IP Library Granted Patent US 12,568,796
Granted Patent B2
US 12,568,796 · App. 18/141,926 · Granted Mar 3, 2026

Semiconductor process equipment

Inventors: Bhaskar Prasad (Jamshedpur, IN); Kirankumar Neelasandra Savandaiah (Bangalore, IN); Thomas Brezoczky (Los Gatos, CA); Lakshmikanth Krishnamurthy Shirahatti (Bangalore, IN)
Assignee: Applied Materials, Inc.
H01L21/67709H01J37/32733H01L21/67201H01L21/677H01L21/67706H01L21/67712H01L21/6773H01L21/67742H01L21/67748H01L21/6838H01L21/68742H01L21/68785
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Quick Facts
Patent No.
US 12,568,796
App. No.
18/141,926
Granted
Mar 3, 2026
Kind
B2
Abstract

A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

Claims (37)

1 . A shutter station, comprising:

a housing including a transport region;

a first magnetic levitation assembly disposed in the transport region configured to levitate and propel a first carrier;

a shutter garage coupled to the housing;

an arm moveable from a first position to a second position, wherein a substrate supported on the arm is disposed in the shutter garage when the arm is in the first position; and

a pedestal disposed within the transport region and moveable to a transfer position to receive a shutter disk disposed on the arm in the second position, wherein the shutter disk is disposed above the pedestal when the arm is in the second position, and wherein the arm is disposed above the pedestal and below the first magnetic levitation assembly in the second position.

2 . The shutter station of claim 1 , the arm further comprising a recess configured to receive a plurality of lift pins coupled to the pedestal.

3 . The shutter station of claim 1 , further comprising:

a second magnetic levitation assembly disposed in the transport region configured to levitate and propel a second carrier, wherein the second magnetic levitation assembly is disposed below the first magnetic levitation assembly.

4 . The shutter station of claim 3 , wherein the arm is disposed below the second magnetic levitation assembly in the second position.

5 . The shutter station of claim 3 , wherein the first and second magnetic levitation assemblies each include at least one pair of magnetic rails.

6 . The shutter station of claim 1 , wherein the housing includes a process region, and the pedestal is moveable from the transfer position to a process position to place the shutter disk in the process region.

7 . A shutter station, comprising:

a housing including a transport region;

a first magnetic levitation assembly disposed in the transport region configured to levitate and propel a first carrier between a park position and a carrier transfer position; and

a shutter assembly, the shutter assembly including:

a shutter carriage including a first support member configured to support a first shutter disk;

an actuation assembly configured to move the shutter carriage within the housing, wherein:

the shutter carriage is configured to be lowered from a first position to a second position to place the first shutter disk in a first shutter transfer position above the first carrier; and

the shutter carriage is configured to be lowered from the second position to a third position while the first carrier is in the park position to engage the first shutter disk with the first carrier and to disengage the first shutter disk from the first support member.

8 . The shutter station of claim 7 , wherein the shutter carriage includes a second support member configured to support a second shutter disk, wherein the shutter carriage is moveable from the first position to a fourth position to place the second shutter disk in a second shutter transfer position above the first carrier; and

the shutter carriage is moveable from the fourth position to a fifth position while the first carrier is in the park position to engage the second shutter disk with a second carrier and to disengage the second shutter disk from the second support member.

9 . The shutter station of claim 8 , wherein the first and second support members are blades.

10 . The shutter station of claim 7 , wherein the first support member is sized to move within a recess of the first carrier without contacting the first carrier as the shutter carriage moves from the second position to the third position.

11 . The shutter station of claim 7 , wherein the first magnetic levitation assembly includes at least one pair of rails including a plurality of electromagnets.

12 . The shutter station of claim 7 , further comprising:

a second magnetic levitation assembly disposed in the transport region below the first magnetic levitation assembly, wherein the second magnetic levitation assembly is configured to levitate and propel a second carrier.

13 . The shutter station of claim 7 , wherein the shutter carriage is disposed in a shutter garage in the first position, and wherein the first carrier is conveyable underneath the shutter carriage by the first magnetic levitation assembly without contacting the shutter carriage while the shutter carriage is in the first position.

