Composition and method for treating substrate
A composition contains a periodic acid compound selected from the group consisting of a periodic acid and a salt thereof, an amine compound that is a specific compound represented by Formula (1) or a salt thereof, and water.
1 . A composition comprising:
a periodic acid compound selected from the group consisting of a periodic acid and a salt thereof;
an amine compound which is a compound represented by the following Formula (1) or a salt thereof; and
water,
wherein a ratio of a content of the periodic acid compounds to a content of the amine compound is 0.01 or more and less than 45 as a mass ratio,
R—NH 2 Formula (1)
in Formula (1), R represents an aliphatic hydrocarbon group which optionally has a substituent, the substituent is selected from the group consisting of an amino group, a phosphonic acid group, and a sulfo group, the aliphatic hydrocarbon group optionally has at least one linking group selected from the group consisting of —O—, —S— and
—NR 1 — in a carbon chain, R 1 represents a hydrogen atom or an aliphatic hydrocarbon group which optionally has a substituent, and the substituent does not include a hydroxy group.
2 . The composition according to claim 1 ,
wherein the composition is a composition for treating a substrate having a substance selected from the group consisting of a ruthenium-containing substance and a ruthenium oxide-containing substance.
3 . The composition according to claim 1 ,
wherein the composition is a composition for treating a substrate having a ruthenium-containing substance and a ruthenium oxide-containing substance.
4 . The composition according to claim 1 ,
wherein the amine compound has 1 to 8 carbon atoms.
5 . The composition according to claim 1 ,
wherein the aliphatic hydrocarbon group represented by R has a substituent group selected from the group consisting of an amino group, a phosphonic acid group, and a sulfo group.
6 . The composition according to claim 1 ,
wherein the amine compound is at least one compound selected from the group consisting of 1,3-propanediamine, 1,4-butanediamine, and 1,6-hexanediamine.
7 . The composition according to claim 1 ,
wherein the composition has a pH of 10.0 or less.
8 . The composition according to claim 1 ,
wherein the composition has a pH of 3.5 or more.
9 . The composition according to claim 1 ,
wherein the composition has a pH of 3.5 to 6.0.
10 . The composition according to claim 1 ,
wherein the composition substantially does not contain abrasive particles.
11 . A method for treating a substrate, comprising:
a step A of removing a substance selected from the group consisting of a metal-containing substance and an oxidized metal-containing substance on a substrate by using the composition according to claim 1 .
12 . The method for treating a substrate according to claim 11 ,
wherein the metal-containing substance includes a ruthenium-containing substance, and the oxidized metal-containing substance includes a ruthenium oxide-containing substance.
13 . The method for treating a substrate according to claim 11 ,
wherein the step A is a step A1 of performing a recess etching treatment by using the composition on a wiring line that is disposed on a substrate and consists of a metal-containing substance or an oxidized metal-containing substance, a step A2 of removing a film in an outer edge portion of a substrate by using the composition, the substrate having the film consisting of a metal-containing substance or an oxidized metal-containing substance disposed thereon, a step A3 of removing a metal-containing substance or an oxidized metal-containing substance attached to a back surface of a substrate by using the composition, the substrate having a film consisting of a metal-containing substance or an oxidized metal-containing substance disposed thereon, a step A4 of removing a metal-containing substance or an oxidized metal-containing substance on a substrate having undergone dry etching by using the composition, or a step A5 of removing a metal-containing substance or an oxidized metal-containing substance on a substrate having undergone chemical mechanical polishing by using the composition.
14 . The method for treating a substrate according to claim 11 , further comprising:
an oxidation treatment step of bringing an oxidant into contact with the metal-containing substance on the substrate,
wherein the step A is performed on the substrate having at least an oxidized metal-containing substance manufactured by the oxidation treatment step.
15 . A composition comprising:
a periodic acid compound selected from the group consisting of a periodic acid and a salt thereof;
an amine compound selected from the group consisting of 1,3-propanediamine, 1,4-butanediamine, 1,6-hexanediamine, succinic acid amide, malonamide, propanamide, butyramide, and adipamide; and
water,
wherein the composition substantially does not contain abrasive particles.
16 . A composition comprising:
a periodic acid compound selected from the group consisting of a periodic acid and a salt thereof;
an amine compound which is a compound represented by the following Formula (1) or a salt thereof; and
water,
wherein the composition has a pH of 6.0 or less,
R—NH 2 Formula (1)
in Formula (1), R represents an aliphatic hydrocarbon group which optionally has a substituent, the substituent is selected from the group consisting of an amino group, a phosphonic acid group, and a sulfo group, the aliphatic hydrocarbon group optionally has at least one linking group selected from the group consisting of —O—, —S— and —NR 1 — in a carbon chain, R 1 represents a hydrogen atom or an aliphatic hydrocarbon group which optionally has a substituent, and the substituent does not include a hydroxy group.
17 . A method for treating a substrate, comprising:
a step A of removing a ruthenium-containing substance on a substrate by using a composition comprising:
a periodic acid compound selected from the group consisting of a periodic acid and a salt thereof;
an amine compound which is a compound represented by the following Formula (1) or a salt thereof; and
water,
R—NH 2 Formula (1)
in Formula (1), R represents an aliphatic hydrocarbon group which optionally has a substituent, the substituent is selected from the group consisting of an amino group, a phosphonic acid group, and a sulfo group, the aliphatic hydrocarbon group optionally has at least one linking group selected from the group consisting of —O—, —S— and —NR 1 — in a carbon chain, R 1 represents a hydrogen atom or an aliphatic hydrocarbon group which optionally has a substituent, and the substituent does not include a hydroxy group.