IP Library Granted Patent US 12,464,815
Granted Patent B2
US 12,464,815 · App. 17/347,979 · Granted Nov 4, 2025

Fin cut in neighboring gate and source or drain regions for advanced integrated circuit structure fabrication

Inventors: Leonard P. Guler (Hillsboro, OR); Biswajeet Guha (Hillsboro, OR); Tahir Ghani (Portland, OR); Tsuan-Chung Chang (Portland, OR); Sean Pursel (Hillsboro, OR)
Assignee: Intel Corporation
H10D84/853H10D30/024H10D30/6211H10D62/116H10D62/121H10D84/013H10D84/0151H10D84/0158H10D84/038
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Quick Facts
Patent No.
US 12,464,815
App. No.
17/347,979
Granted
Nov 4, 2025
Kind
B2
Abstract

Fin cuts in neighboring gate and source or drain regions for advanced integrated circuit structure fabrication is described. For example, an integrated circuit structure includes a horizontal stack of semiconductor nanowire portions. A dielectric gate spacer is vertically over the horizontal stack of semiconductor nanowire portions. A gate isolation structure is laterally adjacent to a first side of the horizontal stack of semiconductor nanowire portions. A source or drain isolation structure is laterally adjacent to a second side of the horizontal stack of semiconductor nanowire portions.

Claims (9)

1 . An integrated circuit structure, comprising:

a horizontal stack of semiconductor nanowire portions;

a dielectric gate spacer vertically over the horizontal stack of semiconductor nanowire portions;

a gate isolation structure laterally adjacent to a first side of the horizontal stack of semiconductor nanowire portions; and

a source or drain isolation structure laterally adjacent to a second side of the horizontal stack of semiconductor nanowire portions, wherein the source or drain isolation structure comprises a dielectric material, and wherein the horizontal stack of semiconductor nanowire portions is laterally between the source or drain isolation structure and the gate isolation structure.

2 . The integrated circuit structure of claim 1 , wherein the gate isolation structure is in contact with the horizontal stack of semiconductor nanowire portions.

3 . The integrated circuit structure of claim 1 , wherein the gate isolation structure has a flat surface adjacent to the first side of the horizontal stack of semiconductor nanowire portions.

4 . The integrated circuit structure of claim 1 , wherein the dielectric gate spacer extends between the source or drain isolation structure.

5 . The integrated circuit structure of claim 1 , wherein the source or drain isolation structure has a non-flat surface adjacent to the second side of the horizontal stack of semiconductor nanowire portions.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 19, 2021
From: GULER, LEONARD P.; GUHA, BISWAJEET; GHANI, TAHIR; CHANG, TSUAN-CHUNG; PURSEL, SEAN
To: INTEL CORPORATION
Reel/Frame 057233/0813 →
Continuity (1)
Related Publication 20220399336A1 · Dec 15, 2022
References Cited (5)
US 10269964B2 · Ching · 2019 [cited by examiner]
US 20200006559A1 · Mehandru · 2020 [cited by applicant]
US 20210143051A1 · Hattendorf · 2021 [cited by applicant]
US 20220093592A1 · Guler · 2022 [cited by applicant]
Extended European Search Report for European Patent Application No. 22169971.3 mailed Oct. 11, 2022, 11 pgs. [cited by applicant]