IP Library › Granted Patent US 12,532,566
Granted Patent B2
US 12,532,566 · App. 18/276,667 · Granted Jan 20, 2026

Epitaxial structure of nonpolar AlGaN-based deep-ultraviolet (DUV) photoelectric detector and preparation method thereof

Inventors: Wenliang Wang (Guangzhou, CN); Jianhua Duan (Guangzhou, CN); Guoqiang Li (Guangzhou, CN)
Assignee: SOUTH CHINA UNIVERSITY OF TECHNOLOGY
H10F77/12485H10F30/10H10F71/1274H10F71/1276H10F71/128H10F77/169
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Quick Facts
Patent No.
US 12,532,566
App. No.
18/276,667
Granted
Jan 20, 2026
Kind
B2
Abstract

An epitaxial structure of a nonpolar AlGaN-based deep-ultraviolet (DUV) photoelectric detector and a preparation method thereof are provided. The epitaxial structure of the nonpolar AlGaN-based DUV photoelectric detector includes a nonpolar AlN buffer layer, a nonpolar Al 0.15 Ga 0.85 N buffer layer, and a nonpolar Al 0.7 Ga 0.3 N epitaxial layer that are sequentially grown on a LaAlO 3 substrate. The LaAlO 3 substrate takes a (100) plane as an epitaxial plane, and AlN[11-20] as an epitaxial growth direction. With the LaAlO 3 substrate, the epitaxial structure reduces dislocations and stresses between the substrate and the epitaxial buffer layer. By designing two AlGaN epitaxial buffer layers with different components, the epitaxial structure reduces a dislocation density and a surface roughness of the nonpolar AlGaN epitaxial layer, further accelerates photoresponse and detectivity of the detector, and enhances overall performance of the nonpolar AlGaN-based DUV photoelectric detector.

Claims (17)

1 . An epitaxial structure of a nonpolar AlGaN-based deep-ultraviolet (DUV) photoelectric detector, comprising a LaAlO 3 substrate, wherein a nonpolar AlN buffer layer, a nonpolar Al 0.15 Ga 0.85 N buffer layer, and a nonpolar Al 0.7 Ga 0.3 N epitaxial layer are sequentially grown on the LaAlO 3 substrate; and the LaAlO 3 substrate takes a (100) plane as an epitaxial plane, and AlN[11-20] as an epitaxial growth direction.

2 . The epitaxial structure of the nonpolar AlGaN-based DUV photoelectric detector according to claim 1 , wherein the nonpolar AlN buffer layer has a thickness of 300 nm to 400 nm.

3 . The epitaxial structure of the nonpolar AlGaN-based DUV photoelectric detector according to claim 1 , wherein the nonpolar Al 0.15 Ga 0.85 N buffer layer has a thickness of 350 nm to 400 nm.

4 . The epitaxial structure of the nonpolar AlGaN-based DUV photoelectric detector according to claim 1 , wherein the nonpolar Al 0.7 Ga 0.3 N epitaxial layer has a thickness of 450 nm to 550 nm.

5 . A preparation method of an epitaxial structure of a nonpolar AlGaN-based deep-ultraviolet (DUV) photoelectric detector, comprising: selecting a LaAlO 3 substrate, and cleaning a surface of the LaAlO 3 substrate to obtain a cleaned LaAlO 3 substrate;

putting the cleaned LaAlO 3 substrate into an ultrahigh vacuum (UHV) chamber, and annealing the cleaned LaAlO 3 substrate at a high temperature to remove surface contamination;

charging nitrogen to the UHV chamber, and epitaxially growing a nonpolar AlN buffer layer on the LaAlO 3 substrate by pulsed laser deposition (PLD);

changing a target material in an environment of growing the nonpolar AlN buffer layer, and growing a nonpolar Al 0.15 Ga 0.85 N buffer layer on the nonpolar AlN buffer layer in-situ; and

changing the target material in the environment of growing the nonpolar AlN buffer layer, and growing a nonpolar Al 0.7 Ga 0.3 N epitaxial layer on the Al 0.15 Ga 0.85 N buffer layer;

wherein the LaAlO 3 substrate takes a (100) plane as an epitaxial plane, and AlN[11-20] as an epitaxial growth direction.

6 . The preparation method according to claim 5 , wherein the environment of growing the nonpolar AlN buffer layer is as follows: by keeping a vacuum degree in the UHV chamber, a laser energy at 220 mJ to 300 mJ, a laser frequency at 15 Hz to 30 Hz, a nitrogen flow at 2 sccm to 8 sccm, and a nitrogen pressure in the UHV chamber at 6 mTorr to 10 mTorr, the nonpolar AlN buffer layer is grown in an N-rich atmosphere.

7 . The preparation method according to claim 5 , wherein the nonpolar AlN buffer layer is epitaxially grown on the LaAlO 3 substrate, and an Al source is an AlN high-purity ceramic target material.

8 . The preparation method according to claim 5 , wherein the nonpolar Al 0.15 Ga 0.85 N buffer layer is grown on the nonpolar AlN buffer layer in-situ, and the target material is gallium-rich AlGaN ceramic.

9 . The preparation method according to claim 5 , wherein the nonpolar Al 0.7 Ga 0.3 N epitaxial layer is grown on the Al 0.15 Ga 0.85 N buffer layer, and the target material is aluminum-rich AlGaN ceramic.

10 . The preparation method according to claim 5 , wherein the nonpolar AlN buffer layer has a thickness of 300 nm to 400 nm;

the nonpolar Al 0.15 Ga 0.85 N buffer layer has a thickness of 350 nm to 400 nm; and

the nonpolar Al 0.7 Ga 0.3 N epitaxial layer has a thickness of 450 nm to 550 nm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 10, 2023
From: WANG, WENLIANG; DUAN, JIANHUA; LI, GUOQIANG
To: SOUTH CHINA UNIVERSITY OF TECHNOLOGY
Reel/Frame 064546/0765 →
Priority Claims (1)
CN 202210363310.4 · Apr 8, 2022 · national
Continuity (1)
Related Publication 20250022973A1 · Jan 16, 2025
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