Hybrid Fin-dielectric semiconductor device
The present disclosure relates to a semiconductor device with a hybrid fin-dielectric region. The semiconductor device includes a substrate, a source region and a drain region laterally separated by a hybrid fin-dielectric (HFD) region. A gate electrode is disposed above the HFD region and the HFD region includes a plurality of fins covered by a dielectric and separated from the source region and the drain region by the dielectric.
1 . A transistor comprising:
a substrate;
a source region and a drain region laterally separated by a hybrid fin-dielectric (HFD) region; and
a gate electrode disposed above the HFD region, wherein the HFD region comprises a plurality of fins covered by a dielectric and separated from the source region and the drain region by the dielectric, wherein the plurality of fins comprise first fins, second fins, and third fins, wherein the first and second fins comprise a different material relative to the third fins.
2 . The transistor of claim 1 , wherein a top surface of the HFD region is vertically offset below a bottom surface of the gate electrode.
3 . The transistor of claim 2 , wherein a gate dielectric is disposed between the HFD region and the gate electrode.
4 . The transistor of claim 3 , wherein the dielectric extends over the plurality of fins, and the dielectric separates the plurality of fins from the gate dielectric.
5 . The transistor of claim 1 , further comprising a lightly doped source (LDS) region disposed under the source region and a lightly doped drain (LDD) region disposed under the drain region.
6 . The transistor of claim 5 , wherein the HFD region and the substrate separate the LDS region from the LDD region.
7 . The transistor of claim 5 , wherein the LDS region and LDD region extend along a bottom surface of the HFD region.
8 . The transistor of claim 7 , wherein a channel region extends through the LDS region, the substrate directly below the HFD region, and through the LDD region.
9 . The transistor of claim 5 , wherein the LDS region and LDD region are doped differently from the substrate, and wherein the first fins extend from the LDD region, the second fins extend from the LDS region, and the third fins extending from the substrate.
10 . The transistor of claim 9 , wherein the first fins comprise a material of the LDD region, the second fins comprise a material of the LDS region, and the third fins comprise a material of the substrate.
11 . A semiconductor device comprising:
a gate electrode disposed over a substrate;
a source region and a drain region disposed on opposite sides of the gate electrode, and a shallow trench isolation (STI) structure disposed within the substrate surrounding the source region and the drain region; and
a hybrid fin-dielectric (HFD) region disposed in the substrate underneath the gate electrode, wherein the HFD region comprises fins separated and isolated from the source region and the drain region by a dielectric; and
wherein the source region and the drain region separate the HFD region from the STI structure in a first direction, and wherein the STI structure extends along opposing sides of the HFD region contacting opposing ends of each of the fins in a second direction perpendicular to the first direction.
12 . The semiconductor device of claim 11 , wherein the dielectric of the HFD region extends past outer edges of the gate electrode in the first direction.
13 . The semiconductor device of claim 11 , wherein the HFD region extends past outer edges of the gate electrode in the first direction.
14 . The semiconductor device of claim 11 , wherein the HFD region is vertically separated below a bottommost surface of the gate electrode, and a first device comprises the HFD region, gate electrode, source region, and drain region; and
the first device is laterally offset from a second device comprising a fin between a source and drain region of the second device, wherein the fin extends above the substrate and above a bottom surface of a gate electrode of the second device.
15 . The semiconductor device of claim 11 , wherein the fins extend continuously between inner neighboring edges of the source region to the drain region in the first direction, and the fins are separated from one another by the dielectric in the second direction.
16 . The semiconductor device of claim 15 , wherein the fins are separated from one another by the dielectric in the first direction, and the fins are further separated from the source region and the drain region by the dielectric in the first direction; and
the fins extend continuously between outer edges of the source region and drain region in the second direction.
17 . The semiconductor device of claim 11 , wherein the fins comprise first fins and second fins, and a fin width of one of the first fins is different from a fin width of one of the second fins.
18 . The semiconductor device of claim 11 , wherein the gate electrode extends parallel to and past outer edges of the fins in the second direction, and further extends over the STI structure.
19 . A method of forming a semiconductor structure, comprising:
forming a shallow trench isolation (STI) structure within a substrate;
forming a first mask over the substrate where the first mask is formed with openings that extend through the first mask;
removing the substrate through the openings of the first mask to form fins from the substrate between nearest neighboring sidewalls of the STI structure, and removing the first mask;
forming a second mask over the substrate with an opening aligned over the fins;
forming a dielectric between the fins, and removing the second mask wherein the fins and the dielectric form a hybrid fin-dielectric (HFD) region;
forming a source region and drain region between the HFD region and the STI structure, wherein the source and drain regions are spaced apart from the fins by the dielectric; and
forming a gate electrode over the HFD region.
20 . The method of claim 19 , further comprising:
forming a photoresist over the substrate, wherein the photoresist is patterned;
implanting a first doping type into the substrate between neighboring edges of the STI structure to form a lightly doped source (LDS) region and a lightly doped drain (LDD) region; and
forming the first mask over the substrate and the LDS region and the LDD region.