IP Library Granted Patent US 12,563,836
Granted Patent B2
US 12,563,836 · App. 18/021,863 · Granted Feb 24, 2026

Display substrate and display device

Inventors: Lizhong Wang (Beijing, CN); Ce Ning (Beijing, CN); Wei Yang (Beijing, CN); Tianmin Zhou (Beijing, CN); Liping Lei (Beijing, CN)
Assignee: BOE TECHNOLOGY GROUP CO., LTD.
H10D86/60H10D86/423H10D86/443H10D86/471
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Quick Facts
Patent No.
US 12,563,836
App. No.
18/021,863
Granted
Feb 24, 2026
Kind
B2
Abstract

A display substrate and a display device are provided. The display substrate includes: a base substrate, and a low temperature poly-silicon thin film transistor and a metal oxide thin film transistor on the base substrate; the low temperature poly-silicon thin film transistor includes: a low temperature poly-silicon semiconductor layer, a first gate insulating layer, a first gate electrode, a first interlayer insulating layer, a first source electrode, and a first drain electrode; the metal oxide thin film transistor includes: a metal oxide semiconductor layer, a second gate insulating layer, a second gate electrode, a second interlayer insulating layer, a passivation layer, a second source electrode, and a second drain electrode; the second source electrode is on a side of the metal oxide semiconductor layer close to the base substrate; and the second drain electrode is on a side of the metal oxide semiconductor layer away from the base substrate.

Claims (29)

1 . A display substrate, comprising: a base substrate, and at least one low temperature poly-silicon thin film transistor and at least one metal oxide thin film transistor on the base substrate;

the low temperature poly-silicon thin film transistor comprises: a low temperature poly-silicon semiconductor layer, a first gate insulating layer, a first gate electrode, a first interlayer insulating layer, a first source electrode, and a first drain electrode;

the metal oxide thin film transistor comprises: a metal oxide semiconductor layer, a second gate insulating layer, a second gate electrode, a second interlayer insulating layer, a passivation layer, a second source electrode, and a second drain electrode; and

the metal oxide semiconductor layer and the low temperature poly-silicon semiconductor layer are in different layers; the second source electrode is on a side of the metal oxide semiconductor layer close to the base substrate; and the second drain electrode is on a side of the metal oxide semiconductor layer away from the base substrate,

wherein the display substrate further comprises a second conductive layer on the base substrate; and

the second conductive layer comprises: the first source electrode, the first drain electrode, and the second source electrode.

2 . The display substrate of claim 1 , wherein the first source electrode and the first drain electrode are on a side of the first interlayer insulating layer away from the base substrate; and

the first source electrode is connected to a source contact region of the low temperature poly-silicon semiconductor layer through a fifth via hole penetrating through the first gate insulating layer and the first interlayer insulating layer; and the first drain electrode is connected to a drain contact region of the low temperature poly-silicon semiconductor layer through a sixth via hole penetrating through the first gate insulating layer and the first interlayer insulating layer.

3 . The display substrate of claim 1 , wherein a material of the metal oxide semiconductor layer comprises at least one of indium gallium zinc oxide, indium gallium tin oxide, and indium tin zinc oxide.

4 . The display substrate of claim 1 , wherein a material of the second drain electrode comprises: a transparent metal oxide.

5 . The display substrate of claim 4 , wherein the transparent metal oxide comprises: indium tin oxide.

6 . A display device, comprising the display substrate of claim 1 .

7 . The display device of claim 6 , wherein the display device is a virtual reality display device or an augmented reality display device, and a resolution of the virtual reality display device or the augmented reality display device is greater than or equal to 1500 PPI.

8 . The display substrate of claim 1 , wherein the second source electrode and a source contact region of the metal oxide semiconductor layer are lapped over each other; and

the second drain electrode is connected to a drain contact region of the metal oxide semiconductor layer through a second via hole penetrating through the second gate insulating layer, the second interlayer insulating layer, and the passivation layer.

9 . The display substrate of claim 8 , wherein the metal oxide thin film transistor further comprises: a light-shielding layer between the first gate insulating layer and the first interlayer insulating layer and covering at least a channel region of the metal oxide semiconductor layer; and

the light-shielding layer is connected to the second gate electrode through a fourth via hole penetrating through the second gate insulating layer and the first interlayer insulating layer.

10 . The display substrate of claim 8 , wherein the metal oxide thin film transistor further comprises: a light-shielding layer between the first gate insulating layer and the first interlayer insulating layer and covering at least a channel region of the metal oxide semiconductor layer; and

the light-shielding layer is connected to the second source electrode through a third via hole penetrating through the first interlayer insulating layer.

11 . The display substrate of claim 1 , wherein the metal oxide thin film transistor further comprises: a buffer layer between the second source electrode and the metal oxide semiconductor layer;

the second source electrode is connected to a source contact region of the metal oxide semiconductor layer through a first via hole penetrating through the buffer layer; and

the second drain electrode is connected to a drain contact region of the metal oxide semiconductor layer through a second via hole penetrating through the second gate insulating layer, the second interlayer insulating layer, and the passivation layer.

12 . The display substrate of claim 11 , wherein a width of the source contact region of the metal oxide semiconductor layer is 0.1 μm to 1.5 μm greater than a width of the drain contact region of the metal oxide semiconductor layer.

13 . The display substrate of claim 11 , wherein the metal oxide thin film transistor further comprises: a light-shielding between the first gate insulating layer and the first interlayer insulating layer and covering at least a channel region of the metal oxide semiconductor layer; and

the light-shielding layer is connected to the second gate electrode through a fourth via hole penetrating through the second gate insulating layer, the buffer layer, and the first interlayer insulating layer.

14 . The display substrate of claim 11 , wherein the metal oxide thin film transistor further comprises: a light-shielding layer between the first gate insulating layer and the first interlayer insulating layer and covering at least a channel region of the metal oxide semiconductor layer; and

the light-shielding layer is connected to the second source electrode through a third via hole penetrating through the first interlayer insulating layer.

15 . The display substrate of claim 14 , further comprising: a first conductive layer on the base substrate; and

the first conductive layer comprises: the first gate electrode and the light-shielding layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2023
From: WANG, LIZHONG; NING, CE; YANG, WEI; ZHOU, TIANMIN; LEI, LIPING
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 062729/0928 →
Continuity (1)
Related Publication 20240266355A1 · Aug 8, 2024
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