IP Library Granted Patent US 12,437,793
Granted Patent B2
US 12,437,793 · App. 18/245,784 · Granted Oct 7, 2025

Driving method of semiconductor device

Inventors: Yuki Okamoto (Kanagawa, JP); Tatsuya Onuki (Kanagawa, JP); Takanori Matsuzaki (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
G11C11/2257G11C11/2273G11C11/2293
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Quick Facts
Patent No.
US 12,437,793
App. No.
18/245,784
Granted
Oct 7, 2025
Kind
B2
Abstract

A semiconductor device with high reliability is provided. The semiconductor device includes a memory cell including a first ferroelectric capacitor and a reference memory cell including a second ferroelectric capacitor. In a first period, first binary data is written to the memory cell, and first reference binary data is written to the reference memory cell. In a second period, the first binary data is read from the memory cell, and the first reference binary data is read from the reference memory cell. In a third period, logic operation of the first binary data and the first reference binary data is performed. In a fourth period, second binary data is written to the memory cell, and second reference binary data is written to the reference memory cell. A value of the first binary data and a value of the second binary data are different from each other, and a value of the first reference binary data and a value of the second reference binary data are different from each other.

Claims (64)

1. A method for driving a semiconductor device comprising a memory cell comprising a ferroelectric capacitor, comprising:

writing binary data to the memory cell in a first period;

reading the binary data from the memory cell in a second period; and

generating a polarization reversal in the ferroelectric capacitor in a third period, so that the binary data is returned to the memory cell,

wherein the memory cell comprises a first transistor, a second transistor, and a third transistor,

wherein one of a source and a drain of the first transistor is electrically connected to a gate of the second transistor and one electrode of the ferroelectric capacitor,

wherein one of a source and a drain of the second transistor is electrically connected to one of a source and a drain of the third transistor,

wherein the other of the source and the drain of the third transistor is electrically connected to the other of the source and the drain of the first transistor,

wherein in the first period and the third period, the first transistor is in an on state and the third transistor is in an off state, and

wherein in the second period, the first transistor is in an off state and the third transistor is in an on state.

2. The method for driving a semiconductor device according to claim 1 , wherein in the third period, the polarization reversal is generated in the ferroelectric capacitor regardless of a value of the binary data.

3. The method for driving a semiconductor device according to claim 2 ,

wherein the ferroelectric capacitor comprises a dielectric, and

wherein the dielectric comprises at least one of hafnium oxide and zirconium oxide.

4. The method for driving a semiconductor device according to claim 1 ,

wherein the semiconductor device further comprises a reference memory cell,

wherein reference binary data is written to the reference memory cell in the first period,

wherein the reference binary data is read from the reference memory cell in the second period, and

wherein logic operation of the binary data read from the memory cell and the reference binary data read from the reference memory cell is performed in the second period.

5. The method for driving a semiconductor device according to claim 4 , wherein the logic operation is exclusive disjunction.

6. The method for driving a semiconductor device according to claim 5 ,

wherein the ferroelectric capacitor comprises a dielectric, and

wherein the dielectric comprises at least one of hafnium oxide and zirconium oxide.

7. The method for driving a semiconductor device according to claim 4 ,

wherein the ferroelectric capacitor comprises a dielectric, and

wherein the dielectric comprises at least one of hafnium oxide and zirconium oxide.

8. The method for driving a semiconductor device according to claim 1 ,

wherein the ferroelectric capacitor comprises a dielectric, and

wherein the dielectric comprises hafnium oxide and/or zirconium oxide.

9. A method for driving a semiconductor device comprising a memory cell comprising a first ferroelectric capacitor and a reference memory cell comprising a second ferroelectric capacitor, comprising:

writing first binary data to the memory cell and writing first reference binary data to the reference memory cell in a first period;

reading the first binary data from the memory cell and reading the first reference binary data from the reference memory cell in a second period;

performing logic operation of the first binary data and the first reference binary data in a third period; and

writing second binary data to the memory cell and writing second reference binary data to the reference memory cell in a fourth period,

wherein a value of the first binary data and a value of the second binary data are different from each other, and

wherein a value of the first reference binary data and a value of the second reference binary data are different from each other.

10. The method for driving a semiconductor device according to claim 9 ,

wherein the semiconductor device comprises a first sense amplifier circuit and a second sense amplifier circuit,

wherein the first sense amplifier circuit is electrically connected to the memory cell,

wherein the second sense amplifier circuit is electrically connected to the reference memory cell, and

wherein in the third period, the first sense amplifier circuit and the second sense amplifier circuit are each in an activation state.

11. The method for driving a semiconductor device according to claim 10 ,

wherein the memory cell comprises a first transistor, a second transistor, and a third transistor,

wherein one of a source and a drain of the first transistor is electrically connected to a gate of the second transistor and one electrode of the first ferroelectric capacitor,

wherein one of a source and a drain of the second transistor is electrically connected to one of a source and a drain of the third transistor,

wherein the other of the source and the drain of the first transistor and the other of the source and the drain of the third transistor are electrically connected to the first sense amplifier circuit,

wherein in the first period and the fourth period, the first transistor is in an on state and the third transistor is in an off state, and

wherein in the second period and the third period, the first transistor is in an off state and the third transistor is in an on state.

12. The method for driving a semiconductor device according to claim 11 ,

wherein the first ferroelectric capacitor comprises a first dielectric,

wherein the second ferroelectric capacitor comprises a second dielectric, and

wherein the first dielectric and the second dielectric each comprise at least one of hafnium oxide and zirconium oxide.

13. The method for driving a semiconductor device according to claim 11 , wherein the logic operation is exclusive disjunction.

