IP Library Granted Patent US 12,643,185
Granted Patent B2
US 12,643,185 · App. 17/969,923 · Granted Jun 2, 2026

Method of transporting workpiece and processing apparatus

Inventors: Kiyoshi Mori (Tokyo, JP); Haruhiko Furuya (Yamanashi, JP)
Assignee: TOKYO ELECTRON LIMITED
B23Q1/44C23C16/4584H10P72/7612H10P72/7618H10P72/50
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Quick Facts
Patent No.
US 12,643,185
App. No.
17/969,923
Granted
Jun 2, 2026
Kind
B2
Abstract

A method of transporting a workpiece includes steps of: (a) adjusting an inclination of a stage including a placement surface on which the workpiece is to be placed such that the placement surface is inclined with respect to a horizontal plane; (b) receiving the workpiece from a transport apparatus configured to transport the workpiece by raising lift pins provided in the stage, before or after step (a); (c) placing the workpiece on the inclined placement surface by performing at least one of lowering the lift pins and raising the stage; and (d) adjusting the inclination of the stage such that the placement surface on which the workpiece is placed is parallel to the horizontal plane.

Claims (62)

1 . A method of transporting a workpiece, the method comprising steps of:

(a) adjusting an inclination of a stage including a placement surface on which the workpiece is to be placed such that the placement surface is inclined with respect to a horizontal plane;

(b) receiving the workpiece horizontally with respect to the horizontal plane from a transport apparatus configured to transport the workpiece by raising lift pins provided in the stage, before or after step (a);

(c) placing the workpiece on the inclined placement surface by performing at least one of lowering the lift pins or raising the stage; and

(d) adjusting the inclination of the stage such that the placement surface on which the workpiece is placed is parallel to the horizontal plane,

wherein step (c) includes steps of:

(c-1) acquiring positional deviation information, which indicates a positional deviation amount between an edge position of the workpiece when the workpiece is placed on the inclined placement surface and a predetermined reference edge position;

(c-2) adjusting a position of the stage based on the positional deviation information; and

(c-3) performing at least one of lowering the lift pins or raising the stage, after adjusting the position of the stage.

2 . The method of claim 1 , wherein the lift pins are arranged at regular intervals along a circumferential direction of the placement surface, and

wherein, in step (a), the inclination of the stage is adjusted such that the placement surface is inclined in a posture in which a height of the placement surface at a position of a specific lift pin among the lift pins is the lowest.

3 . The method of claim 1 , wherein the lift pins are configured to come into contact with a lifting member at lower ends of the lift pins, and are raised or lowered as the lifting member is raised or lowered.

4 . The method of claim 1 , wherein the lift pins are fixed to a lifting member at lower ends of the lift pins, and are raised or lowered as the lifting member is raised or lowered.

5 . The method of claim 1 , wherein an inclination angle of the placement surface with respect to the horizontal plane is 0.5 degrees or more and 2 degrees or less.

6 . A method of transporting a workpiece, the method comprising steps of:

(a) adjusting an inclination of a stage including a placement surface on which the workpiece is to be placed such that the placement surface is inclined with respect to a horizontal plane;

(b) receiving the workpiece horizontally with respect to the horizontal plane from a transport apparatus configured to transport the workpiece by raising lift pins provided in the stage, before or after step (a);

(c) placing the workpiece on the inclined placement surface by performing at least one of lowering the lift pins or raising the stage; and

(d) adjusting the inclination of the stage such that the placement surface on which the workpiece is placed is parallel to the horizontal plane,

wherein the lift pins are arranged at regular intervals along a circumferential direction of the placement surface, and

wherein, in step (a), the inclination of the stage is adjusted such that the placement surface is inclined in a posture in which heights of the placement surface at positions of the lift pins are gradually lowered along the circumferential direction of the placement surface.

7 . The method of claim 6 , wherein the lift pins are configured to come into contact with a lifting member at lower ends of the lift pins, and are raised or lowered as the lifting member is raised or lowered.

8 . The method of claim 6 , wherein the lift pins are fixed to a lifting member at lower ends of the lift pins, and are raised or lowered as the lifting member is raised or lowered.

9 . The method of claim 6 , wherein an inclination angle of the placement surface with respect to the horizontal plane is 0.5 degrees or more and 2 degrees or less.

