level.
3 . A pattern inspection method comprising:
illuminating an inspection substrate on which a pattern is formed;
calculating an offset amount based on a difference between a dark noise level Dr 1 at an image accumulation time t 1 of each of a plurality of photo sensor elements arrayed two-dimensionally and a dark noise level Dr 2 in a case that the image accumulation time t 1 is switched to an image accumulation time t 2 different from the image accumulation time t 1 ;
acquiring, using a time delay integration (TDI) sensor which includes the plurality of photo sensor elements, an image of the inspection substrate by receiving one of a transmitted light and a reflected light from the inspection substrate by the plurality of photo sensor elements, correcting, using the offset amount, a pixel value of optical image data of the acquired image, and outputting the optical image data having been corrected; and
comparing an optical image formed by the optical image data output from the TDI sensor with a reference image, wherein
the offset amount is calculated according to an image acquisition timing from the time when the image accumulation time is switched until the dark noise level Dr 2 is stabilized, and
the TDI sensor corrects, for each image acquisition timing, the optical image data by using the offset amount corresponding to the image acquisition timing concerned.