IP Library › Granted Patent US 12,604,652
Granted Patent B2
US 12,604,652 · App. 18/270,757 · Granted Apr 14, 2026

Method for manufacturing display device, display device, display module, and electronic device

Inventors: Shunpei Yamazaki (Setagaya, JP); Takayuki Ikeda (Atsugi, JP); Kenichi Okazaki (Atsugi, JP); Yasumasa Yamane (Atsugi, JP); Hajime Kimura (Atsugi, JP); Tatsuya Onuki (Atsugi, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H10K71/231H10K50/19H10K59/353H10K71/166H10K71/60H10K59/131H10K59/871H10K59/8722H10K59/8723H10K59/873
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Quick Facts
Patent No.
US 12,604,652
App. No.
18/270,757
Granted
Apr 14, 2026
Kind
B2
Abstract

A high-resolution or high-definition display device is provided. The display device is manufactured by forming a first pixel electrode and a second pixel electrode; forming a first layer over the first pixel electrode and the second pixel electrode; forming a first sacrificial layer over the first layer; processing the first layer and the first sacrificial layer to expose at least part of the second pixel electrode; forming a second layer over the first pixel electrode and the second pixel electrode; forming a second sacrificial layer over the second layer; processing the second layer and the second sacrificial layer to expose at least part of the first sacrificial layer; removing the first sacrificial layer and the second sacrificial layer; forming a third layer over the first pixel electrode and the second pixel electrode; forming a counter electrode over the third layer; and processing the third layer and the counter electrode to remove at least part of each of the third layer and the counter electrode included in a region between the first pixel electrode and the second pixel electrode in a top view.

Claims (86)

1 . A method for manufacturing a display device, comprising:

forming a first pixel electrode and a second pixel electrode;

forming a first layer over the first pixel electrode and the second pixel electrode;

forming a first sacrificial layer over the first layer;

processing the first layer and the first sacrificial layer to expose at least part of the second pixel electrode;

forming a second layer over the first pixel electrode and the second pixel electrode;

forming a second sacrificial layer over the second layer;

processing the second layer and the second sacrificial layer to expose at least part of the first sacrificial layer;

removing the first sacrificial layer and the second sacrificial layer;

forming a third layer over the first pixel electrode and the second pixel electrode;

forming a counter electrode over the third layer; and

processing the third layer and the counter electrode to remove at least part of each of the third layer and the counter electrode included in a region between the first pixel electrode and the second pixel electrode in a top view.

2 . The method for manufacturing a display device, according to claim 1 , further comprising:

forming a protective layer over the counter electrode after the processing of the third layer and the counter electrode.

3 . The method for manufacturing a display device, according to claim 2 ,

wherein as the protective layer, a first protective layer is formed by a first deposition method and a second protective layer is formed by a second deposition method, and

wherein the first deposition method is a deposition method that allows a film to be formed at higher coverage than the second deposition method.

4 . The method for manufacturing a display device, according to claim 1 , further comprising:

forming an insulating layer covering an end portion of the first pixel electrode and an end portion of the second pixel electrode before the formation of the first layer; and

exposing at least part of the insulating layer in the step of processing the third layer and the counter electrode.

5 . The method for manufacturing a display device, according to claim 1 , further comprising:

forming a first resist mask over the first sacrificial layer so as to overlap with the first pixel electrode;

using the first resist mask in the processing of the first layer and the first sacrificial layer;

forming a second resist mask over the second sacrificial layer so as to overlap with the second pixel electrode; and

using the second resist mask in the processing of the second layer and the second sacrificial layer.

6 . The method for manufacturing a display device, according to claim 1 , further comprising:

forming a third resist mask over the counter electrode, the third resist mask comprising an opening in the region between the first pixel electrode and the second pixel electrode in the top view; and

using the third resist mask in the processing of the third layer and the counter electrode.

7 . The method for manufacturing a display device, according to claim 1 , further comprising:

forming a third resist mask over the counter electrode, the third resist mask comprising a first part overlapping with the first pixel electrode and a second part overlapping with the second pixel electrode and apart from the first part; and

using the third resist mask in the processing of the third layer and the counter electrode.

8 . A method for manufacturing a display device, comprising:

forming a plurality of first pixel electrodes aligned in a first direction and a plurality of second pixel electrodes aligned in the first direction, the plurality of first pixel electrodes and the plurality of second pixel electrodes being aligned in a second direction;

forming a first layer over the plurality of first pixel electrodes and the plurality of second pixel electrodes;

forming a first sacrificial layer over the first layer;

processing the first layer and the first sacrificial layer to expose at least part of each of the plurality of second pixel electrodes;

forming a second layer over the plurality of first pixel electrodes and the plurality of second pixel electrodes;

forming a second sacrificial layer over the second layer;

processing the second layer and the second sacrificial layer to expose at least part of the first sacrificial layer;

removing the first sacrificial layer and the second sacrificial layer;

forming a third layer over the plurality of first pixel electrodes and the plurality of second pixel electrodes;

forming a counter electrode over the third layer;

processing the third layer and the counter electrode to remove at least part of each of the third layer and the counter electrode included in a region between the first pixel electrode and the second pixel electrode in a top view;

forming a protective layer over the counter electrode;

processing the protective layer to expose at least part of the counter electrode included in a region between the plurality of first pixel electrodes and a region between the plurality of second pixel electrodes in the top view; and

forming a conductive layer over the counter electrode and the protective layer.

