Granted Patent B2

US 12,520,706 · App. 18/110,272 · Granted Jan 6, 2026

Inventors: Sujeong Kim (Yongin-si, KR); Younggu Kim (Yongin-si, KR)

Assignee: Samsung Display Co., Ltd.

H10K59/873H10K59/1201

Abstract

Claims (48)

1 . A method of manufacturing a display apparatus including a substrate and a light-emitting diode, wherein the substrate includes a display area and a peripheral area disposed outside of the display area, and the light-emitting diode is arranged in the display area, the method comprising steps of:

forming a dam in the peripheral area, the dam including a photodegradable material;

forming an organic layer in an inner region of the dam, the organic layer including a photocurable material, wherein the forming of the organic layer is performed by:

injecting an organic layer-forming material in the inner region of the dam, the organic layer-forming material including the photocurable material, and

irradiating light and curing the organic layer-forming material that is injected; and

removing the dam.

2 . The method of claim 1 , wherein the forming of the dam is performed by:

coating the substrate with a dam-forming material in order to form a pattern, the dam-forming material including the photodegradable material, and

drying the dam-forming material that is patterned.

3 . The method of claim 2 , wherein the coating of the substrate and the forming of the pattern are performed by using line drawing or a silk screen method.

4 . The method of claim 2 , wherein the coating of the substrate and the forming of the pattern are performed by:

coating the substrate with the dam-forming material, and

irradiating light, by using a mask, to the dam-forming material that is coated.

5 . The method of claim 1 , wherein the dam surrounds the display area along edges of the display area in a plan view.

6 . The method of claim 1 , wherein an opening corresponding to the display area in a plan view is formed in the dam.

7 . The method of claim 1 , wherein the forming of the organic layer is performed by using an inkjet method.

8 . The method of claim 1 , wherein the organic layer is disposed over the light-emitting diode and covers an entirety of the display area.

9 . The method of claim 1 , wherein the photocurable material includes a negative photoresist.

10 . The method of claim 1 , wherein the photodegradable material includes a positive photoresist.

11 . The method of claim 1 , wherein the removing of the dam is performed by:

decomposing the dam by irradiating light thereon, and

removing the dam that is decomposed.

12 . The method of claim 11 , wherein the removing of the dam is simultaneously performed with the curing of the organic layer-forming material.

13 . The method of claim 1 , wherein a thickness of the dam is about 0.8 times to about 10 times a thickness of the organic layer.

14 . A method of manufacturing a display apparatus including a substrate and a light-emitting diode, wherein the substrate includes a display area and a peripheral area disposed outside of the display area, and the light-emitting diode is arranged in the display area, the method comprising steps of:

forming a dam in the peripheral area, the dam including a photodegradable material;

forming an organic layer in an inner region of the dam, the organic layer including a photocurable material; and

removing the dam, wherein the display apparatus further includes a first inorganic encapsulation layer covering the light-emitting diode, a second inorganic encapsulation layer on the first inorganic encapsulation layer, and an organic encapsulation layer disposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer, and

wherein the organic layer includes the organic encapsulation layer.

15 . A method of manufacturing a display apparatus including a substrate and a light-emitting diode, wherein the substrate includes a display area and a peripheral area disposed outside of the display area, and the light-emitting diode is arranged in the display area, the method comprising steps of:

forming a dam in the peripheral area, the dam including a photodegradable material;

forming an organic layer in an inner region of the dam, the organic layer including a photocurable material; and

removing the dam, wherein the organic layer includes a first organic layer and a second organic layer directly disposed on the first organic layer, and

wherein the forming of the organic layer is performed by forming the first organic layer and forming the second organic layer on the first organic layer.

16 . The method of claim 15 , wherein the forming of the first organic layer is performed by:

injecting a first organic layer-forming material in the inner region of the dam, the first organic layer-forming material including a photocurable material, and

irradiating light to cure the first organic layer-forming material that is injected, and

wherein the forming of the second organic layer is performed by:

injecting a second organic layer-forming material in the inner region of the dam, the second organic layer-forming material including a photocurable material, and

irradiating light to cure the second organic layer-forming material that is injected.

17 . The method of claim 16 , wherein the curing of the first organic layer-forming material is performed by:

preparing a mask including a light transmissive region and a light-blocking region,

aligning the mask such that the light transmissive region corresponds to the first organic layer-forming material, and the light-blocking region corresponds to the dam, and

irradiating light.

18 . The method of claim 17 , wherein the removing of the dam is performed by:

decomposing the dam by irradiating light, and

removing the dam that is decomposed, and

wherein the decomposing of the dam is simultaneously performed with the curing of the second organic layer-forming material.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (14)