Solar cell and photovoltaic module
A solar cell, including a crystalline silicon substrate; a first passivation contact step provided on a surface of the crystalline silicon substrate; a second passivation contact step provided on a surface of the first passivation contact step away from the crystalline silicon substrate and located corresponding to an electrode; a first passivation antireflection step provided on the surface of the first passivation contact step away from the crystalline silicon substrate and not in contact with the second passivation contact step; a second passivation antireflection step provided on a surface of the second passivation contact step away from the first passivation contact step; and the electrode including a side in contact with the first passivation contact step and another side penetrating through the second passivation contact step and the second passivation antireflection step.
1. A solar cell, comprising:
a crystalline silicon substrate;
a first passivation contact step provided on a surface of the crystalline silicon substrate;
a second passivation contact step provided on a surface of the first passivation contact step away from the crystalline silicon substrate and located corresponding to an electrode;
a first passivation antireflection step provided on the surface of the first passivation contact step away from the crystalline silicon substrate and not in contact with the second passivation contact step;
a second passivation antireflection step provided on a surface of the second passivation contact step away from the first passivation contact step; and
the electrode including a side in direct contact with the first passivation contact step and another side penetrating through the second passivation contact step and the second passivation antireflection step,
wherein the first passivation contact step comprises a first tunnel oxide layer and a first doped polysilicon layer, the first tunnel oxide layer is provided on the surface of the crystalline silicon substrate, and the first doped polysilicon layer is provided on a side of the first tunnel oxide layer away from the crystalline silicon substrate;
the second passivation contact step comprises a second tunnel oxide layer and a second doped polysilicon layer, the second tunnel oxide layer is provided on a side of the first doped polysilicon layer away from the first tunnel oxide layer and located corresponding to the electrode; the second doped polysilicon layer is provided on a side of the second tunnel oxide layer away from the first doped polysilicon layer; and
one side of the electrode is in direct contact with the first doped polysilicon layer.
2. The solar cell according to claim 1 , wherein the first tunnel oxide layer comprises at least one of phosphorous-containing silicon oxide, aluminum oxide, silicon oxynitride, or silicon oxycarbide, and a phosphorus concentration of the first tunnel oxide layer is not greater than 9×10 20 cm −3 .
3. The solar cell according to claim 2 , wherein the phosphorus concentration of the first tunnel oxide layer is not greater than 5×10 19 cm −3 .
4. The solar cell according to claim 1 , wherein a thickness of the first tunnel oxide layer ranges from 0.5 nm to 10 nm.
5. The solar cell according to claim 1 , wherein a phosphorus concentration after activation of the first doped polysilicon layer ranges from 9×10 19 cm −3 to 1×10 21 cm −3 .
6. The solar cell according to claim 1 , wherein a thickness of the first doped polysilicon layer ranges from 3 nm to 150 nm.
7. The solar cell according to claim 1 , wherein the second tunnel oxide layer comprises at least one of phosphorous-containing silicon oxide, aluminum oxide, silicon oxynitride, or silicon oxycarbide, and a phosphorus concentration of the second tunnel oxide layer is not greater than 1×10 21 cm −3 .
8. The solar cell according to claim 1 , wherein a thickness of the second tunnel oxide layer ranges from 0.1 nm to 5 nm, and the thickness of the second tunnel oxide layer is not greater than the first tunnel oxide layer.
9. The solar cell according to claim 1 , wherein a patterned width of the second tunnel oxide layer ranges from 0.5% to 20% of a patterned width of the first doped polysilicon layer, and the patterned width of the second tunnel oxide layer is not greater than 1000 μm.
10. The solar cell according to claim 1 , wherein a phosphorus concentration after activation of the second doped polysilicon layer ranges from 1×10 20 cm −3 to 1×10 21 cm −3 .
11. The solar cell according to claim 1 , wherein a thickness of the second doped polysilicon layer ranges from 5 nm to 300 nm, and the thickness of the second doped polysilicon layer is greater than the first doped polysilicon layer.
12. The solar cell according to claim 1 , wherein a patterned width of the second doped polysilicon layer is not greater than a patterned width of the second tunnel oxide layer.
13. The solar cell according to claim 1 , wherein the first passivation antireflection step comprises at least one passivation antireflection layer, and a thickness of the first passivation antireflection step ranges from 30 nm to 300 nm and is not less than a thickness of the second passivation contact step.
