Heater design solutions for chemical delivery systems
A semiconductor substrate processing apparatus includes a chemical isolation chamber for processing a semiconductor substrate, a chemical delivery module, and a control module. The chemical delivery module is in fluid communication with the chamber and includes a canister oven, a control oven, and a heating element. The canister oven generates a process gas using a heated precursor. The control oven receives the process gas via a first gas line and supplies the process gas to the chamber via a second gas line. The first gas line extends between an inside surface of the canister oven and an inside surface of the control oven. The heating element heats a portion of the first gas line between the inside surface of the canister oven and the inside surface of the control oven. The controller module adjusts a heating temperature of the heating element based on a temperature of the portion.
1 . A semiconductor substrate processing apparatus, the apparatus comprising:
a chemical isolation chamber for processing a semiconductor substrate;
a chemical delivery module in fluid communication with the chemical isolation chamber, the chemical delivery module comprising:
a canister oven configured to heat a precursor to a predetermined temperature and generate a process gas using the heated precursor;
a control oven configured to receive the process gas via a first gas line and supply the process gas to the chemical isolation chamber via a second gas line for processing the semiconductor substrate, the first gas line extending between an inside surface of the canister oven and an inside surface of the control oven; and
a heating element configured to heat a portion of the first gas line between the inside surface of the canister oven and the inside surface of the control oven; and
a controller module coupled to the chemical delivery module and the chemical isolation chamber, the controller module configured to detect a temperature of the portion of the first gas line and adjust a heating temperature of the heating element based on the detected temperature.
2 . The apparatus of claim 1 , wherein the predetermined temperature is a sublimation temperature of the precursor, and the controller module is configured to adjust the heating temperature of the heating element to the sublimation temperature.
3 . The apparatus of claim 1 , wherein the chemical delivery module comprises:
a second canister oven configured to heat a second precursor to a second predetermined temperature and generate a second process gas using the heated second precursor;
wherein the control oven is configured to receive the second process gas via a third gas line and supply the second process gas to the chemical isolation chamber via the second gas line for processing the semiconductor substrate, the third gas line extending between an inside surface of the second canister oven and the inside surface of the control oven.
4 . The apparatus of claim 3 , wherein the chemical delivery module comprises:
a second heating element configured to heat a portion of the third gas line between the inside surface of the second canister oven and the inside surface of the control oven.
5 . The apparatus of claim 4 , wherein the chemical delivery module comprises:
a third heating element configured to heat a portion of the second gas line between the inside surface of the control oven and an outside surface of the control oven.
6 . The apparatus of claim 5 , wherein the chemical delivery module comprises a plurality of temperature sensors configured to measure surface temperatures of the portion of the first gas line, the portion of the second gas line, and the portion of the third gas line.
7 . The apparatus of claim 6 , wherein the controller module is configured to adjust the heating temperature of the heating element, a heating temperature of the second heating element, and a heating temperature of the third heating element based on a difference between the predetermined temperature and at least one of the measured surface temperatures.
8 . The apparatus of claim 1 , wherein the heating element comprises one of:
clamshells with a fire-rod heater;
clamshells with a hand-wrapped heater;
clamshells with a bonded heater;
a gas line-mounted hand-wrapped heater; and
a gas line-mounted bonded heater.
9 . A chemical delivery module for supplying process gas to a chemical isolation chamber of a semiconductor substrate processing apparatus, the chemical delivery module comprising:
a canister oven configured to heat a precursor to a predetermined temperature and generate the process gas using the heated precursor;
a control oven configured to receive the process gas via a first gas line and supply the process gas to the chemical isolation chamber via a second gas line for processing the semiconductor substrate, the first gas line extending between an inside surface of the canister oven and an inside surface of the control oven;
a heating element configured to heat a portion of the first gas line between the inside surface of the canister oven and the inside surface of the control oven; and
a controller module configured to detect a temperature of the portion of the first gas line and adjust a heating temperature of the heating element based on the detected temperature.
10 . The apparatus of claim 9 , wherein the predetermined temperature is a sublimation temperature of the precursor.
11 . The apparatus of claim 10 , wherein the control oven comprises a second heating element, and wherein the controller module is configured to adjust the heating temperature of the heating element and a heating temperature of the second heating element to the sublimation temperature.
12 . The apparatus of claim 9 , wherein the second gas line extends between the inside surface of the control oven and an outside surface of the control oven, and wherein the chemical delivery module comprises a second heating element configured to heat a portion of the second gas line between the inside surface and the outside surface of the control oven.
13 . The apparatus of claim 12 , wherein the chemical delivery module comprises a plurality of temperature sensors configured to periodically measure surface temperatures of the portion of the first gas line and the portion of the second gas line.
14 . The apparatus of claim 13 , wherein the controller module is configured to adjust the heating temperature of the heating element and a heating temperature of the second heating element based on a difference between the predetermined temperature and at least one of the measured surface temperatures.
15 . The apparatus of claim 9 , wherein the heating element comprises one of: clamshells with a fire-rod heater clamshells with a hand-wrapped heater; clamshells with a bonded heater; a gas line-mounted hand-wrapped heater; and a gas line-mounted bonded heater.
16 . A method for processing a semiconductor substrate, the method comprising:
heating a precursor within a canister oven to a predetermined temperature to generate a process gas;
supplying the process gas via a gas line to a chemical isolation chamber in which the semiconductor substrate is processed, the gas line extending between the canister oven and the chemical isolation chamber;
heating a portion of the gas line extending between an inside surface and an outside surface of the canister oven using a heating element;
monitoring a surface temperature of the heating element; and
adjusting a heating temperature of the heating element based on the surface temperature.
17 . The method of claim 16 , further comprising:
determining a deviation of the surface temperature from the predetermined temperature; and
adjusting the heating temperature based on the deviation.
18 . The method of claim 16 , further comprising:
heating a second portion of the gas line extending between an inside surface and an outside surface of the chemical isolation chamber using a second heating element.
19 . The method of claim 18 , further comprising:
monitoring a second surface temperature, the second surface temperature associated with the second heating element; and
adjusting a heating temperature of the second heating element based on the second surface temperature.
20 . The method of claim 19 , wherein the heating element and the second heating element comprise one of:
clamshells with a fire-rod heater;
clamshells with a hand-wrapped heater;
clamshells with a bonded heater;
a gas line-mounted hand-wrapped heater; and
a gas line-mounted bonded heater.