Image sensor device and manufacturing method thereof
A method includes performing a first lithography process using a first pattern of a first photomask to form a first photoresist pattern on a front side of a device substrate; performing a first implantation process using the first pattern as a mask to form first isolation regions in the device substrate; after performing the first implantation process, performing a second lithography process using a second pattern of a second photomask to form a second photoresist pattern on the front side of the device substrate, the second pattern being shifted from the first pattern by a distance less than the first pitch and in the first direction; performing a second implantation process using the second photoresist pattern as a mask to form second isolation regions in the device substrate and spaced apart from the first isolation regions; and forming pixels between the first and second isolation regions.
1 . A method, comprising:
forming first photoresist columns on a device substrate, wherein the first photoresist columns are spaced apart from one another;
applying a chemical mixture comprising surfactant particles and a chemical material to the first photoresist columns, wherein the surfactant particles and the chemical material comprise different compositions;
after applying the chemical mixture to the first photoresist columns to the chemical mixture, performing a first implantation process to implant first ions into the device substrate to form first isolation regions in the device substrate using the first photoresist columns as a mask;
performing a second implantation process to implant second ions into the device substrate to form second isolation regions, wherein the second isolation regions and the first isolation regions are staggered along a first direction from a top view; and
forming pixels between the first and second isolation regions.
2 . The method of claim 1 , wherein the surfactant particles include a fluorinated compound.
3 . The method of claim 1 , wherein the chemical material is a polymer having a thermal cross-linking property.
4 . The method of claim 1 , further comprising:
performing a baking process to the first photoresist columns such that the chemical material is cross-linked to the first photoresist columns and forms a cross-linking film on an exposed surface of the first photoresist columns.
5 . The method of claim 1 , wherein the surfactant particles have a micelle portion.
6 . The method of claim 3 , wherein the polymer is water-soluble.
7 . The method of claim 4 , further comprising:
after performing the baking process, performing a developing process.
8 . The method of claim 4 , wherein forming the cross-linking film on the exposed surface of the first photoresist columns comprises:
forming the cross-linking film on a top surface and opposite sidewalls of the first photoresist columns.
9 . The method of claim 4 , wherein forming the cross-linking film on the exposed surface of the first photoresist columns is performed such that a capillary force inside a trench between two of the first photoresist columns is reduced.
10 . The method of claim 1 , wherein applying the chemical mixture comprising the surfactant particles and the chemical material to the first photoresist columns is performed using a spin-coating process.
11 . A method, comprising:
forming first photoresist columns on a device substrate, wherein the first photoresist columns are parallel to each other;
forming a polymer layer on one of the first photoresist columns;
after forming the polymer layer, performing a first implantation process to implant first ions into the device substrate to form first isolation regions in the device substrate using the first photoresist columns as a mask;
performing a second implantation process to implant second ions into the device substrate to form second isolation regions, wherein the second isolation regions and the first isolation regions are staggered along a first direction from a top view; and
forming pixels between the first and second isolation regions.
12 . The method of claim 11 , wherein the polymer layer is a conformal layer.
13 . The method of claim 11 , wherein the polymer layer is in contact with opposite sidewalls of the one of the first photoresist columns.
14 . The method of claim 11 , wherein the polymer layer is in contact with a top surface of the one of the first photoresist columns.
15 . The method of claim 11 , wherein the polymer layer comprises surfactants disposed on a sidewall of the one of the first photoresist columns.
16 . The method of claim 11 , wherein the polymer layer is in contact with a top surface of the device substrate.
17 . A method, comprising:
forming first photoresist columns on a device substrate, wherein the first photoresist columns have the same height;
forming a polymer layer on one of the first photoresist columns;
after forming the polymer layer, performing a first implantation process to implant first ions into the device substrate to form first isolation regions in the device substrate using the first photoresist columns as a mask;
performing a second implantation process to implant second ions into the device substrate to form second isolation regions, wherein the second isolation regions and the first isolation regions are staggered along a first direction from a top view; and
forming pixels between the first and second isolation regions.
18 . The method of claim 17 , wherein the device substrate has a top surface uncovered by the first photoresist columns and the polymer layer.
19 . The method of claim 17 , wherein the first ions are n-type.
20 . The method of claim 17 , wherein the first ions are p-type.