Multi-bump connection to interconnect structure and manufacturing method thereof
A method includes forming a package component comprising forming a dielectric layer, patterning the dielectric layer to form an opening, and forming a redistribution line including a via in the opening, a conductive pad, and a bent trace. The via is vertically offset from the conductive pad. The conductive pad and the bent trace are over the dielectric layer. The bent trace connects the conductive pad to the via, and the bent trace includes a plurality of sections with lengthwise directions un-parallel to each other. A conductive bump is formed on the conductive pad.
1 . A structure comprising:
a dielectric layer;
a first via extending into the dielectric layer;
a first conductive trace over the dielectric layer, wherein the first conductive trace comprises a first plurality of sections, wherein in a top view of the structure, the first plurality of sections are elongated and have lengthwise directions, wherein in the top view, the lengthwise directions of neighboring ones of the first plurality of sections form non-zero angles, and wherein bottom surfaces of the first plurality of sections are in physical contact with a top surface of the dielectric layer;
a first conductive pad over the dielectric layer, wherein the first conductive trace electrically connects the first conductive pad to the first via, and the first conductive pad, the first conductive trace, and the first via form a continuous conductive region;
a first conductive bump over and contacting the first conductive pad; and
a second conductive bump over and contacting the first conductive pad, wherein the first conductive bump and the second conductive bump are aligned to a straight line, and wherein in a top view of the structure, the first conductive pad extends laterally beyond the first conductive bump and the second conductive bump.
2 . The structure of claim 1 , wherein the first plurality of sections of the first conductive trace comprise a first section joining the first conductive pad, with a first lengthwise direction of the first section and the straight line forming a first angle greater than 0 degrees and smaller than 90 degrees.
3 . The structure of claim 2 , wherein the first plurality of sections of the first conductive trace further comprise a second section joining the first section, with a second lengthwise direction of the second section and the first lengthwise direction forming a second angle, and a complementary angle of the second angle is greater than 0 degrees and smaller than 90 degrees.
4 . The structure of claim 2 , wherein the first plurality of sections comprise three sections.
5 . The structure of claim 2 , wherein at least two of the first plurality of sections are neither parallel to nor perpendicular to the straight line.
6 . The structure of claim 1 , wherein the first conductive pad is elongated, and the first conductive trace is connected to a middle section of the first conductive pad.
7 . The structure of claim 1 further comprising:
a second via extending into the dielectric layer;
a second conductive trace over the dielectric layer, wherein the second conductive trace comprises a second plurality of sections;
a second conductive pad over the dielectric layer, wherein the second conductive trace electrically connects the second conductive pad to the second via;
a second conductive bump over and contacting the second conductive pad; and
an additional redistribution line underlying and contacting both of the first via and the second via.
8 . The structure of claim 7 , wherein the first plurality of sections are parallel to corresponding ones of the second plurality of sections.
9 . A structure comprising:
a dielectric layer;
a first via extending into the dielectric layer;
a first conductive trace over the dielectric layer, wherein the first conductive trace comprises a first plurality of sections, with lengthwise directions of neighboring ones of the first plurality of sections forming non-zero angles;
a first conductive pad over the dielectric layer, wherein the first conductive trace electrically connects the first conductive pad to the first via, and the first conductive pad, the first conductive trace, and the first via form a continuous conductive region;
a first conductive bump over and contacting the first conductive pad; and
a second conductive bump over and contacting the first conductive pad, wherein the first conductive bump and the second conductive bump are aligned to a straight line, and the first plurality of sections of the first conductive trace comprise a first section joining the first conductive pad, with a first lengthwise direction of the first section and the straight line forming a first angle greater than 0 degrees and smaller than 90 degrees.
10 . The structure of claim 9 , wherein the first plurality of sections of the first conductive trace further comprise a second section joining the first section, with a second lengthwise direction of the second section and the first lengthwise direction forming a second angle, and a complementary angle of the second angle is greater than 0 degrees and smaller than 90 degrees.
11 . The structure of claim 9 , wherein the first plurality of sections comprise three sections.
12 . The structure of claim 9 , wherein at least two of the first plurality of sections are neither parallel to nor perpendicular to the straight line.
13 . The structure of claim 9 , wherein the first conductive pad is elongated, and the first conductive trace is connected to a middle section of the first conductive pad.
14 . The structure of claim 9 further comprising:
a second via extending into the dielectric layer;
a second conductive trace over the dielectric layer, wherein the second conductive trace comprises a second plurality of sections;
a second conductive pad over the dielectric layer, wherein the second conductive trace electrically connects the second conductive pad to the second via;
a second conductive bump over and contacting the second conductive pad; and
an additional redistribution line underlying and contacting both of the first via and the second via.
15 . The structure of claim 14 , wherein the first plurality of sections are parallel to corresponding ones of the second plurality of sections.
16 . A structure comprising:
a dielectric layer;
a first via extending into the dielectric layer;
a first conductive trace over the dielectric layer, wherein the first conductive trace comprises a first plurality of sections, with lengthwise directions of neighboring ones of the first plurality of sections forming non-zero angles, wherein bottom surfaces of the first plurality of sections are in physical contact with a top surface of the dielectric layer;
a first conductive pad over the dielectric layer, wherein the first conductive trace electrically connects the first conductive pad to the first via, and the first conductive pad, the first conductive trace, and the first via form a continuous conductive region;
a first conductive bump over and contacting the first conductive pad; and
a second conductive bump over and contacting the first conductive pad, wherein the first conductive bump and the second conductive bump are aligned to a straight line, and the first plurality of sections of the first conductive trace comprise a first section joining the first conductive pad, with a first lengthwise direction of the first section and the straight line forming a first angle greater than 0 degrees and smaller than 90 degrees.
17 . The structure of claim 16 , wherein the first plurality of sections of the first conductive trace further comprise a second section joining the first section, with a second lengthwise direction of the second section and the first lengthwise direction forming a second angle, and a complementary angle of the second angle is greater than 0 degrees and smaller than 90 degrees.
18 . The structure of claim 17 , wherein the first plurality of sections comprise three sections.
19 . The structure of claim 17 , wherein at least two of the first plurality of sections are neither parallel to nor perpendicular to the straight line.
20 . The structure of claim 16 further comprising:
a second via extending into the dielectric layer;
a second conductive trace over the dielectric layer, wherein the second conductive trace comprises a second plurality of sections;
a second conductive pad over the dielectric layer, wherein the second conductive trace electrically connects the second conductive pad to the second via;
a second conductive bump over and contacting the second conductive pad; and
an additional redistribution line underlying and contacting both of the first via and the second via.