System and method for process window optimization in a virtual semiconductor device fabrication environment
A virtual fabrication environment for semiconductor device fabrication that includes an analytics module for performing process window optimization is discussed.
1. A non-transitory computer-readable medium holding computing device-executable instructions for performing process window optimization in a virtual fabrication environment for semiconductor device fabrication, the instructions when executed causing at least one computing device equipped with one or more processors to:
receive, for a Design of Experiment (DOE) for a semiconductor device structure to be virtually fabricated in a computing device-generated virtual fabrication environment, a selected deck of 2D design data and a process sequence that includes a plurality of process steps;
receive one or more input factors for one or more selected variable parameters for one or more of the plurality of process steps in the DOE;
perform, based on the DOE, a simulation with a uniform or approximately even type of distribution in the virtual fabrication environment, the simulation including a plurality of virtual fabrication runs, the plurality of virtual fabrication runs building a plurality of 3D models of the semiconductor device structure;
receive, via a user interface in the virtual fabrication environment, a user selection of one or more virtual metrology optimization targets, each selection of the one or more virtual metrology optimization targets accompanied by a minimum and maximum virtual metrology value;
identify in the virtual fabrication environment an optimized result indicating a yield associated with each of the one or more selected variable parameters by limiting a search space to results satisfying the minimum and maximum virtual metrology values for the virtual metrology optimization targets, wherein the yield is determined based on a percentage of the plurality of virtual fabrication runs that result in corresponding 3D models satisfying the minimum and maximum virtual metrology values; and
display or export the optimized result associated with each of the one or more selected variable parameters, wherein the displayed or exported optimized result includes an indication of a sensitivity of the yield to each of the one or more selected variable parameters and a sensitivity of the yield to a width of an input window used for selecting values of each of the one or more selected variable parameters in the plurality of virtual fabrication runs, the input window centered on a nominal value for the one or more selected variable parameters and the width of the input window indicative of an acceptable variability of the one or more selected variable parameters.
2. The medium of claim 1 wherein the simulation is a Monte Carlo simulation and receiving the one or more input factors includes receiving an upper and lower limit value and a specification of a process of record (POR) nominal value for each of the one or more selected variable parameters, the instructions when executed further causing the at least one computing device to:
display the optimized result indicating a yield associated with each of the one or more selected variable parameters when varying its value between its upper and lower limit value while holding the remaining parameters of the one or more selected variable parameters at their respective POR nominal values.
3. The medium of claim 2 , wherein the instructions when executed further cause the at least one computing device to:
display a pre-optimization result from results of the Monte Carlo simulation indicating a yield associated with each of the one or more selected variable parameters when using the respective POR nominal values, the pre-optimization result displayed before displaying the optimization result.
4. The medium of claim 1 , wherein the one or more selected variable parameters are programmatically identified in the virtual fabrication environment prior to the receipt of the one or more input factors.
5. The medium of claim 1 wherein the one or more selected variable parameters are user-selected and received via a user interface generated in the virtual fabrication environment.
6. The medium of claim 1 , wherein the instructions when executed further cause the at least one computing device to:
display a confidence interval for the yield indicated in the optimized result.
7. The medium of claim 1 , wherein the instructions when executed further cause the at least one computing device to:
receive a user-selected number of virtual fabrication runs for the DOE.
8. The medium of claim 1 wherein the virtual metrology optimization targets are selected from a displayed list of a plurality of available virtual metrology targets based on and following the performance of the simulation.
9. The medium of claim 1 wherein the optimized result for each of the one or more selected variable parameters is displayed in a tabular or plot format.
10. The medium of claim 1 wherein the optimized result for each of the one or more selected variable parameters is displayed in a histogram format.
11. A computing device implemented method for performing process window optimization in a virtual fabrication environment for semiconductor device fabrication, the method perform with at least one computing device including one or more processors, the method comprising:
receiving, for a Design of Experiment (DOE) for a semiconductor device structure to be virtually fabricated in a computing device-generated virtual fabrication environment, a selected deck of 2D design data and a process sequence that includes a plurality of process steps;
receiving one or more input factors for one or more selected variable parameters for one or more of the plurality of process steps in the DOE;
performing, based on the DOE, a simulation with a uniform or approximately even type of distribution in the virtual fabrication environment, the simulation including a plurality of virtual fabrication runs, the plurality of virtual fabrication runs building a plurality of 3D models of the semiconductor device structure;
receiving, via a user interface in the virtual fabrication environment, a user selection of one or more virtual metrology optimization targets, each selection of the one or more virtual metrology optimization targets accompanied by a minimum and maximum virtual metrology value;
identifying in the virtual fabrication environment an optimized result indicating a yield associated with each of the one or more selected variable parameters by limiting a search space to results satisfying the minimum and maximum virtual metrology values for the virtual metrology optimization targets, wherein the yield is determined based on a percentage of the plurality of virtual fabrication runs that result in corresponding 3D models satisfying the minimum and maximum virtual metrology values; and
displaying or exporting the optimized result associated with each of the one or more selected variable parameters, wherein the displayed or exported optimized result includes an indication of a sensitivity of the yield to each of the one or more selected variable parameters and a sensitivity of the yield to a width of an input window used for selecting values of each of the one or more selected variable parameters in the plurality of virtual fabrication runs, the input window centered on a nominal value for the one or more selected variable parameters and the width of the input window indicative of an acceptable variability of the one or more selected variable parameters.
