Semiconductor device
A semiconductor device includes a substrate, lower electrodes on the substrate, a dielectric layer covering the lower electrodes, and an upper electrode covering the dielectric layer. The dielectric layer includes a first region in contact with the lower electrodes, a second region in contact with the upper electrode, and a third region between the first and second regions. The third region includes a first insertion layer including a first oxide including a first metal having a first valence and a second oxide including a second metal having a second valence different from the first valence. A thickness of the dielectric layer is about 40 Å to about 60 Å. A thickness of the first insertion layer is about 3 Å to about 10 Å. A ratio of the second metal to total elements in the dielectric layer is about 5 at % to about 15 at %.
1 . A semiconductor device comprising:
a substrate;
a plurality of lower electrodes on the substrate;
a dielectric layer covering the plurality of lower electrodes; and
an upper electrode covering the dielectric layer,
wherein the dielectric layer includes:
a first region in contact with the plurality of lower electrodes;
a second region in contact with the upper electrode; and
a third region between the first region and the second region,
wherein the third region includes a first insertion layer including a first oxide including a first metal having a first valence and a second oxide including a second metal having a second valence that is different from the first valence,
a thickness of the dielectric layer is from about 40 Å to about 60 Å,
a thickness of the first insertion layer of the third region is from about 3 Å to about 10 Å, and
a ratio of the second metal to total elements included in the dielectric layer is greater than or equal to about 5 at % and less than or equal to about 15 at %.
2 . The semiconductor device of claim 1 , wherein the first metal includes at least one of zirconium (Zr), hafnium (Hf), or titanium (Ti), and the second metal includes at least one of aluminum (Al), yttrium (Y), niobium (Nb), tantalum (Ta), molybdenum (Mo), vanadium (V), or lanthanum (La).
3 . The semiconductor device of claim 1 , wherein the first region and the second region include the first oxide.
4 . The semiconductor device of claim 1 , wherein the first insertion layer of the third region is a single layer.
5 . The semiconductor device of claim 4 , wherein the first insertion layer is in contact with the first region and the first insertion layer is in contact with the second region.
6 . The semiconductor device of claim 1 , wherein the first insertion layer of the third region includes a plurality of layers spaced apart from each other, and a sum of thicknesses of each of the plurality of layers is from about 3 Å to about 10 Å.
7 . The semiconductor device of claim 6 , wherein a number of the plurality of layers is from 2 to 11.
8 . The semiconductor device of claim 6 , wherein:
the third region further includes at least one second insertion layer between the plurality of layers of the first insertion layer, and
the plurality of layers of the first insertion layer and the at least one second insertion layer are alternately disposed.
9 . The semiconductor device of claim 8 , wherein the at least one second insertion layer includes the first oxide, and each of the at least one second insertion layer has a thickness of about 1 Å to about 5 Å.
10 . The semiconductor device of claim 6 , wherein the third region has a thickness of about 10 Å to about 30 Å.
11 . The semiconductor device of claim 1 , wherein the first region and the second region have a same crystallinity.
12 . The semiconductor device of claim 1 , wherein the dielectric layer has a tetragonal, orthorhombic, or perovskite crystal structure.
13 . A semiconductor device comprising:
a substrate;
a plurality of lower electrodes on the substrate;
a dielectric layer covering the plurality of lower electrodes; and
an upper electrode covering the dielectric layer,
wherein the dielectric layer includes:
a first region and a second region including a first oxide; and
a third region interposed between the first region and the second region and including the first oxide and a second oxide,
wherein the first oxide includes a first metal having a first valence,
the second oxide includes a second metal having a second valence that is different from the first valence,
a thickness of the third region is equal to about ⅙ times to about ¾ times a thickness of the dielectric layer, and
a ratio of the second metal included in the third region is about 5 at % or greater and about 15 at % or less with respect to total elements included in the dielectric layer.
14 . The semiconductor device of claim 13 , wherein:
the first oxide includes at least one of zirconium oxide (ZrO 2 ), hafnium oxide (HfO 2 ), or titanium oxide (TiO 2 ), and
the second oxide includes at least one of aluminum oxide (Al 2 O 3 ), yttrium oxide (Y 2 O 3 ), niobium oxide (Nb 2 O 5 ), tantalum oxide (Ta 2 O 5 ), molybdenum oxide (MoO 3 ), vanadium oxide (V 2 O 5 ), or lanthanum oxide (La 2 O 3 ).
15 . The semiconductor device of claim 13 , wherein the first valence is tetravalent, and the second valence is trivalent.
16 . The semiconductor device of claim 13 , wherein the plurality of lower electrodes have a columnar, a cylindrical, or a planar shape.
17 . A semiconductor device comprising:
a device isolating layer that defines active regions on a substrate;
gate electrodes crossing the active regions and extending into the device isolating layer;
first impurity regions and second impurity regions in the active regions on both sides of the gate electrodes;
bit lines disposed on the gate electrodes and connected to the first impurity regions;
conductive patterns disposed on side surfaces of the bit lines and connected to the second impurity regions;
a plurality of lower electrodes extending vertically on the conductive patterns and connected to each of the conductive patterns;
at least one support layer vertically spaced apart from an upper surface of the substrate, extending in a direction that is parallel to the upper surface of the substrate, and being in contact with a side surface of each of the plurality of lower electrodes adjacent thereto;
a dielectric layer covering the plurality of lower electrodes and covering the at least one support layer; and
an upper electrode covering the dielectric layer,
wherein the dielectric layer includes:
a first region in contact with the at least one support layer and with the plurality of lower electrodes, the first region including a first oxide including a first metal;
a second region spaced apart from the first region, being in contact with the upper electrode, and including the first oxide; and
a third region including a first insertion layer including the first oxide and a second oxide that includes a second metal, the third region located between the first region and the second region,
a total thickness of the dielectric layer is from about 40 Å to about 60 Å,
a thickness of the first insertion layer is from about 3 Å to about 10 Å, and
a ratio of the second metal to total elements included in the dielectric layer is greater than or equal to about 5 at % and less than or equal to about 15 at %.
18 . The semiconductor device of claim 17 , wherein the first insertion layer of the third region includes a plurality of layers spaced apart from each other.
19 . The semiconductor device of claim 18 , wherein:
the third region further includes at least one second insertion layer between the plurality of layers of the first insertion layer; and
each of the at least one second insertion layer has a thickness of about 1 Å to about 5 Å and includes the first oxide.
20 . The semiconductor device of claim 17 , wherein the first insertion layer is a single layer.