IP Library › Granted Patent US 12,640,538
Granted Patent B2
US 12,640,538 · App. 18/266,478 · Granted May 26, 2026

Semiconductor laser element, semiconductor laser device, semiconductor laser device manufacturing method, and gas analysis device

Inventors: Makoto Matsuhama (Kyoto, JP); Tomoji Terakado (Kyoto, JP); Yusuke Awane (Kyoto, JP)
Assignee: HORIBA, LTD.
H01S5/1014H01S5/04256H01S5/06258H01S5/125H01S5/20H01S5/3402H01S5/34313G01N21/59G01N2201/06113H01S5/12H01S2301/166H01S2304/04
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Quick Facts
Patent No.
US 12,640,538
App. No.
18/266,478
Granted
May 26, 2026
Kind
B2
Abstract

The present invention enables single mode light to be stably output while also enabling the intensity thereof to be increased, and is a distributed feedback type of semiconductor laser element in which a diffraction grating is formed on a waveguide. The waveguide includes a diffraction grating portion where the diffraction grating is formed, and a flat portion having a region where the diffraction grating is not formed and whose width is broader than the diffraction grating portion. The flat portion has a connecting portion having a region whose width changes continuously approaching a connection location with the diffraction grating portion, and a high-reflection film is provided on an end surface of the flat portion that is on an opposite side from the connecting portion, while an anti-reflection film is provided on an end surface of the diffraction grating portion that is on an opposite side from the connecting portion.

Claims (20)

1 . A quantum cascade laser comprising:

a waveguide having

a diffraction grating portion where a diffraction grating is formed and a flat portion where the diffraction grating is not formed and whose width is broader than that of the diffraction grating portion, wherein the flat portion includes a connecting portion whose width changes continuously approaching a connection location with the diffraction grating portion; and a rectangular portion that is formed in a rectangular shape, and wherein at least one of (i) the connection location between the diffraction grating portion and the connection portion or (ii) a connection location between the rectangular portion and the connecting portion is formed in an R shape,

a high-reflection film provided on an end surface of the flat portion that is on an opposite side from the connecting portion, and

an anti-reflection film provided on an end surface of the diffraction grating portion that is on an opposite side from the connecting portion.

2 . The quantum cascade laser according to claim 1 , wherein the width of the connecting portion becomes continuously narrower approaching the connection location with the diffraction grating portion.

3 . The quantum cascade laser according to claim 1 , wherein a maximum width of the connecting portion is not more than a maximum width of portions of the flat portion other than the connecting portion, and a minimum width of the connecting portion is not less than a maximum width of the diffraction grating portion.

4 . The quantum cascade laser according to claim 1 , wherein the connecting portion has a tapered portion whose width becomes continuously narrower approaching the connection location with the diffraction grating portion, and a narrow-width portion that joins the tapered portion and the diffraction grating portion together.

5 . The quantum cascade laser according to claim 1 , wherein a width dimension of a light-emitting end of the waveguide is 1˜2 times an oscillation wavelength.

6 . The quantum cascade laser according to claim 1 , wherein a surface area of a region where the diffraction grating is not formed is not less than a surface area of a region where the diffraction grating is formed.

7 . The quantum cascade laser according to claim 1 , further comprising: a first electrode that supplies current to the diffraction grating portion; and a second electrode that is provided separately from the first electrode and supplies current to the flat portion.

8 . A semiconductor laser device comprising a substrate; and a semiconductor laser element that is disposed on the substrate, wherein the semiconductor laser element is the quantum cascade laser according to claim 1 .

9 . A method of manufacturing a quantum cascade laser in which a diffraction grating is formed on a waveguide comprising:

structural body formation in which there is formed on a substrate a laminated structural body having a diffraction grating region where the diffraction grating is formed and a flat region where the diffraction grating is not formed; and

waveguide formation in which a waveguide is formed by etching the laminated structural body in such a way that the laminated structural body is provided with a diffraction grating portion where the diffraction grating is formed, and a flat portion having a region where the diffraction grating is not formed and whose width is broader than that of the diffraction grating portion, and in such a way that the flat portion includes a connecting portion having a region whose width changes continuously approaching a connection location with the diffraction grating portion.

10 . An analysis device that analyzes a subject to be measured that is contained in a sample, comprising:

a measurement cell into which the sample is introduced;

the quantum cascade laser according to claim 8 that irradiates laser light onto the measurement cell;

a photodetector that detects laser light transmitted through the measurement cell; and

an analysis portion that analyzes the subject to be measured using a detection signal from the photodetector.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 9, 2023
From: MATSUHAMA, MAKOTO; TERAKADO, TOMOJI; AWANE, YUSUKE
To: HORIBA, LTD.
Reel/Frame 063912/0360 →
Priority Claims (1)
JP 2020-204525 · Dec 9, 2020 · national
Continuity (1)
Related Publication 20240030683A1 · Jan 25, 2024
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