12. The method of claim 11 wherein the simulation is a Monte Carlo simulation and receiving the one or more input factors includes receiving an upper and lower limit value and a specification of a process of record (POR) nominal value for each of the one or more selected variable parameters, the method further comprising:
displaying the optimized result indicating a yield associated with each of the one or more selected variable parameters when varying its value between its upper and lower limit value while holding the remaining parameters of the one or more selected variable parameters at their respective POR nominal values.
13. The method of claim 12 , further comprising:
displaying a pre-optimization result from results of the Monte Carlo simulation indicating a yield associated with each of the one or more selected variable parameters when using the respective POR nominal values, the pre-optimization result displayed before displaying the optimization result.
14. The method of claim 11 , wherein the one or more selected variable parameters are programmatically identified in the virtual fabrication environment prior to the receipt of the one or more input factors.
15. The method of claim 11 wherein the one or more selected variable parameters are user-selected and received via a user interface generated in the virtual fabrication environment.
16. The method of claim 11 , the method further comprising:
displaying a confidence interval for the yield indicated in the optimized result.
17. The method of claim 11 , the method further comprising:
receiving a user-selected number of virtual fabrication runs for the DOE.
18. The method of claim 11 wherein the virtual metrology optimization targets are selected from a displayed list of a plurality of available virtual metrology targets based on and following the performance of the simulation.
19. The method of claim 11 wherein the optimized result for each of the one or more selected variable parameters is displayed in a tabular or plot format.
20. The method of claim 11 wherein the optimized result for each of the one or more selected variable parameters is displayed in a histogram format.
21. A virtual fabrication system, comprising:
at least computing device equipped with one or more processors and configured to generate a virtual fabrication environment for semiconductor device fabrication that includes an analytics module, the virtual fabrication environment:
receiving, for a Design of Experiment (DOE) for a semiconductor device structure to be virtually fabricated, a selected deck of 2D design data and a process sequence that includes a plurality of process steps;
receiving one or more input factors for one or more selected variable parameters for one or more of the plurality of process steps in the DOE;
performing, based on the DOE, a simulation with a uniform or approximately even type of distribution, the simulation including a plurality of virtual fabrication runs, the plurality of virtual fabrication runs building a plurality of 3D models of the semiconductor device structure;
receiving, via a user interface, a user selection of one or more virtual metrology optimization targets, each selection of the one or more virtual metrology optimization targets accompanied by a minimum and maximum virtual metrology value;
identifying an optimized result indicating a yield associated with each of the one or more selected variable parameters by limiting a search space to results satisfying the minimum and maximum virtual metrology values for the virtual metrology optimization targets, wherein the yield is determined based on a percentage of the plurality of virtual fabrication runs that result in corresponding 3D models satisfying the minimum and maximum virtual metrology values; and
displaying or exporting the optimized result associated with each of the one or more selected variable parameters, wherein the displayed or exported optimized result includes an indication of a sensitivity of the yield to each of the one or more selected variable parameters and a sensitivity of the yield to a width of an input window used for selecting values of each of the one or more selected variable parameters in the plurality of virtual fabrication runs, the input window centered on a nominal value for the one or more selected variable parameters and the width of the input window indicative of an acceptable variability of the one or more selected variable parameters; and
a display surface in communication with the at least one computing device, the display surface configured to display the plurality of 3D structural models in a 3D view and the optimized result.
22. A non-transitory computer-readable medium holding computing device-executable instructions for performing process window optimization in a virtual fabrication environment for semiconductor device fabrication, the instructions when executed causing at least one computing device equipped with one or more processors to:
receive, for a semiconductor device structure to be virtually fabricated in a computing device-generated virtual fabrication environment, a selected deck of 2D design data and a process sequence that includes a plurality of process steps;
receive one or more input factors for one or more selected variable parameters for one or more of the plurality of process steps;
perform, using the one or more input factors, a simulation with a uniform or approximately even type of distribution in the virtual fabrication environment, the simulation including a plurality of virtual fabrication runs, the plurality of virtual fabrication runs building a plurality of 3D models of the semiconductor device structure;
receive, via a user interface in the virtual fabrication environment, a user selection of one or more virtual metrology optimization targets;
identify in the virtual fabrication environment an optimized result corresponding to an optimized process window indicating a yield associated with each of the one or more selected variable parameters, each associated with one or more of the plurality of process steps, by limiting a search space for optimized process parameters to results satisfying the minimum and maximum virtual metrology values for the virtual metrology optimization targets; and
display or export the optimized result associated with each of the one or more selected variable parameters, wherein the displayed or exported optimized result includes an indication of a sensitivity of the yield to each of the one or more selected variable parameters and a sensitivity of the yield to a width of an input window used for selecting values of each of the one or more selected variable parameters in the plurality of virtual fabrication runs, wherein the input window is a subset of the search space, wherein the yield is determined as a percentage of the virtual fabrication runs that fall within the input window that produce models that meet the virtual metrology optimization targets, and wherein the width of the input window indicates an acceptable variability of the one or more selected variable parameters.