14. The solar cell according to claim 1 , wherein a thickness of the second passivation antireflection step ranges from 30 nm to 500 nm.
15. The solar cell according to claim 1 , wherein a patterned width of the second passivation antireflection step is not greater than 1000 μm and not less than a patterned width of the second passivation contact step.
16. The solar cell according to claim 1 , wherein a distance from the side of the electrode in contact with the first passivation contact step to a surface of the second passivation antireflection step away from the second passivation contact step is not less than 40 nm.
17. The solar cell according to claim 1 , wherein a patterned width of the electrode is not greater than 100 nm and not greater than a patterned width of the second passivation contact step.
18. A photovoltaic module, comprising:
a plurality of solar cells, wherein at least part of the solar cells is electrically connected in a splicing or laminating manner and packaged through a packaging material, and at least one of the solar cells includes:
a crystalline silicon substrate;
a first passivation contact step provided on a surface of the crystalline silicon substrate;
a second passivation contact step provided on a surface of the first passivation contact step away from the crystalline silicon substrate and located corresponding to an electrode;
a first passivation antireflection step provided on the surface of the first passivation contact step away from the crystalline silicon substrate and not in contact with the second passivation contact step;
a second passivation antireflection step provided on a surface of the second passivation contact step away from the first passivation contact step; and
the electrode including a side in direct contact with the first passivation contact step and another side penetrating through the second passivation contact step and the second passivation antireflection step,
wherein the first passivation contact step comprises a first tunnel oxide layer and a first doped polysilicon layer, the first tunnel oxide layer is provided on the surface of the crystalline silicon substrate, and the first doped polysilicon layer is provided on a side of the first tunnel oxide layer away from the crystalline silicon substrate;
the second passivation contact step comprises a second tunnel oxide layer and a second doped polysilicon layer, the second tunnel oxide layer is provided on a side of the first doped polysilicon layer away from the first tunnel oxide layer and located corresponding to the electrode; the second doped polysilicon layer is provided on a side of the second tunnel oxide layer away from the first doped polysilicon layer; and
one side of the electrode is in direct contact with the first doped polysilicon layer.
19. A method for manufacturing a solar cell according to claim 1 , comprising:
etching and cleaning a surface of a crystalline silicon substrate;
forming a first tunnel oxide layer over the surface of the crystalline silicon substrate;
forming a first undoped polysilicon layer over a surface of the first tunnel oxide layer away from the crystalline silicon substrate;
forming a second initial tunnel oxide layer on a surface of the first undoped polysilicon layer away from the first tunnel oxide layer;
forming a second initial undoped polysilicon layer over a surface of the second initial tunnel oxide layer away from the first undoped polysilicon layer;
diffusing the first undoped polysilicon layer and the second initial undoped polysilicon layer to form a first phosphorus-doped polysilicon layer and a second initial phosphorus-doped polysilicon layer respectively, and forming a phospho silicate glass (PSG) layer on a surface of the second initial phosphorus-doped polysilicon layer;
applying an organic coating on a surface of the PSG layer, and drying the organic coating at a high temperature to form a patterned mask;
etching a surface of the second initial phosphorus-doped polysilicon layer away from the second initial tunnel oxide layer and not covered by the patterned mask, to retain the first tunnel oxide layer, the first phosphorus-doped polysilicon layer, and the PSG layer, the second initial tunnel oxide layer, and the second initial phosphorus-doped polysilicon layer that are covered by the patterned mask, so that a first passivation contact step is formed, and the first passivation contact step includes the first tunnel oxide layer and the first phosphorus-doped polysilicon layer;
etching a surface of the patterned mask, to retain the first tunnel oxide layer, the first doped polysilicon layer, the second tunnel oxide layer, and the second phosphorus-doped polysilicon layer, so that a second passivation contact step is formed, and the second passivation contact step includes the second tunnel oxide layer and the second phosphorus-doped polysilicon layer, and wherein a shape of the patterned mask matches a shape of the second passivation contact step;
forming a first passivation antireflection step over a surface of the first phosphorus-doped polysilicon layer away from the crystalline silicon substrate and forming a second passivation antireflection step over a surface of the second phosphorus-doped polysilicon layer away from the crystalline silicon substrate; and
forming an electrode in a region corresponding to the second passivation contact step and the second passivation antireflection step, wherein the electrode includes a side in direct contact with the first passivation contact step and another side penetrating through the second passivation contact step and the second passivation antireflection step.