Optoelectronic semiconductor component and production method
An optoelectronic semiconductor component includes at least one optoelectronic semiconductor chip, a plurality of lead frame parts, a casting body that mechanically connects the lead frame parts to one another so that a mounting carrier is formed on which the at least one optoelectronic semiconductor chip is mounted, and a plurality of metallizations, wherein the lead frame parts are each formed in one piece and comprise at least one through-plating region and at least one mounting region, the through-plating regions each penetrate the mounting carrier and the mounting regions project beyond the casting body, and the metallizations each start from at least one of the through-plating regions and extend directly onto the casting body laterally next to the at least one associated through-plating region.
1 . An optoelectronic semiconductor component comprising:
at least one optoelectronic semiconductor chip,
a plurality of lead frame parts,
a casting body that mechanically connects the lead frame parts to one another so that a mounting carrier is formed on which the at least one optoelectronic semiconductor chip is mounted,
a plurality of metallizations, and
electrical connection surfaces for external electrical contacting of the semiconductor component,
wherein
the lead frame parts are each formed in one piece and comprise at least one through-plating region and at least one mounting region,
the at least one through-plating region of each lead frame part penetrates the casting body and the at least one mounting region of each lead frame part projects beyond the casting body,
each metallization starts from at least one of the through-plating regions and extend directly onto the casting body laterally next to the at least one associated through-plating region,
the connection surfaces are formed by the mounting regions of the lead frame parts,
the mounting regions are each at least as large as the at least one associated through-plating region, seen in plan view of a contacting side of the semiconductor component, configured for external electrical connection of the connection surfaces, and
the mounting regions and the respectively associated metallizations are arranged congruently one above the other at the connection surfaces, seen in plan view of the contacting side.
2 . The optoelectronic semiconductor component according to claim 1 , further comprising:
a molded body made of a light-impermeable material,
the molded body being mounted on the mounting carrier and running all around the at least one optoelectronic semiconductor chip in a spaced manner so that a trough for the at least one optoelectronic semiconductor chip is formed by the molded body together with the mounting carrier.
3 . The optoelectronic semiconductor component according to claim 1 , wherein
the at least one optoelectronic semiconductor chip is mounted on one of the lead frame parts, and
a plurality of smaller lead frame parts is arranged around the largest lead frame part.
4 . The optoelectronic semiconductor component according to claim 1 , wherein the lead frame parts on a first main side of the mounting carrier and/or the metallizations on an opposite second main side of the mounting carrier form at least one electrical conductor track directly on the casting body, and
the respective metallizations having a single-layer or multilayer structure.
5 . The optoelectronic semiconductor component according to claim 4 , further comprising a plurality of the conductor tracks, wherein
a bonding wire is mounted on each of at least some of the conductor tracks, said bonding wire leading to another conductor track or to the at least one optoelectronic semiconductor chip.
6 . The optoelectronic semiconductor component according to claim 4 , further comprising a plurality of the conductor tracks, wherein at least two of the conductor tracks cross each other, as seen in plan view of the first main side.
7 . The optoelectronic semiconductor component according to claim 1 , wherein at least some of the metallizations have a base area larger by at least a factor of three than the at least one associated through-plating region.
8 . The optoelectronic semiconductor component according to claim 1 , further comprising:
at least one further lead frame part formed of only one mounting region and/or at least one further metallization
mounted on the casting body spaced apart from the lead frame parts.
9 . The optoelectronic semiconductor component according to claim 1 , wherein
at least one of the lead frame parts has:
a trench or double trench running around the at least one optoelectronic semiconductor chip,
a countersink on or under the at least one optoelectronic semiconductor chip,
a solder stop ring running around the at least one optoelectronic semiconductor chip, and/or
an electrically non-functional metal ring running around the at least one optoelectronic semiconductor chip.
10 . The optoelectronic semiconductor component according to claim 1 , further comprising:
a cover body applied to the mounting carrier and which touches the at least one optoelectronic semiconductor chip, wherein
the cover body is permeable to radiation to be generated and/or received by the at least one optoelectronic semiconductor chip.
11 . The optoelectronic semiconductor component according to claim 10 , wherein the cover body completely covers the at least one optoelectronic semiconductor chip.
12 . The optoelectronic semiconductor component according to claim 1 , wherein the at least one optoelectronic semiconductor chip forms part of an external upper surface of the semiconductor component.
13 . The optoelectronic semiconductor component according to claim 1 , wherein the metallization comprises a growth layer and a main layer thicker relative to the growth layer.
14 . The optoelectronic semiconductor component according to claim 1 , wherein
the at least one optoelectronic semiconductor chip is selected from the group consisting of light-emitting diode, laser diode and photosensor, and
the semiconductor component further comprises at least one drive chip for the at least one optoelectronic semiconductor chip so that the at least one drive chip is electrically connected to the at least one optoelectronic semiconductor chip.
15 . The optoelectronic semiconductor component according to claim 1 , further comprising a plurality of the optoelectronic semiconductor chips, wherein the casting body forms a plane-parallel plate.
16 . The optoelectronic semiconductor component according to claim 15 , wherein the molded body forms a plurality of troughs and the optoelectronic semiconductor chips are distributed among the troughs.
17 . A method of manufacturing optoelectronic semiconductor components according to claim 1 , comprising the following steps in order:
A) providing a carrier composite in which a plurality of the mounting carriers are combined, the casting body extending contiguously along all of the mounting carriers of the carrier composite,
B) applying the optoelectronic semiconductor chips so that each of the mounting carriers is provided with at least one optoelectronic semiconductor chip, and
D) dividing the carrier composite to form the semiconductor components.
18 . The method according to claim 17 ,
comprising between B) and D):
C) testing the optoelectronic semiconductor chips in the carrier composite, the optoelectronic semiconductor chips being individually electrically driven,
wherein the testing in C) comprises:
C1) determining first color locations of emissions of the optoelectronic semiconductor chips without phosphor bodies, and/or
C2) determining second color locations of emissions of the optoelectronic semiconductor chips during a creation of the phosphor bodies, and/or
C3) determining third color locations of emissions of the optoelectronic semiconductor chips with the finished phosphor bodies, and
wherein A) comprises:
A1) etching a metal sheet from one side, the metal sheet remaining a mechanical unit and the through-plating regions being formed,
A2) producing the casting body on the etched metal sheet by casting, and
A3) grinding the casting body so that the through-plating regions are exposed from excess material of the casting body.
19 . The method according to claim 17 ,
wherein
the carrier composite comprises, up to D), a plurality of component fields spaced apart from one another,
in the component fields, the mounting carriers are arranged close to one another and areas between the component fields are free of mounting carriers,
adjacent component fields are connected to one another by metallic connecting webs located on the contiguous casting body, and
the connecting webs have at least one branch and/or at least one meander.