Deposition apparatus and method for seating mask of deposition apparatus
An embodiment provides a deposition apparatus including a mask frame, an opening sheet, a deposition mask, and an electrostatic chuck. In the mask frame, a first opening part is defined. The opening sheet is disposed on the mask frame. In the opening sheet, a second opening part overlapping the first opening part is defined. The deposition mask is disposed on the opening sheet. In the deposition mask, a plurality of third opening parts overlapping the second opening part are defined. The electrostatic chuck is disposed on the deposition mask and on which a substrate is disposed. The substrate is disposed on a surface of the electrostatic chuck, and AC power is applied to the deposition mask.
1. A deposition apparatus comprising:
a mask frame in which a first opening part is defined;
an opening sheet disposed on the mask frame and in which a second opening part overlapping the first opening part is defined;
a deposition mask disposed on the opening sheet and in which a plurality of third opening parts overlapping the second opening part are defined;
an electrostatic chuck disposed on the deposition mask and on which a substrate is disposed;
a substrate support part supporting an edge of the substrate; and
a connection bar disposed on the deposition mask,
wherein the substrate is disposed on a surface of the electrostatic chuck,
wherein AC power is applied to the deposition mask,
wherein the deposition mask comprises:
a polymer mask in which the plurality of third opening parts are defined; and
a conductive layer disposed on a surface of the polymer mask and in which the plurality of third opening parts are defined,
wherein when viewed on a plane, the polymer mask and the conductive layer have the same shape and entirely overlap each other,
wherein the AC power is applied to the conductive layer,
wherein the connection bar is disposed adjacent to an edge of the deposition mask,
wherein a connection groove overlapping the connection bar is defined on an upper surface of the opening sheet adjacent to an edge of the opening sheet,
wherein the connection bar penetrates the polymer mask and the conductive layer and ends at a portion of the upper surface of the opening sheet where the connection groove is defined, and the connection bar does not extend through the opening sheet,
wherein a first guide groove is defined at an edge of the mask frame, and the first guide groove overlaps the substrate support part when viewed on the plane and extends through the mask frame in the thickness direction,
wherein a second guide groove is defined at an edge of the opening sheet, and the second guide groove overlaps the first guide groove when viewed on the plane and extends through the opening sheet in the thickness direction,
wherein a third guide groove is defined at an edge of the deposition mask, and the third guide groove overlaps the second guide groove when viewed on the plane and extends through the deposition mask in the thickness direction,
wherein when the substrate support part is moved up and down, the substrate support part moves along the first, second, and third guide grooves,
wherein when a deposition process is performed, the substrate support part is disposed within the first, second, and third guide grooves,
wherein the connection groove of the opening sheet is a recessed portion extending from the upper surface of the opening sheet in a direction toward the mask frame, and a portion of the conductive layer of the deposition mask includes a grooved portion disposed inside the recessed portion of the opening sheet.
2. The deposition apparatus of claim 1 , wherein the substrate is grounded.
3. The deposition apparatus of claim 2 , wherein the substrate comprises:
a plurality of wires; and
a plurality of pads connected to the wires,
wherein each of the plurality of pads connected to the wires is grounded.
4. The deposition apparatus of claim 1 , wherein the polymer mask comprises a polymer film.
5. The deposition apparatus of claim 1 , wherein the deposition mask is disposed close to the substrate by an electrostatic force between the conductive layer and the substrate.
6. The deposition apparatus of claim 1 , wherein the mask frame, the opening sheet, and the deposition mask are in contact with each other.
7. The deposition apparatus of claim 6 , wherein the AC power is connected to the mask frame.
8. The deposition apparatus of claim 6 , wherein the AC power is connected to the opening sheet.
9. The deposition apparatus of claim 1 , wherein the electrostatic chuck comprises:
a first electrode having a first polarity; and
a second electrode having a second polarity opposite to the first polarity,
wherein the substrate is in contact with the surface of the electrostatic chuck by an electrostatic force generated by the first and second electrodes.
10. The deposition apparatus of claim 1 , wherein the deposition mask is connected to the opening sheet through the connection bar.
11. The deposition apparatus of claim 1 , wherein the connection bar is disposed at a height equal to or lower than a surface of the deposition mask.
12. A deposition apparatus comprising:
a mask frame in which a first opening part is defined;
an opening sheet disposed on the mask frame and in which a second opening part overlapping the first opening part is defined;
a deposition mask disposed on the opening sheet and in which a plurality of third opening parts overlapping the second opening part are defined;
an electrostatic chuck disposed on the deposition mask and on which a substrate is disposed;
a substrate support part supporting an edge of the substrate; and
a connection bar disposed on the deposition mask,
wherein the substrate is disposed on a surface of the electrostatic chuck,
wherein the deposition mask comprises:
a polymer mask in which the plurality of third opening parts are defined; and
a conductive layer disposed on a surface of the polymer mask and in which the plurality of third opening parts are defined,
wherein the substrate and the conductive layer are charged with different polarities,
wherein when viewed on a plane, the polymer mask and the conductive layer have the same shape and entirely overlap each other,
wherein AC power is applied to the conductive layer,
wherein the connection bar is disposed adjacent to an edge of the deposition mask,
wherein a connection groove overlapping the connection bar is defined on an upper surface of the opening sheet adjacent to an edge of the opening sheet,
wherein the connection bar penetrates the polymer mask and the conductive layer and ends at a portion of the upper surface of the opening sheet where the connection groove is defined, and the connection bar does not extend through the opening sheet,
wherein a first guide groove is defined at an edge of the mask frame, and the first guide groove overlaps the substrate support part when viewed on the plane and extends through the mask frame in the thickness direction,
wherein a second guide groove is defined at an edge of the opening sheet, and the second guide groove overlaps the first guide groove when viewed on the plane and extends through the opening sheet in the thickness direction,
wherein a third guide groove is defined at an edge of the deposition mask, and the third guide groove overlaps the second guide groove when viewed on the plane and extends through the deposition mask in the thickness direction,
wherein when the substrate support part is moved up and down, the substrate support part moves along the first, second, and third guide grooves,
wherein when a deposition process is performed, the substrate support part is disposed within the first, second, and third guide grooves,
wherein the connection groove of the opening sheet is a recessed portion extending from the upper surface of the opening sheet in a direction toward the mask frame, and a portion of the conductive layer of the deposition mask includes a grooved portion disposed inside the recessed portion of the opening sheet.