IP Library › Granted Patent US 12,546,030
Granted Patent B2
US 12,546,030 · App. 18/979,953 · Granted Feb 10, 2026

SiC epitaxial wafer and method of manufacturing SiC epitaxial wafer

Inventors: Kensho Tanaka (Chichibu, JP); Yoshikazu Umeta (Chichibu, JP)
Assignee: Resonac Corporation
C30B29/36C23C16/325C23C16/4408C23C16/52C30B25/16C30B25/205H01L21/02378H01L21/02532H01L21/02579H01L21/0262H10D62/8325H10D62/834
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Quick Facts
Patent No.
US 12,546,030
App. No.
18/979,953
Granted
Feb 10, 2026
Kind
B2
Abstract

A SiC epitaxial wafer includes a SiC substrate and an epitaxial layer laminated on the SiC substrate, wherein the epitaxial layer contains an impurity element which determines the conductivity type of the epitaxial layer and boron which has a conductivity type different from the conductivity type of the impurity element, and the concentration of boron is less than 1.0×10 14 cm −3 at any position in the plane of the epitaxial layer.

Claims (17)

1 . A SiC device, comprising:

a SiC substrate; and

an epitaxial layer of SiC laminated on the SiC substrate,

wherein the epitaxial layer contains an impurity element which determines the conductivity type of the epitaxial layer and boron which has a conductivity type different from the conductivity type of the impurity element, and

the concentration of boron is 5.0×10 13 cm −3 or less at the center of the epitaxial layer.

2 . The SiC device according to claim 1 , wherein the concentration of boron is the one measured by a secondary ion mass spectrometry.

3 . The SiC device according to claim 1 , wherein the concentration of the impurity element determining the conductivity type of the epitaxial layer is 1.0×10 14 cm −3 or more and 3.0×10 16 cm −3 or less.

4 . The SiC device according to claim 1 , wherein the concentration of the impurity element determining the conductivity type of the epitaxial layer is 1.0×10 14 cm −3 or more and 3.0×10 15 cm −3 or less.

5 . The SiC device according to claim 1 , wherein the impurity element determining the conductivity type of the epitaxial layer is nitrogen.

6 . The SiC device according to claim 1 , wherein the SiC device is a power device.

7 . The SiC device according to claim 1 , wherein the SiC device is a high frequency device.

8 . The SiC device according to claim 1 , wherein the SiC device is a high temperature operation device.

9 . A SiC device, comprising:

a SiC substrate; and

an epitaxial layer of SiC laminated on the SiC substrate,

wherein the epitaxial layer contains an impurity element which determines the conductivity type of the epitaxial layer and boron which has a conductivity type different from the conductivity type of the impurity element, and

the concentration of boron is less than 1.0×10 14 cm −3 at any position in the plane of the epitaxial layer.

Priority Claims (1)
JP 2021-128273 · Aug 4, 2021 · national
Continuity (3)
Division 18371423 · Sep 21, 2023
Continuation 17879474 · Aug 2, 2022
Related Publication 20250109526A1 · Apr 3, 2025
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