Method of repairing light emitting device and display panel having repaired light emitting device
A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and a surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.
1. A light module, comprising:
a circuit board including first pads;
a plurality of light emitters disposed on the circuit board and including second pads, the plurality of light emitters including a first light emitter configured to emit a light having a first peak wavelength and a second light emitter configured to emit a light having a second peak wavelength; and
a plurality of metal bonders including a first metal bonder of the first light emitter and a second metal bonder of the second light emitter, the first and second metal bonders electrically connecting one of the first pads and one of the second pads of the first and second light emitters, respectively,
wherein the first metal bonder of the first light emitter has a thickness that is different from a thickness of the second metal bonder of the second light emitter,
wherein the first metal bonder of the first light emitter and the second metal bonder of the second light emitter include a same material, and
wherein an upper surface of the second metal bonder of the second light emitter is disposed at a level between an upper surface and a bottom surface of the first light emitter.
2. The light module of claim 1 , wherein the first light emitter and the second light emitter are configured to emit light of a same color.
3. The light module of claim 1 , wherein the first light emitter includes a light emitting layer.
4. The light module of claim 1 , wherein the first and second metal bonders include at least one of Au, Sn, or In.
5. The light module of claim 1 , wherein a cross sectional area of the first metal bonder of the first light emitter is different from a cross sectional area of the second metal bonder of the second light emitter.
6. The light module of claim 1 , wherein each of the plurality of light emitters is configured to emit a light having a peak of at least one of a blue light, a green light, and a red light.
7. The light module of claim 1 , wherein a thickness of the first light emitter is substantially a same as a thickness of the second light emitter.
8. A light module, comprising:
a circuit board including first pads;
a plurality of light emitters disposed on the circuit board and including second pads, the plurality of light emitters including a first light emitter configured to emit a first light having a first peak wavelength and a second light emitter configured to emit a second light having a second peak wavelength; and
a plurality of metal bonders including a first metal bonder of the first light emitter and a second metal bonder of the second light emitter, the first and second metal bonders electrically connecting one of the first pads and one of the second pads of the first and second light emitters, respectively,
wherein an upper surface of the second metal bonder is disposed at a level between an upper surface and a bottom surface of the first light emitter,
wherein the first metal bonder of the first light emitter and the second metal bonder of the second light emitter include a same material, and
wherein a distance from the upper surface to a bottom surface of the second metal bonder of the second light emitter is different from a distance from an upper surface to a bottom surface of the first metal bonder of the first light emitter.
9. The light module of claim 8 , wherein the first light emitter and the second light emitter are configured to emit light of a same color.
10. The light module of claim 8 , wherein the first light emitter includes a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer.
11. The light module of claim 8 , wherein the plurality of metal bonders include at least one of Au, Sn, or In.
12. The light module of claim 8 , wherein a cross sectional area of the first metal bonder of the first light emitter is different from a cross sectional area of the second metal bonder of the second light emitter.
13. The light module of claim 8 , wherein each of the plurality of light emitters is configured to emit a light having a peak of at least one of a blue light, a green light, and a red light.
14. The light module of claim 8 , wherein a thickness of the first light emitter is substantially a same as a thickness of the second light emitter.
15. A light module, comprising:
a circuit board including first pads;
a first light emitter disposed on the circuit board and having a second pad;
a second light emitter disposed on the circuit board and having a third pad;
a first metal bonder electrically connecting one of the first pads and the second pad; and
a second metal bonder electrically connecting another one of the first pads and the third pad,
wherein an upper surface of the second metal bonder is disposed at a level between an upper surface and a bottom surface of the first light emitter,
wherein the first metal bonder and the second metal bonder include a same material, and
wherein a distance from an upper surface to a bottom surface of the first metal bonder is different from a distance from the upper surface to a bottom surface of the second metal bonder.
16. The light module of claim 15 , wherein the first light emitter includes a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer.
17. The light module of claim 15 , wherein the first metal bonder and the second metal bonder include at least one of Au, Sn, or In.
18. The light module of claim 15 , wherein a cross sectional area of the first metal bonder is different from a cross sectional area of the second metal bonder.
19. The light module of claim 15 , wherein first light emitter and the second light emitter are configured to emit a light having a peak of at least one of a blue light, a green light, and a red light.