14 . The shutter station of claim 7 , wherein the first support member is disposed in a recess of the first carrier when the shutter carriage is in the second position.

15 . A method of transferring a shutter to a carrier, comprising:

moving an arm with a shutter disk disposed thereon from a first position to a second position to place the shutter disk above a pedestal;

extending a plurality of lift pins coupled to the pedestal into a recess of the arm to engage the shutter disk and to disengage the shutter disk from the arm;

moving the arm to the first position after the shutter disk is disengaged from the arm; and

retracting the plurality of lift pins to engage the shutter disk with the carrier levitated above a magnetic levitation assembly, wherein the arm is positioned above the pedestal and below the magnetic levitation assembly when in the second position.

16 . The method of claim 15 , wherein the carrier is moved from a park position to a carrier transfer position by the magnetic levitation assembly to position the carrier underneath the shutter disk prior to retracting the plurality of lift pins.

17 . The method of claim 15 , wherein a plurality of support members of the carrier are extended between the shutter disk and the pedestal prior to retracting the plurality of lift pins.

18 . The method of claim 17 , wherein the retracting the plurality of lift pins engages the shutter disk with the plurality of support members.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 18, 2023
From: PRASAD, BHASKAR; SAVANDAIAH, KIRANKUMAR NEELASANDRA; BREZOCZKY, THOMAS; SHIRAHATTI, LAKSHMIKANTH KRISHNAMURTHY
To: APPLIED MATERIALS, INC.
Reel/Frame 063683/0095 →
Continuity (2)
Provisional Application 63423350 · Nov 7, 2022
Related Publication 20240153801A1 · May 9, 2024
References Cited (136)
US 5180048A · Kawada et al. · 1993 [cited by applicant]
US 5569350A · Osada et al. · 1996 [cited by applicant]
US 5641054A · Mori · 1997 [cited by examiner]
US 6157106A · Tietz et al. · 2000 [cited by applicant]
US 6206176B1 · Blonigan et al. · 2001 [cited by applicant]
US 6231716B1 · White et al. · 2001 [cited by applicant]
US 7293950B2 · Bonora · 2007 [cited by examiner]
US 7438175B2 · White et al. · 2008 [cited by applicant]
US 7841820B2 · Bonora et al. · 2010 [cited by applicant]
US 7948122B2 · Compter et al. · 2011 [cited by applicant]
US 7964038B2 · Patalay et al. · 2011 [cited by applicant]
US 7994486B2 · Smick et al. · 2011 [cited by applicant]
US 8104951B2 · Aderhold et al. · 2012 [cited by applicant]
US 8851817B2 · Bonora et al. · 2014 [cited by applicant]
US 9390950B2 · Sorabji et al. · 2016 [cited by applicant]
US 9588443B2 · Shibazaki · 2017 [cited by applicant]
US 9964863B1 · Babayan et al. · 2018 [cited by applicant]
US 10204810B2 · Hoey et al. · 2019 [cited by applicant]
US 10236197B2 · Janakiraman et al. · 2019 [cited by applicant]
US 10256124B2 · Mooring · 2019 [cited by examiner]
US 10262887B2 · Hao et al. · 2019 [cited by applicant]
US 10283397B2 · Willwerth et al. · 2019 [cited by applicant]
US 10460977B2 · Breninger et al. · 2019 [cited by applicant]
US 10483141B2 · Janakiraman et al. · 2019 [cited by applicant]
US 10490436B2 · Ghosh et al. · 2019 [cited by applicant]
US 10734265B2 · Janakiraman et al. · 2020 [cited by applicant]
US 10770337B2 · Lee et al. · 2020 [cited by applicant]