9 . The method for manufacturing a display device, according to claim 8 ,

wherein as the protective layer, a first protective layer is formed by a first deposition method and a second protective layer is formed by a second deposition method, and

wherein the first deposition method is a deposition method that allows a film to be formed at higher coverage than the second deposition method.

10 . The method for manufacturing a display device, according to claim 8 , further comprising:

forming an insulating layer covering end portions of the plurality of first pixel electrodes and end portions of the plurality of second pixel electrodes before the formation of the first layer; and

exposing at least part of the insulating layer in the step of processing the third layer and the counter electrode.

11 . The method for manufacturing a display device, according to claim 8 , further comprising:

forming a first resist mask over the first sacrificial layer so as to overlap with the first pixel electrode;

using the first resist mask in the processing of the first layer and the first sacrificial layer;

forming a second resist mask over the second sacrificial layer so as to overlap with the second pixel electrode; and

using the second resist mask in the processing of the second layer and the second sacrificial layer.

12 . The method for manufacturing a display device, according to claim 8 , further comprising:

forming a third resist mask over the counter electrode, the third resist mask comprising an opening in the region between the first pixel electrode and the second pixel electrode in the top view; and

using the third resist mask in the processing of the third layer and the counter electrode.

13 . The method for manufacturing a display device, according to claim 8 , further comprising:

forming a third resist mask over the counter electrode, the third resist mask comprising a first part overlapping with the plurality of first pixel electrodes and a second part overlapping with the plurality of second pixel electrodes and apart from the first part; and

using the third resist mask in the processing of the third layer and the counter electrode.

14 . The method for manufacturing a display device, according to claim 8 , further comprising:

forming a fourth resist mask over the protective layer, the fourth resist mask comprising an opening in the region between the plurality of first pixel electrodes and the region between the plurality of second pixel electrodes in the top view; and

using the fourth resist mask in the processing of the protective layer.

15 . The method for manufacturing a display device, according to claim 8 , further comprising:

forming a fourth resist mask over the protective layer, the fourth resist mask comprising a third part overlapping with at least one of the plurality of first pixel electrodes and at least part of the plurality of second pixel electrodes and a fourth part overlapping with at least one of the other first pixel electrodes and at least one of the other second pixel electrodes and apart from the third part, and

using the fourth resist mask in the processing of the protective layer.

16 . A display device comprising:

a plurality of first light-emitting devices and a plurality of second light-emitting devices;

a protective layer over the plurality of first light-emitting devices and the plurality of second light-emitting devices; and

a conductive layer over the protective layer,

wherein the first light-emitting devices each include a first pixel electrode, a first layer over the first pixel electrode, a third layer over the first layer, and a counter electrode over the third layer,

wherein the second light-emitting devices each include a second pixel electrode, a second layer over the second pixel electrode, the third layer over the second layer, and the counter electrode over the third layer,

wherein the first light-emitting devices and the second light-emitting devices are configured to emit light of different colors,

wherein a region between the first pixel electrode and the second pixel electrode in a top view includes a first part where the third layer and the counter electrode are not provided,

wherein the third layer and the counter electrode are shared by the plurality of first light-emitting devices,

wherein the third layer and the counter electrode are shared by the plurality of second light-emitting devices,

wherein a region between two first pixel electrodes and a region between two second pixel electrodes in the top view each include a second part where the protective layer is not provided, and

wherein in the second part, the counter electrode and the conductive layer are electrically connected to each other.

17 . The display device according to claim 16 ,

wherein a space surrounded by the protective layer is included between the first light-emitting device and the second light-emitting device.

18 . The display device according to claim 16 ,

wherein the protective layer includes a first protective layer over the counter electrode and a second protective layer over the first protective layer, and

wherein a space surrounded by the first protective layer and the second protective layer is included between the first light-emitting device and the second light-emitting device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 3, 2023
From: YAMAZAKI, SHUNPEI; IKEDA, TAKAYUKI; OKAZAKI, KENICHI; YAMANE, YASUMASA; KIMURA, HAJIME; ONUKI, TATSUYA
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 064138/0660 →
Priority Claims (2)
JP 2021-004494 · Jan 14, 2021 · national
JP 2021-004495 · Jan 14, 2021 · national
Continuity (1)
Related Publication 20240057428A1 · Feb 15, 2024
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