IP Library › Granted Patent US 12,472,723
Granted Patent B2
US 12,472,723 · App. 18/770,036 · Granted Nov 18, 2025

Casing material for power storage device, production method therefor, and power storage device

Inventors: Daisuke Yasuda (Tokyo, JP); Makoto Amano (Tokyo, JP); Takanori Yamashita (Tokyo, JP)
Assignee: DAI NIPPON PRINTING CO., LTD.
B32B7/12B32B27/08B32B2307/31B32B2307/7265B32B2457/10
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Quick Facts
Patent No.
US 12,472,723
App. No.
18/770,036
Granted
Nov 18, 2025
Kind
B2
Abstract

A casing material for a power storage device, including a laminate that includes, in order, at least a base material layer, a barrier layer, and a heat-fusible resin layer. The heat-fusible resin layer includes a single layer or a plurality of layers. The heat-fusible resin layer includes at least one layer having a hardness of at least 70 MPa from a cross-section in the lamination direction of the laminate, measured using a nanoindentation method using an indentation load of 100 μN.

Claims (50)

1 . A power storage device outer packaging material which comprises a laminate including at least a base material layer, a barrier layer and a heat-sealable resin layer in this order,

the heat-sealable resin layer comprising a resin containing a polyolefin backbone,

the heat-sealable resin layer including a single layer or multiple layers,

the heat-sealable resin layer including at least one layer having a hardness of 70 MPa or more as measured from a cross-section in a lamination direction of the laminate under a load of indentation of 100 μN in a nanoindentation method.

2 . The power storage device outer packaging material according to claim 1 , further comprising an adhesive layer between the barrier layer and the heat-sealable resin layer.

3 . The power storage device outer packaging material according to claim 2 , wherein the thickness of a layer having a hardness of 70 MPa or more and the largest thickness in the heat-sealable resin layer is larger than the thickness of the adhesive layer.

4 . The power storage device outer packaging material according to claim 2 , wherein the adhesive layer is formed of a thermoplastic resin.

5 . The power storage device outer packaging material according to claim 2 , wherein the adhesive layer has a logarithmic decrement ΔE of 0.22 or less at 120° C. in rigid pendulum measurement.

6 . The power storage device outer packaging material according to claim 2 , wherein the heat-sealable resin layer includes a first heat-sealable resin layer and a second heat-sealable resin layer in this order from the surface side of the laminate, and the thickness of the second heat-sealable resin layer is larger than the thickness of the adhesive layer.

7 . The power storage device outer packaging material according to claim 1 , wherein the heat-sealable resin layer includes a first heat-sealable resin layer and a second heat-sealable resin layer in this order from the surface side of the laminate, and the thickness of the second heat-sealable resin layer is larger than the thickness of the first heat-sealable resin layer.

8 . The power storage device outer packaging material according to claim 1 , wherein the heat-sealable resin layer includes a first heat-sealable resin layer and a second heat-sealable resin layer in this order from the surface side of the laminate, and the first heat-sealable resin layer and the second heat-sealable resin layer are formed of different resins.

9 . The power storage device outer packaging material according to claim 1 , wherein

an adhesive layer is provided between the barrier layer and the heat-sealable resin layer,

the heat-sealable resin layer includes a first heat-sealable resin layer and a second heat-sealable resin layer in this order from the surface side of the laminate, and

the adhesive layer, the first heat-sealable resin layer and the second heat-sealable resin layer are co-extruded resin layers.

10 . The power storage device outer packaging material according to claim 1 , wherein the heat-sealable resin layer includes a first heat-sealable resin layer forming a surface of the laminate, and a value obtained by measuring a temperature difference T 1 and a temperature difference T 2 in the first heat-sealable resin layer by the following method and dividing the temperature difference T 2 by the temperature difference T 1 is 0.60 or more:

(measurement of temperature difference T 1 )

the temperature difference T 1 between an extrapolated melting start temperature and an extrapolated melting end temperature in the melting peak temperature of the first heat-sealable resin layer is measured by differential scanning calorimetry; and

(measurement of temperature difference T 2 )

the first heat-sealable resin layer is left to stand for 72 hours in an electrolytic solution in which the concentration of lithium hexafluorophosphate is 1 mol/l and the volume ratio of ethylene carbonate, diethyl carbonate, and dimethyl carbonate is 1:1:1 and the resin is then sufficiently dried in an environment at a temperature of 85° C., and the temperature difference T 2 between an extrapolated melting start temperature and an extrapolated melting end temperature in the melting peak temperature of the first heat-sealable resin layer after drying is measured by differential scanning calorimetry.

11 . The power storage device outer packaging material according to claim 6 , wherein a lubricant is present on a surface of the first heat-sealable resin layer.

