Additively manufactured structure and method of manufacturing the same
A structure comprises: a plurality of substructures and a vernier-based position marker. The plurality of substructures include a first substructure, a second substructure, and at least one electronic component. The second substructure is at least partially additively manufactured on the first substructure. The vernier-based position marker is configured to indicate a relative offset between the first substructure and the second substructure.
1 . A structure including:
a plurality of substructures comprising a first substructure, a second substructure, and at least one electronic component, wherein the first substructure includes a first vernier pattern having a first periodicity, and the second substructure includes a second vernier pattern having a second periodicity that is different than the first periodicity in at least one direction, the first vernier pattern and the second vernier pattern being positioned relative to one another to form a vernier-based position marker;
the vernier-based position marker indicating a relative offset between the first substructure and the second substructure;
wherein the first substructure and the second substructure are comprised of a dielectric material that forms a non-conductive part of the structure where the position marker is provided, the first vernier pattern and the second vernier pattern comprise electrically conductive elements, and the vernier-based position marker being electrically conductive; and
wherein the first vernier pattern and the second vernier pattern each comprise at least one vernier scale to indicate the relative offset in one or both directions (X,Y) perpendicular to an additive manufacturing direction (Z), wherein the at least one vernier scale comprises at least one first side scale on a side surface of the first substructure and at least one second side scale on a side surface of the second substructure, to form at least a portion of the position marker along a lateral boundary of the structure in the X or Y direction, the first vernier pattern being embedded in the first substructure and the second vernier pattern being embedded in the second substructure, wherein the first vernier pattern and the second vernier pattern are in direct contact with each other.
2 . The structure of claim 1 , wherein the first vernier pattern is formed on a top surface of the first substructure and the second vernier pattern is formed on a bottom surface of the second substructure, wherein the bottom surface and the top surface are facing each other.
3 . A structure, including:
a plurality of substructures comprising a first substructure and a second substructure holding at least one electronic component, wherein the second substructure is at least partially additively manufactured on the first substructure; and a vernier-based position marker configured to indicate a relative offset between the first substructure and the second substructure, wherein the position marker comprises a first vernier pattern and a second vernier pattern, wherein the first vernier pattern is formed on the first substructure and the second vernier pattern is formed on the second substructure or on a component of an apparatus for additive manufacturing, wherein the first vernier pattern and the second vernier pattern each comprise a grid to indicate an offset in one or both directions (X,Y) perpendicular to an additive manufacturing direction (Z), wherein the offset is read off from intensity maxima created by the Moiré effect, and, wherein each grid further includes an outer marker to determine whether the grids are offset from each other by more than one grid period.
4 . The structure of claim 3 , wherein the at least one vernier scale comprises:
a first vertical vernier scale formed periodically in the additive manufacturing direction (Z), and a second vertical vernier scale formed on a part of an apparatus for additive manufacturing for detecting a vertical offset of the first substructure and/or the second substructure.
5 . The structure of claim 3 , wherein the substructures comprise a transparent material at least at a position of the position marker to enable optical detection by means of an optical sensor.
6 . The structure of claim 1 , wherein the position marker is structured such that electrical contacts between the first vernier pattern and the second vernier pattern are made via an outer wall of each the first substructure and the second substructure, wherein the electrical current flows at positions where the first vernier pattern and second vernier pattern are in direct contact with one another.
7 . The structure of claim 6 , wherein the position marker comprises a linear encoder.
8 . The structure of claim 1 , wherein the position marker is a first position marker and the structure additionally comprises a second vernier-based position marker spaced apart from the first position marker to increase measurement accuracy or detect a twist.