Method of quality determining of deposition mask, method of manufacturing deposition mask, method of manufacturing deposition mask device, method of selecting deposition mask, and deposition mask
A method of quality determination of a deposition mask according to the present disclosure includes: a measuring step that measures a dimension X1 from a P1 point to a Q1 point, and a dimension X2 from a P2 point to a Q2 point; and a determining step that determines a quality of a deposition mask, based on the dimension X1 and the dimension X2 measured in the measuring step.
1 . A method of manufacturing a deposition mask extending in a first direction, the method comprising:
a step of supplying an elongated metal plate extending in a strip shape;
a step of etching the metal plate by a photolithographic technique to form a first recess in the metal plate from a first surface side; and
a step of etching the metal plate by the photolithography technique to form a second recess in the metal plate from a second surface side,
the deposition mask comprises:
a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction;
a P1 point and a Q1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction; and
a P2 point and a Q2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction, and
a plurality of through holes formed by communicating the first recess and the second recess with each other,
wherein the deposition mask satisfies an equation below:
❘
"\[LeftBracketingBar]"
X
1
-
X
2
❘
"\[RightBracketingBar]"
≤
α
X
1
0
×
α
Y
W
Y
×
1
0
-
3
in which X1 represents a dimension from the P1 point to the Q1 point, X2 represents a dimension from the P2 point to the Q2 point, and α X represents a design value of the dimension X1 and the dimension X2,
wherein through holes of the plurality of through holes are positioned between the P1 point and the Q1 point in the first direction, and
other through holes of the plurality of through holes are positioned between the P2 point and the Q2 point in the first direction.
2 . The method of manufacturing a deposition mask according to claim 1 , wherein:
the deposition mask has a plurality of through holes formed by communicating the first recess and the second recess with each other; and
wherein the deposition mask satisfies an equation below:
❘
"\[RightBracketingBar]"
X
1
-
X
2
❘
"\[RightBracketingBar]"
≤
α
X
1
0
×
α
Y
W
Y
×
1
0
-
3
in which α X represents a design value of the dimension X1 and the dimension X2, α Y represents a design value of a dimension from the P1 point to the P2 point and a dimension from the Q1 point to the Q2 point, and W Y represents a maximum value of a distance between center points of the two through holes in the second direction.
3 . A method of manufacturing a deposition mask extending in a first direction, the method comprising:
a step of supplying an elongated metal plate extending in a strip shape;
a step of etching the metal plate by a photolithographic technique to form a first recess in the metal plate from a first surface side; and
a step of etching the metal plate by the photolithography technique to form a second recess in the metal plate from a second surface side,
the deposition mask comprises:
a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction;
a P1 point and a Q1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction;
a P2 point and a Q2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction; and
a plurality of through holes formed by communicating the first recess and the second recess with each other,
wherein the deposition mask satisfies an equation below:
❘
"\[LeftBracketingBar]"
X
1
-
X
2
❘
"\[RightBracketingBar]"
≤
α
X
1
0
×
α
Y
W
Y
×
1
0
-
3
in which X1 represents a dimension from the P1 point to the Q1 point, X2 represents a dimension from the P2 point to the Q2 point, α X represents a design value of the dimension X1 and the dimension X2, α Y represents a design value of a dimension from the P1 point to the P2 point and a dimension from the Q1 point to the Q2 point, and W Y represents a maximum value of a distance between center points of two through holes in the second direction,
wherein through holes of the plurality of through holes are positioned between the P1 point and the Q1 point in the first direction, and
other through holes of the plurality of through holes are positioned between the P2 point and the Q2 point in the first direction.
4 . A method of manufacturing a deposition mask device comprising:
a step of preparing the deposition mask by the method of manufacturing a deposition mask according to claim 1 ; and
a step of applying a tensile force to the deposition mask in the first direction and stretching the deposition mask on a frame.
5 . A method of depositing a deposition material on a substrate comprising:
a step of preparing the deposition mask device by the method of manufacturing a deposition mask device according to claim 4 ;
a step of bringing the deposition mask of the deposition mask device into tight contact with the substrate; and
a step of depositing the deposition material on the substrate through the through holes of the deposition mask.
6 . A method of manufacturing a deposition mask device comprising:
a step of preparing the deposition mask by the method of manufacturing a deposition mask according to claim 3 ; and
a step of applying a tensile force to the deposition mask in the first direction and stretching the deposition mask on a frame.
7 . A method of depositing a deposition material on a substrate comprising:
a step of preparing the deposition mask device by the method of manufacturing a deposition mask device according to claim 6 ;
a step of bringing the deposition mask of the deposition mask device into tight contact with the substrate; and
a step of depositing the deposition material on the substrate through the through holes of the deposition mask.