Measurement apparatus, lithography apparatus, and method of manufacturing article
The present invention provides a measurement apparatus that measures a position of an object, comprising: a detector configured to irradiate a measurement target point of the object with light having a plurality of wavelengths, and detect a position of the measurement target point based on the light reflected by the measurement target point; and a processor configured to determine the position of the object based on a detection result of the detector, wherein the detection result includes an error represented by a waveform in which an amplitude cyclically changes in accordance with a distance between the detector and the object, and wherein the processor is configured to cause the detector to detect the position of the measurement target point at the distance at which the amplitude in the waveform of the error falls within an allowable range.
1 . A measurement apparatus that measures a position of an object, comprising:
a detector configured to irradiate a measurement target point of the object with light having a plurality of wavelengths, and detect a position of the measurement target point based on the light reflected by the measurement target point; and
a processor configured to determine the position of the object based on a detection result of the detector,
wherein the detection result includes a combined error represented by a waveform formed by a combination of cyclic errors derived from the plurality of wavelengths of the light,
wherein an amplitude of the waveform representing the combined error cyclically changes, due to interaction of the cyclic errors derived from the plurality of wavelengths of the light, in accordance with a distance between the detector and the object, and
wherein the processor is configured to cause the detector to detect the position of the measurement target point of the object at the distance at which the amplitude of the combined error in the waveform formed by the combination of the cyclic errors derived from the plurality of wavelengths of the light falls within an allowable range.
2 . The apparatus according to claim 1 , wherein the processor is configured to determine a target distance between the detector and the object such that the amplitude in the waveform of the combined error falls within the allowable range, and cause the detector to detect the position of the measurement target point at the target distance.
3 . The apparatus according to claim 2 , wherein the processor is configured to obtain, while changing a section for extracting a part of the waveform of the combined error, an index value indicating a magnitude of the combined error for each section to generate information indicating a relationship between the distance and the index value, and determine the target distance based on the information.
4 . The apparatus according to claim 3 , wherein the processor is configured to obtain, as the index value, a difference between a maximum value and a minimum value of the combined error in the section.
5 . The apparatus according to claim 3 , wherein the processor is configured to obtain, as the index value, a standard deviation of the combined error in the section.
6 . The apparatus according to claim 3 , wherein the processor is configured to obtain, as the index value, an amplitude obtained by approximating the waveform of the combined error in the section with a sine wave.
7 . The apparatus according to claim 1 , wherein the processor is configured to obtain n detection results (n≥2) by causing the detector to detect the position of the measurement target point in each of a plurality of states in which the distances are different from each other by 1/n of a period of the waveform of the combined error, and determine the position of the object based on the n detection results.
8 . A lithography apparatus that forms a pattern on a substrate, comprising:
a measurement apparatus defined in claim 1 that measures a position of an object; and
a controller configured to control, based on a measurement result of the measurement apparatus, formation of the pattern on the substrate,
wherein the measurement apparatus measures, as the position of the object, a position of the substrate and/or a position of an original including a pattern to be transferred to the substrate.
9 . A method of manufacturing an article, the method comprising:
measuring a position of an object by using a measurement apparatus according to claim 1 ;
processing the object based on a result of measuring the position of the object, to manufacture the article.