10 . A method of transporting a workpiece, the method comprising steps of:

(e) adjusting an inclination of a stage including a placement surface on which the workpiece is placed such that the placement surface is inclined with respect to a horizontal plane;

(f) lifting the workpiece from the inclined placement surface by raising lift pins provided in the stage; and

(g) transferring the workpiece supported by the lift pins to a transport apparatus configured to transport the workpiece,

wherein the lift pins are arranged at regular intervals along a circumferential direction of the placement surface,

wherein, in step (e), the inclination of the stage is adjusted such that the placement surface is inclined in a posture in which a height of the placement surface at a position of a specific lift pin among the lift pins is the lowest, and

wherein, in step (e), depending on a cumulative number of workpieces transported by the transport apparatus, a location at which the height of the placement surface after being inclined is the lowest is sequentially switched to positions of the lift pins in the circumferential direction of the placement surface.

11 . The method of claim 10 , wherein the lift pins are arranged at regular intervals along a circumferential direction of the placement surface, and

wherein, in step (e), the inclination of the stage is adjusted such that the placement surface is inclined in a posture in which heights of the placement surface at positions of the lift pins are gradually lowered along the circumferential direction of the placement surface.

12 . The method of claim 10 , wherein the lift pins are configured to come into contact with a lifting member at lower ends of the lift pins, and are raised or lowered as the lifting member is raised or lowered.

13 . The method of claim 10 , wherein the lift pins are fixed to a lifting member at lower ends of the lift pins, and are raised or lowered as the lifting member is raised or lowered.

14 . The method of claim 10 , wherein an inclination angle of the placement surface with respect to the horizontal plane is 0.5 degrees or more and 2 degrees or less.

15 . A processing apparatus comprising:

a stage including a placement surface on which a workpiece is to be placed;

an adjuster configured to adjust an inclination of the stage;

lift pins provided in the stage;

a lifter configured to raise and lower the lift pins; and

a controller,

wherein the controller is configured to cause each part of the processing apparatus to execute:

(a) adjusting the inclination of the stage such that the placement surface is inclined with respect to a horizontal plane;

(b) receiving the workpiece horizontally with respect to the horizontal plane from a transport apparatus configured to transport the workpiece by raising the lift pins, before or after step (a);

(c) placing the workpiece on the inclined placement surface by performing at least one of lowering the lift pins or raising the stage; and

(d) adjusting the inclination of the stage such that the placement surface on which the workpiece is placed is parallel to the horizontal plane,

wherein the lift pins are arranged at regular intervals along a circumferential direction of the placement surface, and

wherein, in step (a), the inclination of the stage is adjusted such that the placement surface is inclined in a posture in which heights of the placement surface at positions of the lift pins are gradually lowered along the circumferential direction of the placement surface.

16 . A processing apparatus comprising:

a stage including a placement surface on which a workpiece is to be placed;

an adjuster configured to adjust an inclination of the stage;

lift pins provided in the stage;

a lifter configured to raise and lower the lift pins; and

a controller,

wherein the controller is configured to cause each part of the processing apparatus to execute:

(e) adjusting the inclination of the stage on which the workpiece is placed such that the placement surface is inclined with respect to a horizontal plane;

(f) lifting the workpiece from the inclined placement surface by raising the lift pins; and

(g) transferring the workpiece supported by the lift pins to a transport apparatus configured to transport the workpiece,

wherein the lift pins are arranged at regular intervals along a circumferential direction of the placement surface,

wherein, in step (e), the inclination of the stage is adjusted such that the placement surface is inclined in a posture in which a height of the placement surface at a position of a specific lift pin among the lift pins is the lowest, and

wherein, in step (e), depending on a cumulative number of workpieces transported by the transport apparatus, a location at which the height of the placement surface after being inclined is the lowest is sequentially switched to positions of the lift pins in the circumferential direction of the placement surface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2023
From: MORI, KIYOSHI; FURUYA, HARUHIKO
To: TOKYO ELECTRON LIMITED
Reel/Frame 062469/0346 →
Priority Claims (1)
JP 2021-172990 · Oct 22, 2021 · national
Continuity (1)
Related Publication 20230128473A1 · Apr 27, 2023
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