Multi-frequency hybrid piezo actuation and capactive transducer
A method includes receiving, by a piezoelectric stack of a transducer, a first piezoelectric voltage. The transducer has a base structure and a first layer, the base structure having a first displacement between a first portion of the base structure and the first layer. The method also includes transmitting, by the transducer, a first ultrasound frequency while receiving a first piezoelectric voltage, and receiving, by the transducer, a first bias voltage. The received first bias voltage alters the first displacement between the first portion of the base structure and the first layer, and the altered first displacement is smaller than the first displacement. The method further includes receiving, by the piezoelectric stack of the transducer, a second piezoelectric voltage to the transducer, and transmitting, by the transducer, a second ultrasound frequency while receiving the first bias voltage and the second piezoelectric voltage.
1 . A method comprising:
receiving, by a piezoelectric stack of a transducer, a first piezoelectric voltage, wherein the transducer has a base structure and a first layer, the base structure having a first displacement between a first portion of the base structure and the first layer;
transmitting, by the transducer, a first ultrasound frequency while receiving a first piezoelectric voltage;
receiving, by the transducer, a first bias voltage, wherein the received first bias voltage alters the first displacement between the first portion of the base structure and the first layer, wherein the altered first displacement is smaller than the first displacement;
receiving, by the piezoelectric stack of the transducer, a second piezoelectric voltage to the transducer; and
transmitting, by the transducer, a second ultrasound frequency while receiving the first bias voltage and the second piezoelectric voltage, wherein the altered first displacement is configured such that the first portion of the base structure contacts the first layer.
2 . The method of claim 1 , wherein the second ultrasound frequency is greater than the first ultrasound frequency.
3 . The method of claim 1 , wherein the first bias voltage is a direct current (“DC”) voltage.
4 . The method of claim 1 , wherein the first bias voltage is a voltage difference between the first layer and the base structure.
5 . The method of claim 1 , further comprising receiving a reflection of the first ultrasound frequency via a piezoelectric material of the piezoelectric stack.
6 . The method of claim 1 , further comprising receiving a reflection of the first ultrasound frequency via a piezoelectric material and capacitive transducer.
7 . The method of claim 1 , further comprising receiving a reflection of the second ultrasound frequency via a piezoelectric material of the piezoelectric stack.
8 . The method of claim 1 , wherein the base structure has a second displacement between a second portion of the base structure and the first layer; and further comprising:
receiving, by the transducer, a second bias voltage, wherein the received second bias voltage alters the second displacement between the second portion of the base structure and the first layer, wherein the altered second displacement is smaller than the second displacement; and
receiving, by the piezoelectric stack of the transducer, a third piezoelectric voltage; and
transmitting, by the transducer, a third ultrasound frequency while receiving the second bias voltage and the third piezoelectric voltage.
9 . The method of claim 1 , wherein applying a second bias voltage to the transducer comprises applying a second bias voltage to the first layer.
10 . The method of claim 1 , wherein applying a second bias voltage to the transducer comprises applying a second bias voltage to the base structure.
11 . The method of claim 1 , wherein applying a first piezoelectric voltage to the transducer comprises applying a first piezoelectric voltage to an electrode.
12 . The method of claim 1 , wherein the first layer comprises a top plate and an insulation layer.
13 . The method of claim 12 , wherein the insulation layer does not contact a second portion of the base structure responsive to the first bias voltage.
14 . The method of claim 1 , wherein the piezoelectric stack comprises:
a first electrode;
a second electrode; and
a piezoelectric material between the first electrode and the second electrode.
15 . The method of claim 1 , wherein the transducer is disposed in a vehicle.
16 . The method of claim 1 , further comprising detecting objects using the transducer.
17 . The method of claim 2 , wherein the second ultrasound frequency is twice the first ultrasound frequency.
18 . The method of claim 16 , wherein the second ultrasound frequency is 80 KHz, and the first ultrasound frequency is 40 KHz.
19 . The method of claim 1 , further comprising calculating a distance of an object by measuring a time-of-flight value between transmitting the first ultrasound frequency and receiving a reflection of the first ultrasound frequency.