US 10784142B2 · Marcelynas et al. · 2020 [cited by applicant]
US 10851453B2 · Tsai et al. · 2020 [cited by applicant]
US 10892180B2 · Chia et al. · 2021 [cited by applicant]
US 11232965B2 · Newman et al. · 2022 [cited by applicant]
US 11377310B2 · Aust et al. · 2022 [cited by applicant]
US 11508595B2 · Aust et al. · 2022 [cited by applicant]
US 11527424B2 · Berger et al. · 2022 [cited by applicant]
US 20020018842A1 · Dunlow · 2002 [cited by applicant]
US 20020034883A1 · Klein et al. · 2002 [cited by applicant]
US 20020108842A1 · Bonora et al. · 2002 [cited by applicant]
US 20030178145A1 · Anderson et al. · 2003 [cited by applicant]
US 20030219977A1 · Pomarede et al. · 2003 [cited by applicant]
US 20040005211A1 · Lowrance et al. · 2004 [cited by applicant]
US 20040023495A1 · Butterfield et al. · 2004 [cited by applicant]
US 20040058293A1 · Nguyen et al. · 2004 [cited by applicant]
US 20040255442A1 · McDiarmid et al. · 2004 [cited by applicant]
US 20060102078A1 · Fairbairn et al. · 2006 [cited by applicant]
US 20060156981A1 · Fondurulia et al. · 2006 [cited by applicant]
US 20060283688A1 · Blonigan · 2006 [cited by examiner]
US 20070009652A1 · Manz · 2007 [cited by examiner]
US 20070160507A1 · Satoh et al. · 2007 [cited by applicant]
US 20070269297A1 · Meulen et al. · 2007 [cited by applicant]
US 20080175694A1 · Park et al. · 2008 [cited by applicant]
US 20080232947A1 · van der Meulen et al. · 2008 [cited by applicant]
US 20080266037A1 · Williams · 2008 [cited by applicant]
US 20090314211A1 · Du Bois et al. · 2009 [cited by applicant]
US 20100062592A1 · Clark · 2010 [cited by applicant]
US 20100136773A1 · Akae et al. · 2010 [cited by applicant]
US 20100226737A1 · Sakaue et al. · 2010 [cited by applicant]
US 20110312189A1 · Kim et al. · 2011 [cited by applicant]
US 20120109355A1 · Baccini et al. · 2012 [cited by applicant]
US 20120213614A1 · Bonora et al. · 2012 [cited by applicant]
US 20120249291A1 · Holcomb et al. · 2012 [cited by applicant]
US 20130171757A1 · Ponnekanti et al. · 2013 [cited by applicant]
US 20140020629A1 · Tsai et al. · 2014 [cited by applicant]
US 20150114823A1 · Lee et al. · 2015 [cited by applicant]
US 20170250379A1 · Verplancken · 2017 [cited by examiner]
US 20170331359A1 · Paweletz · 2017 [cited by examiner]
US 20180339816A1 · Oldendorf et al. · 2018 [cited by applicant]
US 20180374732A1 · Klein et al. · 2018 [cited by applicant]
US 20190348264A1 · Tsai et al. · 2019 [cited by applicant]
US 20200026060A1 · Takato · 2020 [cited by applicant]
US 20200232088A1 · White et al. · 2020 [cited by applicant]
US 20200262060A1 · Hosek et al. · 2020 [cited by applicant]
US 20200262660A1 · Hosek et al. · 2020 [cited by applicant]
US 20200381276A1 · Yedla et al. · 2020 [cited by applicant]
US 20210024929A1 · Yokota et al. · 2021 [cited by applicant]
US 20210249291A1 · Raatz · 2021 [cited by examiner]
US 20210265188A1 · Moura · 2021 [cited by examiner]
US 20210296150A1 · Berger et al. · 2021 [cited by applicant]
US 20210328146A1 · Heymanns et al. · 2021 [cited by applicant]
US 20210354934A1 · Aust et al. · 2021 [cited by applicant]
US 20220003718A1 · Watanabe · 2022 [cited by applicant]
US 20220013383A1 · Savandaiah et al. · 2022 [cited by applicant]
US 20220037181A1 · Hatano et al. · 2022 [cited by applicant]
US 20220130700A1 · Newman et al. · 2022 [cited by applicant]
