IP Library › Granted Patent US 12,620,437
Granted Patent B2
US 12,620,437 · App. 18/407,338 · Granted May 5, 2026

Memory device, assist cell and double assist cell for a memory device

Inventors: Wolfgang Penth (Holzgerlingen, DE); Jan Niklas Stegmaier (Sindelfingen, DE); Rolf Sautter (Bondorf, DE); Silke Penth (Holzgerlingen, DE)
Assignee: International Business Machines Corporation
G11C11/419G11C11/418
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Quick Facts
Patent No.
US 12,620,437
App. No.
18/407,338
Granted
May 5, 2026
Kind
B2
Abstract

A memory device comprising at least one memory bank is provided and comprises a two-dimensional array of memory cells, a plurality of local bit lines connecting all memory cells in a first dimension of the two-dimensional array, a plurality of word lines connecting all memory cells in a second dimension of the two-dimensional array. The memory device further comprises at least one array of assist cells per memory bank, each array having one shared sense line and being arranged along memory cells and connected to by a bit line. The assist cells are configured as modified memory cells with a common sense line to provide a sense amplifier functionality. An assist cell and a double assist cell for a memory device are also provided.

Claims (28)

1 . A memory device, comprising:

at least one memory bank, including a two-dimensional array of memory cells;

a plurality of local bit lines connecting all memory cells in a first dimension of the two-dimensional array;

a plurality of word lines connecting all memory cells in a second dimension of the two-dimensional array;

at least one array of assist cells per memory bank, each array having one shared sense line and being arranged along memory cells and connected to by a bit line; and

wherein the assist cells are configured as modified memory cells with a common sense line to provide a sense amplifier functionality, and wherein in the assist cells two of at least six transistors of an assist memory cell that connect inner nodes of the memory cell with the local bit lines are short-circuited, in particular, are short-circuited via a wire connection of source and drain electrodes of the transistors.

2 . The memory device according to claim 1 , wherein the memory cells are static random access memory cells.

3 . The memory device according to claim 1 , wherein in assist cell gates of two of at least six transistors of the memory cell that connect the inner nodes of the memory cell with the local bit lines are connected to a power line.

4 . The memory device according to claim 1 , wherein a ground connection of a memory cell is replaced by the common sense line which can be controlled from outside of the memory bank to enable or disable the assist cell.

5 . The memory device according to claim 1 , further comprising a memory cell access circuitry, providing at least one multiplexer for the at least one memory bank per the first dimension associated with at least one local bit line of the at least one memory bank.

6 . The memory device according to claim 5 , wherein the at least one multiplexer transfers the local bit lines to global bit lines for output.

7 . The memory device according to claim 6 , wherein the transfer of the local bit lines to the global bit lines is driven by a local read enable line.

8 . The memory device according to claim 1 , wherein an input/output device is provided comprising output drivers for transferring global bit lines to output lines.

9 . The memory device according to claim 1 , wherein two memory banks are arranged in a double memory bank.

10 . The memory device according to claim 9 , further comprising a memory cell access circuitry, providing at least one multiplexer for the double memory bank per the first dimension associated with at least one local bit line of each of two neighboring memory banks in the double memory bank.

11 . The memory device according to claim 10 , wherein the at least one multiplexer transfers the local bit lines to global bit lines for output, in particular wherein the transfer of the local bit lines is driven by a local read enable line.

12 . The memory device according to claim 9 , wherein an input/output device is provided comprising output drivers for transferring global bit lines to output lines.

13 . The memory device according to claim 1 , wherein the assist cells in the array of assist cells are arranged pairwise as double assist cells.

14 . An assist cell for a memory device, being configured as a modified memory cell of the memory device with a common sense line to provide a sense amplifier functionality, wherein in the assist cell two of at least six transistors of a memory cell that connect inner nodes of the memory cell with local bit lines are short-circuited, in particular, are short-circuited via a wire connection of source and drain electrodes of the transistors.

15 . The assist cell according to claim 14 , wherein in the assist cell two of at least six transistors of a memory cell, that connect the inner nodes of the memory cell with the local bit lines, are short-circuited via a wire connection of the source and drain electrodes of the transistors:

wherein a ground connection of the memory cell is replaced by the common sense line, which can be controlled from outside of a memory bank, to enable or disable the assist cell.

16 . The assist cell according to claim 14 , wherein in assist cell gates of two of at least six transistors of the memory cell, that connect inner nodes of the assist cell with the local bit lines, are connected to a power line:

wherein a ground connection of the memory cell is replaced by a common sense line, which can be controlled from outside of a memory bank, to enable or disable the assist cell.

17 . A double assist cell for a memory device, being configured as two modified memory cells of the memory device with a common sense line to provide a function of a sense amplifier; and wherein in the double assist cell two of at least six transistors of a memory cell that connect inner nodes of the memory cell with local bit lines are short-circuited, in particular, are short-circuited via a wire connection of source and drain electrodes of the transistors.