14. The method for driving a semiconductor device according to claim 10 ,

wherein the first ferroelectric capacitor comprises a first dielectric,

wherein the second ferroelectric capacitor comprises a second dielectric, and

wherein the first dielectric and the second dielectric each comprise at least one of hafnium oxide and zirconium oxide.

15. The method for driving a semiconductor device according to claim 10 , wherein the logic operation is exclusive disjunction.

16. The method for driving a semiconductor device according to claim 9 ,

wherein the first ferroelectric capacitor comprises a first dielectric,

wherein the second ferroelectric capacitor comprises a second dielectric, and

wherein the first dielectric and the second dielectric each comprise hafnium oxide and/or zirconium oxide.

17. The method for driving a semiconductor device according to claim 16 , wherein the logic operation is exclusive disjunction.

18. The method for driving a semiconductor device according to claim 9 , wherein the logic operation is exclusive disjunction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 17, 2023
From: OKAMOTO, YUKI; ONUKI, TATSUYA; MATSUZAKI, TAKANORI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 063018/0285 →
Priority Claims (1)
JP 2020-158038 · Sep 22, 2020 · national
Continuity (1)
Related Publication 20240029773A1 · Jan 25, 2024
References Cited (40)
US 5519234A · Paz de Araujo et al. · 1996 [cited by applicant]
US 5546342A · Nakane et al. · 1996 [cited by applicant]
US 5768176A · Katoh · 1998 [cited by applicant]
US 5851841A · Ushikubo et al. · 1998 [cited by applicant]
US 7446361B2 · Maruyama · 2008 [cited by applicant]
US 7643325B2 · Hagiwara et al. · 2010 [cited by applicant]
US 7675795B2 · Koyama · 2010 [cited by applicant]
US 7928910B2 · Suzuki et al. · 2011 [cited by applicant]
US 10121705B2 · Shinohara et al. · 2018 [cited by applicant]
US 11296708B2 · Manipatruni et al. · 2022 [cited by applicant]
US 11521953B1 · Manipatruni et al. · 2022 [cited by applicant]
US 20060114740A1 · Watanabe · 2006 [cited by examiner]
US 20070171693A1 · Koyama · 2007 [cited by applicant]
US 20080174494A1 · Suzuki et al. · 2008 [cited by applicant]
US 20080175034A1 · Hagiwara et al. · 2008 [cited by applicant]
US 20110176348A1 · Yamazaki et al. · 2011 [cited by applicant]
US 20150137239A1 · Shinohara et al. · 2015 [cited by applicant]
US 20160358639A1 · Jiang · 2016 [cited by examiner]
US 20190148390A1 · Frank · 2019 [cited by examiner]
US 20230215481A1 · Ocker · 2023 [cited by examiner]
CN 001117192A · 1996 [cited by applicant]
EP 0667621A · 1995 [cited by applicant]
EP 0811981A · 1997 [cited by applicant]
JP 07226086A · 1995 [cited by applicant]
JP 08097386A · 1996 [cited by applicant]
JP 08273373A · 1996 [cited by applicant]
JP 09326196A · 1997 [cited by applicant]
JP 2008135136A · 2008 [cited by applicant]
JP 2015103555A · 2015 [cited by applicant]
International Search Report (Application No. PCT/IB2021/058181) Dated Nov. 16, 2021. [cited by applicant]
Written Opinion (Application No. PCT/IB2021/058181) Dated Nov. 16, 2021. [cited by applicant]
Yamazaki.S et al., “Properties of crystalline In—Ga—Zn-oxide semiconductor and its transistor characteristics”, Jpn. J. Appl. Phys. (Japanese Journal of Applied Physics) , Mar. 31, 2014, vol. 53, No. 4S, pp. 04ED18-1-04… [cited by applicant]
Kato.K et al., “Evaluation of Off-State Current Characteristics of Transistor Using Oxide Semiconductor Material, Indium-Gallium-Zinc Oxide”, Jpn. J. Appl. Phys. (Japanese Journal of Applied Physics) , 2012, vol. 51, pp… [cited by applicant]
Harada.H et al., “Low Power LC Display Using In—Ga—Zn-Oxide TFTs Based on Variable Frame Frequency and Partial Scan”, AM-FPD '10 Digest of Technical Papers, Jul. 5, 2010, pp. 199-202. [cited by applicant]
Ishizu.T et al., “Embedded Oxide Semiconductor Memories: A Key Enabler for Low-Power ULSI”, ECS Transactions, May 21, 2017, vol. 79, No. 1, pp. 149-156, the Electrochemical Society. [cited by applicant]
Slesazeck.S et al., “Uniting The Trinity of Ferroelectric HfO2 Memory Devices in a Single Memory Cell”, IMW 2019 (11th IEEE International Memory Workshop), May 12, 2019, pp. 20-23. [cited by applicant]
Okuno.J et al., “SoC compatible 1T1C FeRAM memory array based on ferroelectric Hf0.5Zr0.5O2”, 2020 Symposium on Vlsi Technology : Digest of Technical Papers, Jun. 16, 2020, p. 2pages. [cited by applicant]
Boscke.T et al., “Ferroelectricity in hafnium oxide thin films”, Appl. Phys. Lett. (Applied Physics Letters) , Sep. 8, 2011, vol. 99, No. 10, pp. 102903-1-102903-3. [cited by applicant]
Fan.Z et al., “Ferroelectric HfO2-based materials for next-generation ferroelectric memories”, Journal of Advanced Dielectrics, May 3, 2016, vol. 6, No. 2, pp. 1630003-1-1630003-11. [cited by applicant]
Toriumi.A, “Ferroelectricity of HfO2 thin film”, Oyobuturi , Sep. 10, 2019, vol. 88, No. 9, pp. 586-596, JSAP(The Japan Society of Applied Physics). [cited by applicant]