US 20220208426A1 · Aust et al. · 2022 [cited by applicant]
US 20220285179A1 · Chung · 2022 [cited by examiner]
US 20220293451A1 · Sulyman et al. · 2022 [cited by applicant]
US 20220293452A1 · Sulyman et al. · 2022 [cited by applicant]
US 20220301921A1 · Shindo · 2022 [cited by examiner]
US 20220336258A1 · Srivastava et al. · 2022 [cited by applicant]
US 20220393618A1 · Aust et al. · 2022 [cited by applicant]
US 20220415635A1 · Yedla et al. · 2022 [cited by applicant]
US 20220415687A1 · Hatano et al. · 2022 [cited by applicant]
US 20220415688A1 · Hatano et al. · 2022 [cited by applicant]
US 20230055201A1 · Ehmann · 2023 [cited by examiner]
US 20230085667A1 · Hudgens · 2023 [cited by examiner]
US 20230132174A1 · Thanu et al. · 2023 [cited by applicant]
US 20240153803A1 · Prasad · 2024 [cited by examiner]
US 20240363382A1 · Oldendorf · 2024 [cited by examiner]
CN 101158852A · 2008 [cited by applicant]
CN 111321377A · 2020 [cited by applicant]
CN 113707585A · 2021 [cited by applicant]
DE 102018006259A1 · 2019 [cited by applicant]
EP 1681261A1 · 2006 [cited by applicant]
EP 4222779A1 · 2023 [cited by applicant]
JP 62121134A · 1987 [cited by applicant]
JP H06324297A · 1994 [cited by applicant]
KR 1020210081597A · 2021 [cited by applicant]
KR 1020220099611A · 2022 [cited by applicant]
TW 202141675A · 2021 [cited by applicant]
WO 2008077048A2 · 2008 [cited by applicant]
WO 2011102410A1 · 2011 [cited by applicant]
WO 2015007385A1 · 2015 [cited by applicant]
WO 2015043712A1 · 2015 [cited by applicant]
WO 2015140155A1 · 2015 [cited by applicant]
WO 2015158725A1 · 2015 [cited by applicant]
WO 2015162177A1 · 2015 [cited by applicant]
WO 2015189263A1 · 2015 [cited by applicant]
WO 2016162288A1 · 2016 [cited by applicant]
WO 2019037858A1 · 2019 [cited by applicant]
WO 2019052657A1 · 2019 [cited by applicant]
WO 2019145035A1 · 2019 [cited by applicant]
WO 2019238416A1 · 2019 [cited by applicant]
WO 2020126040A1 · 2020 [cited by applicant]
WO 2020192911A1 · 2020 [cited by applicant]
WO 2021106796A1 · 2021 [cited by applicant]
WO 2021106799A1 · 2021 [cited by applicant]
WO 2021223843A1 · 2021 [cited by applicant]
WO 2022044834A1 · 2022 [cited by applicant]
WO 2022072075A1 · 2022 [cited by applicant]
U.S. Appl. No. 18/081,493, filed Dec. 14, 2022. [cited by applicant]
International Search Report/ Written Opinion issued to PCT/US2023/079455 on Mar. 6, 2024. [cited by applicant]
Yu et al.; Controller design and implementation of six-degree-of-freedom magnetically levitated positioning system with high precision; Proc. IMechE vol. 222 Part I: J. Systems and Control Engineering; 12 pages. [cited by applicant]
Zhu et al; Design and Control of a Six Degrees-of-Freedom Magnetically Levitated Positioning System; IFAC PapersOnLine 49-21 (2016) pp. 127-132. [cited by applicant]
Temposonics; Sensor Selector Guide; Retrieved from the Internet at: <https://www.temposonics.com/docs/temposonicslibraries/literature/sensor_selector_guide_industrial_551814_en.pdf?sfvrsn=5fde8874_12>; 21 pages. [cited by applicant]
Linear Motion Tips; How do Magnettostrictive sensors work ?; Retrieved from the Internet at: <https://www.linearmotiontips.com/how-do-magnetostrictive-sensors-work/> 9 Pages. [cited by applicant]
International Search Report and Written Opinion in related application PCT/US2023/035709 dated Feb. 5, 2024. [cited by applicant]