Substrate processing condition setting method, substrate processing method, substrate processing condition setting system, and substrate processing system
A substrate processing condition setting method includes acquiring, causing, and setting. In the acquiring, a plurality of estimation processing results are acquired by inputting a plurality of processing conditions to a trained model that is subjected to machine training based on a training processing condition and a processing result obtained by processing a substrate under the training processing condition. In the causing, a display section is caused to display an image based on the estimation processing results. In the setting, one processing condition corresponding to one estimation processing result of the estimation processing results is set, as an actual processing condition in substrate processing, based on the image displayed on the display section.
1 . A substrate processing condition setting method comprising:
acquiring a plurality of estimation processing results by inputting a plurality of processing conditions to a trained model that is subjected to machine training based on a training processing condition and a processing result obtained by processing a substrate under the training processing condition;
causing a display section to display an image including a distribution chart based on the estimation processing results, to display a plurality of marks on the distribution chart based on the plurality of the estimation processing results, and to display a curved response surface that is generated by interpolation between respective points of the plurality of marks or is generated by an approximate function generated based on the respective points of the plurality of marks, the marks each being user selectable through an operator to accept a user operation;
selecting, by a user to operate the operator, one of the marks on the distribution chart in order to select one processing condition; and
setting the one selected processing condition, as an actual processing condition in substrate processing, the one processing condition corresponding to one estimation processing result of the estimation processing results.
2 . The substrate processing condition setting method according to claim 1 , further comprising
setting, prior to the acquiring, an input condition range within which a specific processing condition is included, wherein
in the acquiring, the estimation processing results are obtained by inputting processing conditions, of the processing conditions, within the input condition range to the trained model.
3 . The substrate processing condition setting method according to claim 2 , wherein
the processing conditions each include at least a concentration condition indicating a concentration of a processing liquid to be supplied to a substrate, a temperature condition indicating a temperature of the processing liquid to be supplied to the substrate, a supply amount condition indicating a supply amount of the processing liquid to be supplied to the substrate, a rotational speed condition indicating a rotational speed of the substrate, and a speed condition indicating a scan speed of a nozzle that supplies the processing liquid to the substrate.
4 . The substrate processing condition setting method according to claim 1 , wherein
the image includes a distribution chart,
the processing conditions each include a plurality of parameters, and
the distribution chart is displayed three-dimensionally using the estimation processing results and two types of parameters of the parameters, the estimation processing results and the two types of the parameters being specified by the user.
5 . The substrate processing condition setting method according to claim 4 , wherein
the display section displays a user-selectable selection area for selection of the two types of the parameters each as a variable of the distribution chart.
6 . The substrate processing condition setting method according to claim 1 , wherein
the marks include:
a first mark displayed within a specific range in the distribution chart within which a point corresponding to a target processing result is included; and
a second mark displayed outside the specific range in the distribution chart, the second mark being different from the first mark.
7 . A substrate processing method comprising:
setting, according to the substrate processing condition setting method according to claim 1 , the one processing condition as the actual processing condition; and
performing the substrate processing under the one processing condition.
8 . A substrate processing condition setting system comprising:
storage that stores therein a training processing condition and a trained model that is subjected to machine training based on a processing result obtained by processing a substrate under the training processing condition;
a display section;
an operator to receive an operation by a user; and
a controller, wherein
the controller
acquires a plurality of estimation processing results by inputting a plurality of processing conditions to the trained model;
causes the display section to display an image including a distribution chart based on the estimation processing results, to display a plurality of marks on the distribution chart based on the plurality of the estimation processing results, and to display a curved response surface that is generated by interpolation between respective points of the plurality of marks or is generated by an approximate function generated based on the respective points of the plurality of marks, the marks each being user selectable through the operator; and
upon the user's operation on the operator to select one of the marks on the distribution chart, sets one processing condition corresponding to the one selected mark as an actual processing condition in substrate processing, the one processing condition corresponding to one estimation processing result of the estimation processing results.
9 . The substrate processing condition setting system according to claim 8 , wherein
the controller acquires the estimation processing results by inputting to the trained model processing conditions, of the processing conditions, within an input condition range within which a specific processing condition is included.
10 . The substrate processing condition setting system according to claim 9 , wherein
the processing conditions each include at least a concentration condition indicating a concentration of a processing liquid to be supplied to a substrate, a temperature condition indicating a temperature of the processing liquid to be supplied to the substrate, a supply amount condition indicating a supply amount of the processing liquid to be supplied to the substrate, a rotational speed condition indicating a rotational speed of the substrate, and a speed condition indicating a scan speed of a nozzle that supplies the processing liquid to the substrate.
11 . The substrate processing condition setting system according to claim 8 , wherein
the processing conditions each include a plurality of parameters, and
the controller causes display of the distribution chart three-dimensionally using the estimation processing results and two types of parameters of the parameters, the estimation processing results and the two types of the parameters being specified by the user.
12 . The substrate processing condition setting system according to claim 11 , wherein the display section displays a user-selectable selection area for selection of the two types of the parameters each as a variable of the distribution chart.
13 . The substrate processing condition setting system according to claim 8 , wherein
the marks include:
a first mark displayed within a specific range in the distribution chart within which a point corresponding to a target processing result is included; and
a second mark displayed outside the specific range in the distribution chart, the second mark being different from the first mark.
14 . A substrate processing system comprising:
the substrate processing condition setting system according to claim 8 ; and
a processing unit that performs the substrate processing under the one processing condition.