IP Library › Granted Patent US 12,532,709
Granted Patent B2
US 12,532,709 · App. 18/212,395 · Granted Jan 20, 2026

Substrate processing apparatus

Inventors: Takahiro Hamada (Yokohama, JP); Osamu Yamazaki (Yokohama, JP)
Assignee: Shibaura Mechatronics Corporation
H01L21/68728B23Q1/03
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Quick Facts
Patent No.
US 12,532,709
App. No.
18/212,395
Granted
Jan 20, 2026
Kind
B2
Abstract

According to one embodiment, a substrate processing apparatus includes a rotating table configured to rotate a substrate and a plurality of fixing members configured to fix the substrate on the rotating table by grasping the substrate while abutting an outer periphery of the substrate, wherein each fixing member includes a curved surface on a side that abuts the substrate, a reduced portion formed to be connected to an end of the curved surface and having a width which is continuously reduced in the first direction from a boundary with the curved surface, a first sloping surface formed on a top portion to slope downwards in the first direction, and a support portion formed on the curved surface and configured to support the substrate such that a top surface of the top portion is flush with an upper surface of the substrate in a state where the substrate is grasped.

Claims (27)

1 . A substrate processing apparatus comprising:

a rotating table configured to rotate a substrate; and

a plurality of fixing members configured to fix the substrate on the rotating table by grasping the substrate while abutting an outer periphery of the substrate,

wherein each of the plurality of fixing members includes:

a curved surface on a side that abuts the substrate when viewed in a direction of a rotational axis of the rotating table;

a reduced portion formed to be connected to an end of the curved surface when viewed in the direction of the rotational axis of the rotating table, and having a width in a direction perpendicular to a first direction facing away from the side that abuts the substrate, which is continuously reduced in the first direction from a boundary with the curved surface;

a first sloping surface formed on a top portion to slope downwards in the first direction when viewed in a direction that is perpendicular to the direction of the rotational axis of the rotating table and perpendicular to the first direction; and

a support portion formed on the curved surface and configured to support the substrate such that a top surface of the top portion is flush with an upper surface of the substrate in a state where the substrate is grasped.

2 . A substrate processing apparatus comprising:

a rotating table configured to rotate a substrate; and

a plurality of fixing members configured to fix the substrate on the rotating table by grasping the substrate while abutting an outer periphery of the substrate,

wherein each of the plurality of fixing members includes a top portion, a base portion configured to hold the top portion, and a support portion configured to support the substrate,

wherein the top portion includes:

a curved surface on a side that abuts the substrate when viewed in a direction of a rotational axis of the rotating table;

a reduced portion formed to be connected to an end of the curved surface when viewed in the direction of the rotational axis of the rotating table, and having a width in a direction perpendicular to a first direction facing away from the side that abuts the substrate, which is continuously reduced in the first direction from a boundary with the curved surface, and

a first sloping surface which slopes downwards in the first direction when viewed in a direction that is perpendicular to the direction of the rotational axis of the rotating table and perpendicular to the first direction, and

wherein the support portion is configured to support the substrate such that a top surface of the top portion is flush with an upper surface of the substrate in a state where the substrate is grasped.

3 . The substrate processing apparatus of claim 1 , wherein the top portion has a horizontal surface on a side that supports the substrate when viewed in the direction that is perpendicular to the direction of the rotational axis of the rotating table and perpendicular to the first direction, and

wherein the first sloping surface slopes downwards from an end of the horizontal surface in the first direction.

4 . The substrate processing apparatus of claim 1 , wherein a length of the first sloping surface in the first direction is at least half of a length of the top portion in the first direction.

5 . The substrate processing apparatus of claim 1 , wherein each of the plurality of fixing members is provided such that a direction of the reduced portion having a width continuously reduced in the first direction is parallel to a scattering direction of a processing liquid supplied to the substrate.

6 . The substrate processing apparatus of claim 1 , wherein each of the plurality of fixing members further includes a second sloping surface configured to slope downwards from an end of the first sloping surface in the first direction when viewed in the direction that is perpendicular to the direction of the rotational axis of the rotating table and perpendicular to the first direction.

7 . The substrate processing apparatus of claim 2 , wherein the top portion has a horizontal surface on a side that supports the substrate when viewed in the direction that is perpendicular to the direction of the rotational axis of the rotating table and perpendicular to the first direction, and

wherein the first sloping surface slopes downwards from an end of the horizontal surface in the first direction.

8 . The substrate processing apparatus of claim 2 , wherein a length of the first sloping surface in the first direction is at least half of a length of the top portion in the first direction.

9 . The substrate processing apparatus of claim 2 , wherein each of the plurality of fixing members is provided such that a direction of the reduced portion having a width continuously reduced in the first direction is parallel to a scattering direction of a processing liquid supplied to the substrate.

10 . The substrate processing apparatus of claim 2 , wherein each of the plurality of fixing members further includes a second sloping surface configured to slope downwards from an end of the first sloping surface in the first direction when viewed in the direction that is perpendicular to the direction of the rotational axis of the rotating table and perpendicular to the first direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2023
From: HAMADA, TAKAHIRO; YAMAZAKI, OSAMU
To: SHIBAURA MECHATRONICS CORPORATION
Reel/Frame 064018/0527 →
Priority Claims (1)
JP 2022-100353 · Jun 22, 2022 · national
Continuity (1)
Related Publication 20230420288A1 · Dec 28, 2023
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