Intraluminal imaging devices with a reduced number of signal channels
An imaging assembly for an intraluminal imaging device is provided. In one embodiment, the imaging assembly includes an imaging array positioned at a distal portion of the intraluminal imaging device. The imaging array may have a plurality of imaging elements arranged into subarrays. The imaging assembly also may include a micro-beam-former integrated circuit (IC) coupled to the imaging array at the distal portion of the intraluminal imaging device. The micro-beam-former IC includes a plurality of microchannels that may separately beam-form signals received from imaging elements of at least two subarrays. The imaging assembly further includes two or more signal lines that may couple to the micro beam-former IC. Each signal line may correspond to a specific subarray and may receive the beam-formed signals specific to corresponding subarray.
1 . An apparatus, comprising:
an intracardiac echocardiography (ICE) catheter comprising:
a flexible elongate member sized and shaped to be advanced through a blood vessel, wherein the flexible elongate member comprises a proximal portion, a distal portion, and a diameter;
an imaging assembly positioned at the distal portion and comprising:
an ultrasound transducer array comprising a plurality of transducer elements and configured to generate imaging signals;
an integrated circuit (IC) configured to receive the imaging signals, perform beamforming of the imaging signals, and output beamformed signals; and
a plurality of cables extending within the flexible elongate member and comprising a plurality of signal lines, at least one power line, and at least one control line;
a first type of electrical connection between the ultrasound transducer array and the IC configured to carry the imaging signals corresponding to a quantity of the plurality transducer elements before the beamforming is performed, wherein the first type of electrical connection comprises flip-chip mounting;
a second type of electrical connection between the imaging assembly and the plurality of cables configured to carry the beamformed signals corresponding to less than the quantity of the plurality of transducer elements after the beamforming is performed,
wherein a quantity of the plurality of cables is less than the quantity of the plurality of transducer elements.
2 . The apparatus of claim 1 , wherein the ultrasound transducer array is positioned directly on top of the IC.
3 . The apparatus of claim 2 ,
wherein the IC comprises transmitters and receivers, and
wherein the first type of electrical connection is configured to establish direct communication between the plurality of transducer elements and the transmitters and the receivers.
4 . The apparatus of claim 1 , wherein the ultrasound transducer array comprises a two-dimensional, rectangular array extending in a long dimension and a short dimension.
5 . The apparatus of claim 1 , wherein the imaging assembly further comprises:
an interposer; and
a third type of electrical connection between the interposer and the IC configured to carry the beamformed signals corresponding to less than the quantity of the plurality of transducer elements after the beamforming is performed, wherein the third type of electrical connection comprises wire bonding.
6 . The apparatus of claim 5 , wherein the wire bonding is positioned at the distal portion of the interposer.
7 . The apparatus of claim 5 ,
wherein the second type of electrical connection comprises soldering between the interposer and the plurality of cables,
wherein the soldering is positioned at the proximal portion of the interposer.
8 . The apparatus of claim 1 ,
wherein the quantity of the plurality of transducer elements comprises more than 800 transducer elements and less than 1000 transducer elements, and
wherein the quantity of the plurality of cables comprises more than 16 cables and less than 30 cables.
9 . The apparatus of claim 1 , wherein the imaging assembly further comprises capacitors configured to provide at least one of noise decoupling or storage for energy supplied by the at least one power line.
10 . The apparatus of claim 1 ,
wherein the plurality of signal lines is configured to carry imaging signals generated by the ultrasound transducer array,
wherein the at least one power line is configured to supply energy to at least one of the ultrasound transducer array or the IC, and
wherein the at least one control line is configured to communicate control signals to the IC.
11 . The apparatus of claim 1 , further comprising a processor configured for communication with the ICE catheter and configured to generate ultrasound images of a heart.
12 . The apparatus of claim 1 , wherein an entirety of the imaging assembly is fit inside a diameter of the ICE catheter.