Heterogeneous gate all around dielectric thickness
A semiconductor includes a first GAA FET and second GAA FET. The second GAA FET includes a first gate dielectric and second gate dielectric within its gate structure. The first GAA FET includes just the first gate dielectric within its gate structure. The gate dielectric structure of the first GAA FET provides for a nominal or a lesser effective gate dielectric or gate dielectric resistance relative to an effective gate dielectric structure of the second GAA FET. The first GAA FET further includes a first gate conductor within its gate structure and the second GAA FET further includes the first gate conductor and a second gate conductor within its gate structure. The first gate conductor and the second gate conductor are separated by the second gate dielectric.
1. A semiconductor device comprising:
a substrate;
a first gate all around field effect transistor (GAA FET) upon the substrate and comprising a plurality of first nanostructure channels and a first gate structure that includes a first gate dielectric around the plurality of first nanostructure channels and a first gate conductor over the first gate dielectric; and
a second GAA FET upon the substrate and comprising a plurality of second nanostructure channels and a second gate structure that includes the first gate dielectric around the plurality of second nanostructure channels, the first gate conductor over the first gate dielectric, a second gate conductor over the first gate conductor, and a second gate dielectric between a top surface of the first gate conductor and a bottom surface of the second gate conductor, wherein a top surface of the first gate dielectric is above the top surface of the first gate conductor.
2. The semiconductor device of claim 1 , wherein the first GAA FET further includes a first gate spacer around the first gate structure and wherein the second GAA FET further includes a second gate spacer around the second gate structure.
3. The semiconductor device of claim 2 , wherein the first gate dielectric is between the first gate conductor and the first gate spacer within the first GAA FET.
4. The semiconductor device of claim 2 , wherein the first gate dielectric is between the first gate conductor and the second gate spacer and the second gate dielectric is between the second gate conductor and the second gate spacer within the second GAA FET.
5. The semiconductor device of claim 2 , wherein the first gate structure further includes a first work function conductor between the first gate dielectric and the first gate conductor.
6. The semiconductor device of claim 5 , wherein the second gate structure further includes the first work function conductor between the first gate dielectric and the first gate conductor.
7. The semiconductor device of claim 6 , wherein the second gate dielectric is between the first gate dielectric and the second gate conductor within the second GAA FET.
8. The semiconductor device of claim 1 , wherein the first gate conductor is configured to receive a first voltage and the second gate conductor is configured to receive a second voltage, wherein the second voltage is greater than the first voltage.
9. The semiconductor device of claim 1 , wherein the first gate structure comprises a first current impedance from the first gate conductor to the plurality of first nanostructure channels, wherein the second gate structure comprises a second current impedance from the second gate conductor to the plurality of second nanostructure channels, and wherein the second current impedance is greater than the first current impedance.
10. The semiconductor device of claim 1 , wherein the plurality of first nanostructure channels and the plurality of second nanostructure channels are formed of the same material.
11. The semiconductor device of claim 1 , wherein the plurality of first nanostructure channels each have a first channel length and wherein the plurality of second nanostructure channels each have a second channel length, wherein the second channel length is greater than the first channel length.
12. A semiconductor device comprising:
a substrate;
a low voltage gate all around field effect transistor (SG GAA FET) upon the substrate and comprising a plurality of first nanostructure channels and a first gate structure that includes a first gate dielectric around the plurality of first nanostructure channels and a first gate conductor over the first gate dielectric; and
a high voltage gate all around field effect transistor (EG GAA FET) upon the substrate and comprising a plurality of second nanostructure channels and a second gate structure that includes the first gate dielectric around the plurality of second nanostructure channels, the first gate conductor over the first gate dielectric, a second gate conductor over the first gate conductor, and a second gate dielectric between a top surface of the first gate conductor and a top surface of the second gate conductor, wherein a top surface of the first gate dielectric is above the top surface of the first gate conductor.
13. The semiconductor device of claim 12 , wherein the SG GAA FET further includes a first gate spacer around the first gate structure and wherein the EG GAA FET further includes a second gate spacer around the second gate structure.
14. The semiconductor device of claim 13 , wherein the first gate dielectric is between the first gate conductor and the first gate spacer within the SG GAA FET.
15. The semiconductor device of claim 13 , wherein the first gate dielectric is between the first gate conductor and the second gate spacer and the second gate dielectric is between the second gate conductor and the second gate spacer within the EG GAA FET.
16. The semiconductor device of claim 13 , wherein the first gate structure further includes a first work function conductor between the first gate dielectric and the first gate conductor.
17. The semiconductor device of claim 16 , wherein the second gate structure further includes the first work function conductor between the first gate dielectric and the first gate conductor.
18. The semiconductor device of claim 17 , wherein the second gate dielectric is between the first gate dielectric and the second gate conductor within the EG GAA FET.
19. The semiconductor device of claim 12 , wherein the first gate structure comprises a first current impedance from the first gate conductor to the plurality of first nanostructure channels, wherein the second gate structure comprises a second current impedance from the second gate conductor to the plurality of second nanostructure channels, and wherein the second current impedance is greater than the first current impedance.
20. A semiconductor device comprising:
a transistor comprising a plurality of nanostructure channels and a gate structure, the gate structure comprising:
a first gate dielectric around the plurality of first nanostructure channels;
a first work function conductor over the first gate dielectric;
a first gate conductor upon the first work function conductor;
a second gate conductor above the first gate conductor; and
a second gate dielectric between a top surface of the first gate conductor and a bottom surface of the second gate conductor, wherein a top surface of the first gate dielectric is above the top surface of the first gate conductor.