Semiconductor package structure having antenna array
A semiconductor package structure is provided. The structure includes a package substrate having a first surface and a second surface opposite to the first surface and including a ground layer embedded therein. A semiconductor die is formed on the first surface of the package substrate and an antenna pattern layer is formed on the second surface of the package substrate and electrically coupled to the semiconductor die. The structure also includes a first connector and a second connector formed on the second surface of the package substrate and arranged adjacent to the antenna pattern layer. The first connector is electrically coupled to the semiconductor die and electrically isolated to the ground layer, and the second connector is electrically coupled to the ground layer. A wireless communication device including the semiconductor package structure is also provided.
1 . A semiconductor package structure, comprising:
a package substrate having a first surface and a second surface opposite to the first surface and comprising a ground layer embedded therein;
a semiconductor die formed on the first surface of the package substrate;
an antenna pattern layer formed on the second surface of the package substrate and electrically coupled to the semiconductor die;
a first connector and a second connector formed on the second surface of the package substrate and arranged adjacent to the antenna pattern layer, wherein the first connector is electrically coupled to the semiconductor die and electrically isolated to the ground layer, and the second connector is electrically coupled to the ground layer; and
a first conductive via extending from the second surface and passing through the ground layer; and
a second conductive via extending from the second surface onto the ground layer,
wherein the first conductive via and the second first conductive via are electrically coupled to the first connector and the second connector, respectively.
2 . The semiconductor package structure as claimed in claim 1 , wherein each of the first conductive via and the second conductive via comprises a dielectric material surrounded by a conductive layer.
3 . The semiconductor package structure as claimed in claim 1 , wherein each of the first connector and the second connector has a height in a range from about λ/100 to about λ/25, where λ is a wavelength of radio waves transmitted/received by the antenna pattern layer.
4 . The semiconductor package structure as claimed in claim 1 , wherein a minimum distance between a center of each of the first connector and the second connector and a line extending along an edge of one of the antenna pattern layer that faces the first connector and the second connector is in a range from about λ/35 to about λ/20, where λ is a wavelength of radio waves transmitted/received by the antenna pattern layer.
5 . The semiconductor package structure as claimed in claim 1 , further comprising:
a third connector formed on the first surface of the package substrate, wherein a size of the third connector is different than a size of the first and second connectors; and
an encapsulating layer enclosing the semiconductor die.
6 . A semiconductor package structure, comprising:
a package substrate having a first surface and a second surface opposite to the first surface and comprising a ground layer embedded therein;
a semiconductor die formed on the first surface of the package substrate;
a plurality of antenna pattern layers formed on the second surface of the package substrate and arranged in an array;
a plurality of first connectors and a plurality of second connectors formed on the second surface of the package substrate;
a plurality of first pads correspondingly bonded to the plurality of first connectors; and
a plurality of first conductive vias extending from the second surface and passing through the ground layer; and
a second plurality of conductive vias extending from the second surface onto the ground layer,
wherein the plurality of first conductive vias and the plurality of second first conductive vias are electrically coupled to the plurality of first connectors and the plurality of second connectors, respectively,
wherein the plurality of first connectors and the plurality of second connectors are arranged in a first line and on a first side of the array, and
wherein the plurality of first connectors is electrically isolated from the plurality of second connectors, and the plurality of second connectors is electrically coupled to the ground layer.
7 . The semiconductor package structure as claimed in claim 6 , further comprising a second pad bonded to each of the plurality of second connectors.
8 . The semiconductor package structure as claimed in claim 7 , further comprising:
a plurality of third connectors and a plurality of fourth connectors formed on the second surface of the package substrate, wherein the plurality of third connectors and the plurality of fourth connectors are arranged in a second line and on a second side of the array opposite to the first side thereof; and
a plurality of third pads correspondingly bonded to the plurality of third connectors and a fourth pad bonded to each of the plurality of fourth connectors,
wherein the plurality of third connectors is electrically isolated from the plurality of fourth connectors, and the plurality of fourth connectors is electrically coupled to the ground layer.
9 . The semiconductor package structure as claimed in claim 6 , further comprising a plurality of second pads correspondingly bonded to the plurality of second connectors.
10 . The semiconductor package structure as claimed in claim 9 , further comprising:
a plurality of third connectors formed on the second surface of the package substrate, wherein the plurality of third connectors is electrically coupled to the ground layer; and
a plurality of third pads correspondingly bonded to the plurality of third connectors, wherein the plurality of third connectors is arranged in a second line, between the array and the plurality of first connectors and between the array and the plurality of second connectors.
11 . The semiconductor package structure as claimed in claim 10 , wherein a minimum distance between a center of one of the plurality of third connectors and a line extending along an edge of one of the plurality of antenna pattern layers that faces the plurality of third connectors is in a range from about λ/35 to about λ/20, where λ is a wavelength of radio waves transmitted/received by the plurality of antenna pattern layers.
12 . The semiconductor package structure as claimed in claim 9 , further comprising:
a plurality of third connectors and a plurality of fourth connectors formed on the second surface of the package substrate, wherein the plurality of third connectors and the plurality of fourth connectors are arranged in a second line and on a second side of the array opposite to the first side of the array; and
a plurality of third pads correspondingly bonded to the plurality of third connectors and a plurality of fourth pads correspondingly bonded to the plurality of fourth connectors,
wherein the plurality of third connectors is electrically isolated from the plurality of fourth connectors, and the plurality of fourth connectors is electrically coupled to the ground layer.
13 . The semiconductor package structure as claimed in claim 12 wherein the plurality of first connectors and a plurality of second connectors are alternately arranged along the first line, and the plurality of third connectors and a plurality of fourth connectors are alternately arranged along the second line.
14 . The semiconductor package structure as claimed in claim 12 , further comprising:
a plurality of fifth connectors formed on the second surface of the package substrate, wherein the plurality of fifth connectors is electrically coupled to the ground layer;
a plurality of fifth pads correspondingly bonded to the plurality of fifth connectors, wherein the plurality of fifth connectors is arranged in a third line, between the array and the plurality of first connectors and between the array and the plurality of second connectors;
a plurality of sixth connectors formed on the second surface of the package substrate, wherein the plurality of sixth connectors is electrically coupled to the ground layer; and
a plurality of sixth pads correspondingly bonded to the plurality of sixth connectors, wherein the plurality of sixth connectors is arranged in a fourth line and between the array and the pluralities of third and fourth connectors.
15 . The semiconductor package structure as claimed in claim 6 , wherein each of the first connector and the second connector has a height in a range from about λ/100 to about λ/25, where λ is a wavelength of radio waves transmitted/received by the plurality of antenna pattern layers.
16 . The semiconductor package structure as claimed in claim 6 , further comprising:
a third connector formed on the first surface of the package substrate, wherein a size of the third connector is different than a size of the first and second connectors; and
an encapsulating layer enclosing the semiconductor die.