12 . A method for producing a power storage device outer packaging material, comprising the step of laminating at least a base material layer, a barrier layer and a heat-sealable resin layer in this order to obtain a laminate,

the heat-sealable resin layer comprising a resin containing a polyolefin backbone,

the heat-sealable resin layer including a single layer or multiple layers,

the heat-sealable resin layer including at least one layer having a hardness of 70 MPa or more as measured from a cross-section in a lamination direction of the laminate under a load of indentation of 100 μN in a nanoindentation method.

13 . A power storage device in which a power storage device element including at least a positive electrode, a negative electrode and an electrolyte is stored in a packaging formed of the power storage device outer packaging material according to claim 1 .

14 . A power storage device outer packaging material which comprises a laminate including at least a base material layer, a barrier layer and a heat-sealable resin layer in this order,

the barrier layer comprising aluminum alloys or stainless steel,

the heat-sealable resin layer including a single layer or multiple layers,

the heat-sealable resin layer including at least one layer having a hardness of 70 MPa or more as measured from a cross-section in a lamination direction of the laminate under a load of indentation of 100 μN in a nanoindentation method.

15 . The power storage device outer packaging material according to claim 1 , wherein the base material layer comprises a laminate of a polyester film and a polyamide film, a laminate of a polyester film and a polyester film, a laminate of a polyamide film and a polyamide, or a polyolefin film.

16 . The power storage device outer packaging material according to claim 1 , wherein the thickness of the laminate forming the power storage device outer packaging material is 148 μm or less.

17 . The power storage device outer packaging material according to claim 1 , wherein the thickness of the laminate forming the power storage device outer packaging material is more than 148 μm and 155 μm or less.

18 . The power storage device outer packaging material according to claim 1 , wherein the thickness of the laminate forming the power storage device outer packaging material is more than 155 μm and 180 μm or less.

19 . The power storage device outer packaging material according to claim 1 , wherein the thickness of the base material layer is 35 μm or less.

20 . The power storage device outer packaging material according to claim 1 , wherein the thickness of the base material layer is more than 35 μm and 50 μm or less.

21 . The power storage device outer packaging material according to claim 1 , wherein

an adhesive agent layer is provided between the base material layer and the barrier layer, and

the adhesive agent layer comprises a colorant.

22 . The power storage device outer packaging material according to claim 1 , wherein a surface coating layer is laminated on a side opposite to the barrier layer from the base material layer.

23 . The power storage device outer packaging material according to claim 1 , wherein the thickness of the barrier layer is 50 μm or less.

24 . The power storage device outer packaging material according to claim 1 , wherein the thickness of the barrier layer is more than 50 μm and 200 μm or less.

25 . The power storage device outer packaging material according to claim 2 , wherein the thickness of the adhesive layer is 20 μm or less.

26 . The power storage device outer packaging material according to claim 2 , wherein the thickness of the adhesive layer is more than 20 μm and 60 μm or less.

27 . The power storage device outer packaging material according to claim 1 , wherein

the heat-sealable resin layer comprises a first heat-sealable resin layer and a second heat-sealable resin layer, and

the thickness of the second heat-sealable resin layer is 20 μm or less.

28 . The power storage device outer packaging material according to claim 1 , wherein

the heat-scalable resin layer comprises a first heat-scalable resin layer and a second heat-scalable resin layer, and

the thickness of the second heat-scalable resin layer is more than 20 μm and 100 μm or less.

Priority Claims (1)
JP 2018-200444 · Oct 24, 2018 · national
Continuity (2)
Continuation 17287216
Related Publication 20240399709A1 · Dec 5, 2024
References Cited (13)
US 20080241663A1 · Yamashita · 2008 [cited by examiner]
US 20080286635A1 · Seino et al. · 2008 [cited by applicant]
US 20150255761A1 · Hashimoto et al. · 2015 [cited by applicant]
US 20180102514A1 · Dai et al. · 2018 [cited by applicant]
US 20180331330A1 · Amano et al. · 2018 [cited by applicant]
US 20220115723A1 · Yasuda et al. · 2022 [cited by applicant]
US 20240399709A1 · Yasuda · 2024 [cited by examiner]
JP 2008287971A · 2008 [cited by applicant]
JP 2017069203A · 2017 [cited by applicant]
WO 2014050542A1 · 2014 [cited by applicant]
WO 2017094724A1 · 2017 [cited by applicant]
WO 2018097329A1 · 2018 [cited by applicant]
Dec. 17, 2019 International Search Report issued in International Patent Application No. PCT/JP2019/041798. [cited by applicant]
Cited By (1)
US 12,626,980