Anchor and cavity configuration for MEMS-based cooling systems
A cooling system is described. The cooling system includes a bottom plate, a support structure, and a cooling element. The bottom plate has orifices therein. The cooling element has a central axis and is supported by the support structure at the central axis. A first portion of the cooling element is on a first side of the central axis and a second portion of the cooling element is on a second side of the central axis opposite to the first side. The first and second portions of the cooling element are unpinned. The first portion and the second portion are configured to undergo vibrational motion when actuated to drive a fluid through the orifices. The support structure couples the cooling element to the bottom plate. The support structure is coupled with at least one of the cooling element or the bottom plate by diffusion bond(s).
1 . A cooling system, comprising:
a bottom plate having a plurality of orifices therein;
a support structure;
a cooling element having a central axis, the cooling element being supported by the support structure at the central axis such that a first portion of the cooling element on a first side of the central axis and a second portion of the cooling element on a second side of the central axis opposite to the first side are unpinned, the first portion and the second portion being configured to undergo vibrational motion when actuated to drive a fluid through the plurality of orifices, the support structure coupling the cooling element to the bottom plate; and
wherein the support structure is an adhesive support structure coupled with at least one of the cooling element or the bottom plate by at least one diffusion bond.
2 . The cooling system of claim 1 , wherein the support structure undergoes rotational motion in response to the vibrational motion.
3 . The cooling system of claim 1 , wherein the cooling element and the support structure form an integrated structure.
4 . The cooling system of claim 1 , wherein the cooling element and the support structure include titanium.
5 . The cooling system of claim 1 , wherein the bottom plate includes a cavity therein, the bottom plate having a thickness, the cavity having a depth less than the thickness and a cavity width.
6 . The cooling system of claim 5 , wherein the bottom plate includes an orifice plate and a jet channel plate, the orifice plate including the plurality of orifices therein, the jet channel plate including the cavity therein.
7 . The cooling system of claim 1 , wherein the cooling element includes a trench defining a first support structure width.
8 . The cooling system of claim 1 , wherein the bottom plate includes a trench defining a support structure width.
9 . A cooling system, comprising:
a plurality of cooling cells, each of the plurality of cooling cells including a bottom plate having a plurality of orifices therein, a support structure and a cooling element, the cooling element having a central axis, the cooling element being supported by the support structure at the central axis such that a first portion of the cooling element on a first side of the central axis and a second portion of the cooling element on a second side of the central axis opposite to the first side are unpinned, the first portion and the second portion configured to undergo vibrational motion when actuated to drive a fluid through the plurality of orifices, the support structure coupling the cooling element to the bottom plate; and
wherein the support structure is an adhesive support structure coupled with at least one of the cooling element or the bottom plate by at least one diffusion bond.
10 . The cooling system of claim 9 , wherein at least one of the cooling element and the support structure includes titanium.
11 . The cooling system of claim 9 , wherein the support structure undergoes rotational motion in response to the vibrational motion.
12 . The cooling system of claim 9 , wherein the cooling element and the support structure form an integrated structure.
13 . The cooling system of claim 9 , wherein the bottom plate includes a cavity therein, the bottom plate having a thickness, the cavity having a depth less than the thickness and a cavity width.
14 . The cooling system of claim 13 , wherein the bottom plate includes an orifice plate and a jet channel plate, the orifice plate including the plurality of orifices therein, the jet channel plate including the cavity therein.
15 . A cooling system, comprising:
a chamber having a plurality of openings therein;
a support structure coupled with the chamber;
a cooling element, the cooling element being supported by the support structure at a region such that a first portion of the cooling element on a first side of the region and a second portion of the cooling element on a second side of the region opposite to the first side are unpinned, the first portion and the second portion being configured to undergo vibrational motion when actuated to drive a fluid through at least a portion of the plurality of openings, the support structure coupling the cooling element to the chamber; and
wherein the support structure undergoes rotational motion in response to the vibrational motion.
16 . The cooling system of claim 15 , wherein the support structure is an adhesive support structure coupled with at least one of the cooling element or the bottom plate by at least one diffusion bond.
17 . The cooling system of claim 16 , wherein the diffusion bond is the adhesive for the adhesive support structure.
18 . The cooling system, of claim 15 , wherein:
the chamber includes a bottom plate having the at least the portion of the plurality of openings therein.
19 . The cooling system of claim 18 , wherein the bottom plate includes an orifice plate and a jet channel plate, the orifice plate including the plurality of openings therein, the jet channel plate including a cavity therein.
20 . The cooling system of claim 19 , wherein the jet channel plate and the orifice plate are integrated into a single structure.