IP Library Granted Patent US 12,640,191
Granted Patent B2
US 12,640,191 · App. 18/421,741 · Granted May 26, 2026

Memory array with multiplexed digit lines

Inventors: Ferdinando Bedeschi (Biassono, IT); Stefan Frederik Schippers (Peschiera del Garda, IT)
Assignee: Micron Technology, Inc.
G11C11/4096G11C11/4085G11C11/4091H10B12/30H10B12/50G11C11/4087G11C11/565
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Quick Facts
Patent No.
US 12,640,191
App. No.
18/421,741
Granted
May 26, 2026
Kind
B2
Abstract

Methods, systems, and devices for a memory device with multiplexed digit lines are described. In some cases, a memory cell of the memory device may include a storage component and a selection component that includes two transistors. A first transistor may be coupled with a word line and a second transistor may be coupled with a select line to selectively couple the memory cell with a digit line. The selection component, in conjunction with a digit line multiplexing component, may support a sense component common to a set of digit lines. In some cases, the digit line of the set may be coupled with the sense component during a read operation, while the remaining digit lines of the set are isolated from the sense component.

Claims (45)

1 . A memory device, comprising:

a memory cell coupled with a digit line and a plate line, the memory cell comprising a storage component, a first transistor coupled with the storage component and the digit line, and a second transistor coupled with the storage component and the plate line;

a word line coupled with a gate of the first transistor and configured to selectively couple the storage component with the digit line;

a select line coupled with a gate of the second transistor and configured to selectively couple the storage component with the plate line;

a sense component configured to selectively couple with a plurality of digit lines comprising the digit line; and

a third transistor coupled with the select line and configured to selectively couple the digit line with the sense component during at least a portion of a read operation.

2 . The memory device of claim 1 , further comprising:

a second memory cell coupled with the word line and a second digit line of the plurality; and

a fourth transistor configured to selectively couple the second digit line of the plurality with the sense component, a gate of the fourth transistor coupled with a second select line.

3 . The memory device of claim 1 , wherein:

the first transistor is a first vertical transistor that comprises a first doped region that extends in a first direction between the storage component and the digit line; and

the second transistor is a second vertical transistor that comprises a second doped region that extends in the first direction between the storage component and the plate line.

4 . The memory device of claim 3 , wherein:

the first doped region is positioned between the second doped region and a substrate of the memory device in the first direction.

5 . The memory device of claim 4 , wherein the storage component is positioned between the first doped region and the second doped region in the first direction.

6 . A memory device, comprising:

a memory cell coupled with a digit line and a plate line, the memory cell comprising a storage component and two transistors connected in a series configuration;

a word line coupled with a gate of a first transistor of the two transistors and configured to select the memory cell;

a select line coupled with a gate of a second transistor of the two transistors and configured to couple the memory cell with the digit line;

a sense component configured to selectively couple with a plurality of digit lines comprising the digit line; and

a third transistor coupled with the select line and configured to selectively couple the digit line with the sense component during at least a portion of a read operation.

7 . The memory device of claim 6 , wherein a first node of at least one of the two transistors is coupled with the storage component and a second node of another of the two transistors is coupled with the digit line.

8 . The memory device of claim 7 , wherein the first transistor is coupled with the storage component at the first node and the second transistor is coupled with the digit line at the second node.

9 . The memory device of claim 7 , wherein the first transistor is coupled with the digit line at the second node and the second transistor is coupled with the storage component at the first node.

10 . The memory device of claim 6 , further comprising:

a second memory cell coupled with the word line and a second digit line of the plurality; and

a fourth transistor configured to selectively couple the second digit line of the plurality with the sense component, a gate of the fourth transistor coupled with a second select line.

11 . The memory device of claim 6 , wherein:

the first transistor is a first vertical transistor that comprises a first doped region that extends in a first direction between the storage component and the digit line; and

the second transistor is a second vertical transistor that comprises a second doped region that extends in the first direction between the storage component and the plate line.

12 . The memory device of claim 11 , the first doped region is positioned between the second doped region and a substrate of the memory device in the first direction.

13 . The memory device of claim 6 , wherein the storage component is coupled with the plate line.

14 . The memory device of claim 6 , wherein the memory cell comprises a dynamic random access memory (DRAM) cell.

15 . A memory device, comprising:

a memory cell comprising a storage component, a first transistor, and a second transistor, wherein the first transistor and the second transistor are coupled with the storage component;

a word line coupled with the memory cell;

a digit line coupled with the first transistor of the memory cell and extending in a first direction;

a select line coupled with the second transistor of the memory cell, the select line configured to selectively couple the memory cell with the digit line;

a sense component configured to be selectively coupled with a plurality of digit lines that comprise the digit line; and

a third transistor configured to selectively couple the digit line with the sense component, a gate of the third transistor coupled with the select line.

16 . The memory device of claim 15 , further comprising:

a second memory cell coupled with the word line and a second digit line of the plurality; and

a fourth transistor configured to selectively couple the second digit line of the plurality with the sense component, a gate of the fourth transistor coupled with a second select line.

17 . The memory device of claim 15 , wherein the word line extends in a second direction orthogonal to the first direction.

18 . The memory device of claim 17 , wherein the first direction and the second direction are parallel to a surface of a substrate.

Continuity (3)
Division 17370488 · Jul 8, 2021
Division 16379222 · Apr 9, 2019
Related Publication 20240242758A1 · Jul 18, 2024
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