Wax coating apparatus for wafer mounting and wafer mounting apparatus including same
A wax coating apparatus for wafer mounting of the embodiment includes: a vacuum chuck in which a vacuum flow path providing vacuum pressure is embedded; a heating plate mounted on an upper side of the vacuum chuck and having holes and grooves connected to the vacuum flow path of the vacuum chuck in order to suck a block to which a wafer is adhered; a rotating shaft connected to a lower side of the vacuum chuck; a driving motor for rotating the rotating shaft; and a wax nozzle provided to be spaced apart from the upper side of the vacuum chuck, wherein the heating plate may be operated so as to heat the block while the wax nozzle sprays wax on the block.
1. A wax coating apparatus for wafer mounting, the wax coating apparatus comprising:
a vacuum chuck in which a vacuum flow path providing vacuum pressure is embedded;
a heating plate mounted on an upper side of the vacuum chuck and having holes and grooves connected to the vacuum flow path of the vacuum chuck in order to suck a block to which a wafer is adhered;
a rotating shaft connected to a lower side of the vacuum chuck;
a driving motor for rotating the rotating shaft; and
a wax nozzle provided to be spaced apart from the upper side of the vacuum chuck,
wherein the heating plate includes an upper plate and is operated so as to heat the block while the wax nozzle sprays wax on the block,
wherein the upper plate includes a central hole communicating with the vacuum flow path of the vacuum chuck at a center thereof,
a pair of linear-shaped grooves crossing each other based on the central hole, and
a ring-shaped groove connecting both ends of the linear-shaped grooves to each other.
2. The wax coating apparatus of claim 1 , wherein the driving motor is configured to rotate the vacuum chuck by the rotating shaft while the wax nozzle sprays the wax to the block, and the heating plate is operated in conjunction with at least one of the driving motor and the wax nozzle.
3. The wax coating apparatus of claim 1 , wherein the heating plate is mounted on the upper side of the vacuum chuck by a plurality of fastening parts positioned at a predetermined interval in a circumferential direction.
4. The wax coating apparatus of claim 1 , wherein the heating plate is composed of a disk shape of which a diameter smaller than a diameter of the block and greater than a radius of the block.
5. The wax coating apparatus of claim 1 , wherein the upper plate is made of a metal and a heater is adhered to a lower side of the upper plate.
6. A wafer mounting apparatus comprising: a block loading unit for providing the block; a wafer loading unit for providing the wafer; the wax coating apparatus according to claim 1 that is configured to heat the block while coating wax to the block provided from the block loading unit; and a wafer adhering unit that is configured to adhere the wafer provided from the wafer loading unit to a wax-coated surface of the block provided from the wax coating apparatus.
7. A wafer mounting apparatus comprising: a block loading unit for providing the block; a wafer loading unit for providing the wafer; the wax coating apparatus according to claim 2 that is configured to heat the block while coating wax to the block provided from the block loading unit; and a wafer adhering unit that is configured to adhere the wafer provided from the wafer loading unit to a wax-coated surface of the block provided from the wax coating apparatus.
8. A wafer mounting apparatus comprising: a block loading unit for providing the block; a wafer loading unit for providing the wafer; the wax coating apparatus according to claim 3 that is configured to heat the block while coating wax to the block provided from the block loading unit; and a wafer adhering unit that is configured to adhere the wafer provided from the wafer loading unit to a wax-coated surface of the block provided from the wax coating apparatus.
9. A wafer mounting apparatus comprising: a block loading unit for providing the block; a wafer loading unit for providing the wafer; the wax coating apparatus according to claim 4 that is configured to heat the block while coating wax to the block provided from the block loading unit; and a wafer adhering unit that is configured to adhere the wafer provided from the wafer loading unit to a wax-coated surface of the block provided from the wax coating apparatus.
10. A wafer mounting apparatus comprising: a block loading unit for providing the block; a wafer loading unit for providing the wafer; the wax coating apparatus according to claim 5 that is configured to heat the block while coating wax to the block provided from the block loading unit; and a wafer adhering unit that is configured to adhere the wafer provided from the wafer loading unit to a wax-coated surface of the block provided from the wax coating apparatus.