Power rails for stacked semiconductor device
The present disclosure describes a method to form a stacked semiconductor device with power rails. The method includes forming the stacked semiconductor device on a first surface of a substrate. The stacked semiconductor device includes a first fin structure, an isolation structure on the first fin structure, and a second fin structure above the first fin structure and in contact with the isolation structure. The first fin structure includes a first source/drain (S/D) region, and the second fin structure includes a second S/D region. The method also includes etching a second surface of the substrate and a portion of the first S/D region or the second S/D region to form an opening. The second surface is opposite to the first surface. The method further includes forming a dielectric barrier in the opening and forming an S/D contact in the opening.
1 . An integrated circuit, comprising:
a stacked semiconductor device on a first surface of a substrate, wherein the stacked semiconductor device comprises a first device stacked over a second device, and wherein the second device comprises a source/drain (S/D) region;
a S/D contact structure on a second surface of the substrate and connected to the S/D region, wherein the second surface is opposite to the first surface; and
a dielectric barrier surrounding the S/D contact structure, wherein the dielectric barrier is in contact with the S/D region, and wherein a thickness of the dielectric barrier ranges from about 3 nm to about 5 nm.
2 . The integrated circuit of claim 1 , further comprising a gate contact structure on the first surface of the substrate, wherein the gate contact structure is connected to a gate structure of the first device.
3 . The integrated circuit of claim 1 , further comprising an isolation structure between the first and second devices.
4 . The integrated circuit of claim 1 , wherein the S/D contact structure comprises a silicide layer on the S/D region and a metal contact structure on the silicide layer.
5 . The integrated circuit of claim 1 , further comprising a S/D interconnect on the S/D contact structure, wherein the S/D contact structure and the S/D interconnect connect the S/D region to a power supply.
6 . The integrated circuit of claim 1 , further comprising a S/D interconnect on the S/D contact structure, wherein the S/D contact structure and the S/D interconnect connect the S/D region to ground.
7 . The integrated circuit of claim 1 , wherein the first device comprises a first stack of semiconductor layers extending along a first direction, and wherein the second device comprises a second stack of semiconductor layers extending along the first direction.
8 . The integrated circuit of claim 1 , wherein the first device comprises a first stack of semiconductor layers extending along a first direction, and wherein the second device comprises a second stack of semiconductor layers extending along a second direction about 90 degrees relative to the first direction.
9 . The integrated circuit of claim 1 , further comprising a block structure on the first surface of the substrate, wherein the block structure and the S/D contact structure are on opposite sides of the S/D region.
10 . A semiconductor device, comprising:
first and second stacks of semiconductor layers on a first surface of a substrate, wherein the first stack of semiconductor layers is stacked over the second stack of semiconductor layers;
an epitaxial layer between the first and second stacks of semiconductor layers;
a gate structure surrounding the first and second stacks of semiconductor layers;
a source/drain (S/D) region in contact with the second stack of semiconductor layers and the epitaxial layer; and
a S/D contact structure on a second surface of the substrate and connected to the S/D region, wherein the second surface is opposite to the first surface.
11 . The semiconductor device of claim 10 , further comprising a gate contact structure on the first surface of the substrate, wherein the gate contact structure is connected to the gate structure.
12 . The semiconductor device of claim 10 , further comprising an isolation structure between the first and second stacks of semiconductor layers.
13 . The semiconductor device of claim 10 , wherein the S/D contact structure comprises a silicide layer on the S/D region and a metal contact structure on the silicide layer.
14 . The semiconductor device of claim 10 , further comprising a S/D interconnect on the S/D contact structure, wherein the S/D contact structure and the S/D interconnect connect the S/D region to a power supply or ground.
15 . The semiconductor device of claim 10 , wherein the first and second stacks of semiconductor layers extends along a same direction.
16 . The semiconductor device of claim 10 , further comprising a block structure on the first surface of the substrate, wherein the block structure and the S/D contact structure are on opposite sides of the S/D region.
17 . A semiconductor device, comprising:
first and second stacks of semiconductor layers on a first surface of a substrate, wherein the first stack of semiconductor layers is stacked over the second stack of semiconductor layers;
a dielectric structure between the first and second stacks of semiconductor layers;
an epitaxial layer on the dielectric structure;
a first source/drain (S/D) region on the epitaxial layer and in contact with the first stack of semiconductor layers;
a second S/D region in contact with the second stack of semiconductor layers, wherein the dielectric structure is in contact with top surfaces of the second stacks of semiconductor layers and the second S/D region; and
first and second S/D contact structures on a second surface of the substrate, wherein:
the second surface is opposite to the first surface;
the first S/D contact structure is connected to the first S/D region; and
the second S/D contact structure is connected to the second S/D region.
18 . The semiconductor device of claim 17 , further comprising a first S/D interconnect on the first S/D contact structure and a second S/D interconnect on the second S/D contact structure, wherein the first S/D contact structure and the first S/D interconnect connect the first S/D region to a power supply, and wherein the second S/D contact structure and the second S/D interconnect connect the second S/D region to ground.
19 . The semiconductor device of claim 17 , further comprising a gate contact structure on the first surface of the substrate, wherein the gate contact structure is connected to a gate structure surrounding the second stack of semiconductor layers.
20 . The semiconductor device of claim 17 , further comprising a block structure on the first surface of the substrate, wherein the block structure and the first S/D contact structure are on opposite sides of the first S/D region.