IP Library › Granted Patent US 12,494,250
Granted Patent B2
US 12,494,250 · App. 18/331,570 · Granted Dec 9, 2025

Resistive random access memory based one-time-programmable memory devices

Inventors: Yu-Der Chih (Hsinchu, TW); Chung-Cheng Chou (Hsinchu, TW)
Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
G11C13/0069G11C13/003
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Quick Facts
Patent No.
US 12,494,250
App. No.
18/331,570
Granted
Dec 9, 2025
Kind
B2
Abstract

A memory device includes a first memory array including a plurality of first memory bits. Each of the plurality of first memory bits is configured as a one-time-programmable (OTP) memory bit. A second memory array includes a plurality of second memory bits, each of the plurality of second memory bits being configured as a multi-time-programmable (MTP) memory bit. A lock bit circuit operatively coupled to the first memory array and not the second memory array. The lock bit circuit is configured to generate a lock bit indicative of whether at least one of the plurality of first memory bits has been programmed.

Claims (40)

1 . A memory device, comprising:

a first memory array including a plurality of first memory bits, each of the plurality of first memory bits being configured as a one-time-programmable (OTP) memory bit;

a second memory array including a plurality of second memory bits, each of the plurality of second memory bits being configured as a multi-time-programmable (MTP) memory bit; and

a lock bit circuit operatively coupled to the first memory array;

wherein the lock bit circuit is configured to generate a lock bit indicative of whether at least one of the plurality of first memory bits has been programmed.

2 . The memory device of claim 1 , wherein the plurality of first memory bits and the plurality of second memory bits are each a resistive random access memory (RRAM) bit.

3 . The memory device of claim 1 , wherein the lock bit has (i) a high logic state indicating that the at least one first memory bit has been programmed; and (ii) a low logic state indicating that the at least one first memory bit has not been programmed.

4 . The memory device of claim 1 , wherein each of the plurality of first memory bits has a first variable resistance that is formed with a first resistance and configured to be programmed to a second resistance, the second resistance being lower than the first resistance.

5 . The memory device of claim 4 , wherein the lock bit circuit comprises an AND gate having a first input and a second input, the first input being configured to sense a voltage presented by the at least one first memory bit, the second input being configured to receive a control signal.

6 . The memory device of claim 5 , wherein the voltage is determined based on whether the at least one first memory bit has the first resistance or the second resistance.

7 . A memory device, comprising:

a first memory array including a plurality of first memory bits, each of the plurality of first memory bits comprising a first access transistor and a first resistor coupled in series, the first resistor having a first variable resistance; and

a lock bit circuit operatively coupled to the first memory array;

wherein the lock bit circuit is configured to generate a lock bit indicative of whether at least one of the plurality of first memory bits has been permanently programmed from a first resistance to a second resistance, the second resistance being lower than the first resistance.

8 . The memory device of claim 7 , wherein the lock bit circuit comprises:

a reference resistor having a fixed resistance;

a reference transistor connected to the reference resistor in series;

a first clamping transistor;

a second clamping transistor; and

an AND gate.

9 . The memory device of claim 8 , wherein the fixed resistance is higher than the second resistance but lower than the first resistance.

10 . The memory device of claim 8 , wherein the reference transistor and the first access transistor are cross-coupled to each other.

11 . The memory device of claim 8 , wherein when the lock bit circuit is in a program mode, the lock bit circuit is configured to provide a conduction path flowing through the first resistor to the first access transistor and one of the first or second clamping transistor.

12 . The memory device of claim 8 , wherein when the lock bit circuit is in a read mode, the lock bit circuit is configured to compare the first resistor with the reference resistor so as to determine a voltage at a node connected between the first resistor and the first access transistor, the node being connected to one of two inputs of the AND gate.

13 . The memory device of claim 12 , wherein when the first resistor has been permanently programmed to have the second resistance, the voltage at the node is at a high logic state.

14 . The memory device of claim 13 , wherein when the first resistor remains with the first resistance, the voltage at the node is at a low logic state.

15 . The memory device of claim 14 , wherein the lock bit circuit is configured to generate the lock bit based on the voltage at the node.

16 . The memory device of claim 7 , further comprising:

a second memory array including a plurality of second memory bits, each of the plurality of second memory bits comprising a second access transistor and a second resistor coupled in series, the second resistor having a second variable resistance;

wherein the lock bit circuit is not operatively coupled to the second memory array.

17 . The memory device of claim 16 , wherein each of the plurality of second memory bits is configured to be reversibly programmed between the first resistance and the second resistance.

18 . A method for operating a memory device, comprising:

providing a memory array including a plurality of resistive random access memory (RRAM) bits;

permanently programming at least one of the plurality of RRAM bits based on changing a resistance of the at least one RRAM bit;

comparing the resistance of the at least one RRAM bit with a reference resistance; and

generating, based on the comparison, a lock bit indicating whether the at least one RRAM bit has been permanently programmed.

19 . The method of claim 18 , further comprising:

in response to determining that the resistance is greater than the reference resistance, generating the lock bit with a first logic state indicating that the at least one RRAM bit has not been permanently programmed.

20 . The method of claim 18 , further comprising:

in response to determining that the resistance is lower than the reference resistance, generating the lock bit with a second logic state indicating that the at least one RRAM bit has been permanently programmed.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE ADD INVENTOR CHUNG-CHENG CHOU PREVIOUSLY RECORDED ON REEL 63897 FRAME 305. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Aug 26, 2025
From: CHOU, CHUNG-CHENG; CHIH, YU-DER
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073589/0885 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2023
From: CHIH, YU-DER
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 063897/0305 →
Continuity (1)
Related Publication 20240412785A1 · Dec 12, 2024
References Cited (9)
US 6035401A · Dalvi · 2000 [cited by examiner]
US 7911839B2 · Ahmed · 2011 [cited by applicant]
US 10726914B2 · Chung · 2020 [cited by applicant]
US 11495313B1 · Kirschner · 2022 [cited by applicant]
US 12100449B1 · Nazarian · 2024 [cited by examiner]
US 20220336012A1 · Chang · 2022 [cited by examiner]
US 20220351774A1 · Chang · 2022 [cited by examiner]
US 20230005538A1 · Jo · 2023 [cited by examiner]
Office Action issued in connection with Taiwan Appl. No. 112143534 dated Oct. 25, 2024. [cited by applicant]