18 . The double assist cell according to claim 17 , wherein in the double assist cell two of at least six transistors of a single memory cell that connect inner nodes of the single memory cell with local bit lines are short-circuited via a wire connection of source and drain electrodes of the transistors:

wherein a ground connection of the two memory cells is replaced by the common sense line which can be controlled from outside of a memory bank, to enable or disable the double assist cell.

19 . The double assist cell according to claim 17 , wherein in double assist cell gates of two of at least six transistors of a single memory cell that connect inner nodes of the single memory cell with local bit lines are connected to a power line:

wherein a ground connection of the two memory cells is replaced by a common sense line which can be controlled from outside of a memory bank, to enable or disable the double assist cell.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 8, 2024
From: PENTH, WOLFGANG; STEGMAIER, JAN NIKLAS; SAUTTER, ROLF; PENTH, SILKE
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 066056/0521 →
Priority Claims (1)
GB 2315196 · Oct 4, 2023 · national
Continuity (1)
Related Publication 20250118360A1 · Apr 10, 2025
References Cited (30)
US 10559352B2 · Shankar · 2020 [cited by applicant]
US 10978142B2 · Su · 2021 [cited by applicant]
US 11043262B2 · Madhavan · 2021 [cited by applicant]
US 11062766B2 · Siddiqui · 2021 [cited by applicant]
US 11211116B2 · Yang · 2021 [cited by applicant]
US 11605423B2 · Lim · 2023 [cited by applicant]
US 20030117874A1 · Lee · 2003 [cited by applicant]
US 20080112244A1 · Teramoto · 2008 [cited by applicant]
US 20080175088A1 · Choi · 2008 [cited by applicant]
US 20130039120A1 · Moriwaki · 2013 [cited by applicant]
US 20130083592A1 · Kang · 2013 [cited by applicant]
US 20130148415A1 · Shu · 2013 [cited by applicant]
US 20150138863A1 · Roy · 2015 [cited by applicant]
US 20150357032A1 · Tatsumura · 2015 [cited by applicant]
US 20160012868A1 · Moon · 2016 [cited by applicant]
US 20190267053A1 · Sreenivasula Reddy et al. · 2019 [cited by applicant]
US 20210158865A1 · Gupta · 2021 [cited by applicant]
US 20220139442A1 · Choi · 2022 [cited by examiner]
US 20220208239A1 · Pilo · 2022 [cited by applicant]
US 20230042652A1 · Bhavnagarwala · 2023 [cited by applicant]
US 20230069721A1 · Lin · 2023 [cited by examiner]
US 20230075959A1 · Liu · 2023 [cited by examiner]
US 20230122135A1 · Yang · 2023 [cited by applicant]
Lien, et al., “A 40 nm 512 kb Cross-Point 8 T Pipeline SRAM With Binary Word-Line Boosting Control, Ripple Bit-Line and Adaptive Data-Aware Write-Assist,” IEEE Transactions on Circuits and Systems I: Regular Papers, Dec… [cited by applicant]
Lu, et al., “A 0.33-V, 500-KHz, 3.94-μW 40-nm 72-Kb 9T Subthreshold SRAM With Ripple Bit-Line Structure and Negative Bit-Line Write-Assist,” IEEE Transactions on Circuits and Systems II: Express Briefs, Dec. 2012 [acces… [cited by applicant]
Nguyen, et al., “Rapido Testing and Modeling of Assisted Write and Read Operations for SRAMs,” 2016 IEEE 25th North Atlantic Test Workshop (NATW), May 2016 [accessed on Oct. 19, 2023], pp. 28-33, IEEE, DOI: 10.1109/NATW… [cited by applicant]
Patel, et al., “Body Biased Sense Amplifier With Auto-Offset Mitigation for Low-Voltage SRAMs,” IEEE Transactions on Circuits and Systems I: Regular Papers, Aug. 2021 [accessed on Oct. 19, 2023], pp. 3265-3278, vol. 68,… [cited by applicant]
Penth, et al., “Memory Device, Assist Cell and Double Assist Cell for a Memory Device,” Application and Drawings, Filed on Oct. 4, 2023, 32 Pages, Related GB Patent Application Serial No. 2315196.2, IBM Docket No. P2022… [cited by applicant]
Yokoyama, et al., “Disturbance Aware Dynamic Power Reduction in Synchronous 2RW Dual-Port 8T SRAM by Self-Adjusting Wordline Pulse Timing,” IEEE Journal of Solid-State Circuits, Jul. 2023 [accessed on Oct. 19, 2023], pp… [cited by applicant]
Intellectual Property Office, “Patents Act 1977: Search Report under Section 17(5),” IPO, Mar. 28, 2024, 5 pages, GB Application No. 2315196.2, IBM Ref. No. P202205190GB01. [cited by applicant]