Impedance matching apparatus
An impedance matching apparatus for providing impedance matching for an RF component. The apparatus includes a balun transformer circuit having a primary coil at an input side of the balun transformer circuit. The primary coil can be connected to a signal source to receive an input signal from the signal source. The balun transformer circuit further includes a secondary coil at an output side of the balun transformer circuit, the secondary coil being coupled to the primary coil to supply an output signal to the RF component and having a parasitic leakage inductance configured to match the output impedance of the signal source to the input impedance of the RF component
1 . An impedance matching apparatus for providing impedance matching for a radio frequency component, comprising:
a balun transformer circuit including a primary coil at an input side of the balun transformer circuit, the primary coil being connected to a signal source to receive an input signal from the signal source, the balun transformer circuit further including a secondary coil at an output side of the balun transformer circuit, the secondary coil being coupled to the primary coil to supply an output signal to the radio frequency component and having a parasitic leakage inductance configured to match an output impedance of the signal source to an input impedance of the radio frequency component, the parasitic leakage inductance of the balun transformer circuit configured to include a predefined coupling factor, k, defined by an implemented gap, G, between the primary coil of the balun transformer circuit and the secondary coil of the balun transformer circuit.
2 . The impedance matching apparatus of claim 1 wherein the predefined coupling factor, k, is further defined by an implemented offset between the primary coil and the secondary coil of the balun transformer circuit.
3 . The impedance matching apparatus of claim 1 wherein the predefined coupling factor, k, is further defined by an implemented winding ratio, R, of a number of windings of the primary coil and a number of windings of the secondary coil.
4 . The impedance matching apparatus of claim 1 wherein the primary coil and the secondary coil of the balun transformer circuit are implemented on different layers of an integrated circuit.
5 . The impedance matching apparatus of claim 4 wherein a cross-section area of the primary coil overlaps with a cross-section area of the secondary coil of the balun transformer circuit to reduce a chip area of the balun transformer circuit within the integrated circuit.
6 . A front-end module comprising:
a radio frequency component; and
an impedance matching apparatus to provide impedance matching for the radio frequency component, the impedance matching apparatus including a balun transformer circuit including a primary coil at an input side of the balun transformer circuit, the primary coil being connected to a signal source to receive an input signal from the signal source, and a secondary coil at an output side of the balun transformer circuit, the secondary coil being coupled to the primary coil to supply an output signal to the radio frequency component and having a parasitic leakage inductance used to match an output impedance of the signal source to an input impedance of the radio frequency component, the parasitic leakage inductance of the balun transformer circuit of the impedance matching apparatus configured to include a predefined coupling factor, k, defined by an implemented gap, G, between the primary coil of the balun transformer circuit and the secondary coil of the balun transformer circuit.
7 . The front-end module of claim 6 wherein the predefined coupling factor, k, is further defined by an implemented offset between the primary coil and the secondary coil of the balun transformer circuit.
8 . The front-end module of claim 6 wherein the predefined coupling factor, k, is defined by an implemented winding ratio, R, of a number of windings of the primary coil and a number of windings of the secondary coil.
9 . The front-end module of claim 6 wherein the primary coil and the secondary coil of the balun transformer circuit are implemented on different layers of an integrated circuit.
10 . The front-end module of claim 9 wherein a cross-section area of the primary coil overlaps with a cross-section area of the secondary coil of the balun transformer circuit to reduce a chip area of the balun transformer circuit within the integrated circuit.
11 . A 5 G mm wave device comprising:
a front-end module including an radio frequency component and an impedance matching apparatus to provide impedance matching for the radio frequency component, the impedance matching apparatus including a balun transformer circuit including a primary coil at an input side of the balun transformer circuit, the primary coil being connected to a signal source to receive an input signal from the signal source, and a secondary coil at an output side of the balun transformer circuit, the secondary coil being coupled to the primary coil to supply an output signal to the radio frequency component and having a parasitic leakage inductance used to match an output impedance of the signal source to an input impedance of the radio frequency component, the parasitic leakage inductance of the balun transformer circuit of the impedance matching apparatus configured to include a predefined coupling factor, k, defined by an implemented gap, G, between the primary coil of the balun transformer circuit and the secondary coil of the balun transformer circuit.
12 . The 5 G mm wave device of claim 11 wherein the predefined coupling factor, k, is defined by an implemented offset between the primary coil and the secondary coil of the balun transformer circuit.
13 . The 5 G mm wave device of claim 11 wherein the predefined coupling factor, k, is defined by an implemented winding ratio, R, of a number of windings of the primary coil and a number of windings of the secondary coil.
14 . The 5 G mm wave device of claim 11 wherein the primary coil and the secondary coil of the balun transformer circuit are implemented on different layers of an integrated circuit.
15 . The impedance matching apparatus of claim 1 wherein the primary coil surrounds the secondary coil.
16 . The impedance matching apparatus of claim 1 wherein the secondary coil has more windings than the primary coil.
17 . The front-end module of claim 6 wherein the primary coil surrounds the secondary coil.
18 . The front-end module of claim 6 wherein the secondary coil has more windings than the primary coil.
19 . The 5 G mm wave device of claim 11 wherein the primary coil surrounds the secondary coil.
20 . The 5 G mm wave device of claim 11 wherein the secondary coil has more windings than the primary coil.