IP Library › Granted Patent US 12,549,840
Granted Patent B2
US 12,549,840 · App. 18/491,143 · Granted Feb 10, 2026

Camera module and electronic device including same

Inventors: Taehwan Kim (Suwon-si, KR); Bongchan Kim (Suwon-si, KR); Hwajoong Jung (Suwon-si, KR); Hyungjin Rho (Suwon-si, KR); Jaeheung Park (Suwon-si, KR); Kwangseok Byon (Suwon-si, KR); Hyosang An (Suwon-si, KR); Jaehyoung Park (Suwon-si, KR); Kihuk Lee (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H04N23/55H04M1/0264H04M1/0277H04N23/54H04M2250/52
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Quick Facts
Patent No.
US 12,549,840
App. No.
18/491,143
Granted
Feb 10, 2026
Kind
B2
Abstract

According to various embodiments disclosed herein, a camera module and/or an electronic device including same comprises: a lens assembly including at least one lens aligned on an optical axis; a first circuit board that includes an image sensor disposed on the optical axis and is disposed to be movable along two intersecting directions on a plane perpendicular to the optical axis; a second circuit board in which at least one connector is disposed; and a flexible printed circuit board electrically connecting the first circuit board and the second circuit board. The flexible printed circuit board includes: a first end coupled to the first circuit board; a second end coupled to the second circuit board; a plurality of extensions extending from the first end and connected to the second end; at least one slit disposed between two adjacent extensions among the plurality of extensions; and a plurality of conducting wires arranged in the plurality of extensions, wherein two or more conducting wires selected from among the conducting wires and arranged in different extensions can be connected in parallel.

Claims (43)

1 . A camera module, comprising:

a lens assembly including at least one lens aligned on an optical axis;

a first circuit board including an image sensor disposed on the optical axis and disposed to be movable in two directions, the two directions crossing each other on a plane perpendicular to the optical axis;

a second circuit board having at least one connector disposed thereon; and

a flexible printed circuit board electrically connecting the first circuit board and the second circuit board, wherein the flexible printed circuit board includes:

a first end portion coupled to the first circuit board;

a second end portion coupled to the second circuit board;

a plurality of extensions extending from the first end portion and connected to the second end portion;

at least one slit disposed between two adjacent extensions among the plurality of extensions; and

a plurality of conducting lines disposed in the plurality of extensions,

wherein two or more selected from among the conducting lines disposed in different extensions are electrically connected in parallel between the first end portion and the second end portion.

2 . The camera module of claim 1 , wherein the conducting lines connected in parallel are configured to be merged on the first circuit board to supply power.

3 . The camera module of claim 1 , wherein at least a pair of conducting lines are disposed in one extension.

4 . The camera module of claim 3 , wherein the conducting lines in one extension are configured to be impedance-matched with respect to each other.

5 . The camera module of claim 1 , wherein when viewed in a direction parallel to the optical axis, a width of the slit is less than a width of the extension.

6 . The camera module of claim 1 , wherein the extension includes:

a first section extending along a first direction of the two directions crossing each other; and

a second section extending along a second direction of the two directions crossing each other.

7 . The camera module of claim 6 , wherein the extension further includes a third section connecting the first section and the second section, and wherein the third section has an arc shape or is disposed to be inclined with respect to the two directions crossing each other.

8 . The camera module of claim 6 , wherein the first section or the second section is disposed around at least one side surface of the first circuit board or, when viewed in a direction of the optical axis, the first section or the second section are disposed to at least partially overlap the first circuit board.

9 . The camera module of claim 1 , wherein the flexible printed circuit board further includes:

a base film including a first surface and a second surface facing a direction opposite to the first surface;

an insulation layer disposed on the first surface; and

at least one conductive layer formed on the second surface or a surface of the insulation layer,

wherein at least one of the conducting lines is disposed on the first surface and surrounded by the insulation layer, and

wherein when viewed in a direction parallel to the optical axis, an edge of the conductive layer is at least partially aligned with an edge of the extension.

10 . The camera module of claim 1 , wherein the flexible printed circuit board includes:

a first conductive layer;

base films coupled to face each other with the first conductive layer disposed therebetween; and

insulation layers formed on surfaces of the base films,

wherein the conducting lines are formed on a surface of any one of the base films and surrounded by any one of the insulation layers, and

wherein a side portion of the first conductive layer is visible to an outside of the extension between the base films.

11 . The camera module of claim 1 , wherein the flexible printed circuit board further includes at least one rigid printed circuit board or at least one bridge disposed to connect at least two adjacent extensions among the extensions across at least one slit.

12 . The camera module of claim 11 , wherein the flexible printed circuit board further includes at least one insulating protrusion formed on at least one of a surface of the extension, a surface of the bridge, or a surface of the rigid printed circuit board.

13 . An electronic device, comprising:

a housing; and

the camera module of claim 1 , the camera module configured to receive external light from one surface of the housing or another surface facing in a direction opposite to the one surface; and

at least one processor, wherein one or more of at least one processor is configured to obtain an object image using the camera module in a capture mode.

14 . The electronic device of claim 13 , further comprising a sensor module comprising at least one sensor configured to detect a vibration of the housing by an external force, wherein one or more of the at least one processor is configured to:

identify shaking based on the vibration detected by the sensor module; and

move the first circuit board in at least one of the two directions based on the identified shaking.

15 . The electronic device of claim 14 , wherein a first portion of the extension is configured to move or deform based on the first circuit board moving in a first direction of the two directions, and

wherein a second portion different from the first portion of the extension is configured to move or deform based on the circuit board moving in a second direction different from the first direction of the two directions.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2023
From: KIM, TAEHWAN; KIM, BONGCHAN; JUNG, HWAJOONG; RHO, HYUNGJIN; PARK, JAEHEUNG; BYON, KWANGSEOK; AN, HYOSANG; PARK, JAEHYOUNG; LEE, KIHUK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 065295/0091 →
Priority Claims (2)
KR 10-2021-0053052 · Apr 23, 2021 · national
KR 10-2021-0082181 · Jun 24, 2021 · national
Continuity (2)
Continuation PCTKR2022005807 · Apr 22, 2022
Related Publication 20240048835A1 · Feb 8, 2024
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