IP Library › Granted Patent US 12,646,636
Granted Patent B2
US 12,646,636 · App. 19/356,470 · Granted Jun 2, 2026

High-current flexible conductive circuits with connectors

Inventors: Lewis Richard Galligan (Novi, MI); Andrew Fisher (Ortonville, MI); Kevin Coakley (Belmont, CA); Muthu Sebastian (Mountain View, CA); Jean-Paul Ortiz (White Lake, MI); Arturo Cantu-Chavez (Pflugerville, TX); Mark Terlaak (Howell, MI); Will Findlay (San Carlos, CA); Gary Cook (San Carlos, CA); James Jeon (San Carlos, CA); Mohammad Rizwanullah (San Carlos, CA)
Assignee: CelLink Corporation
H01B7/0861H01B3/307H01B7/04H01B7/0807H01B7/28
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,646,636
App. No.
19/356,470
Granted
Jun 2, 2026
Kind
B2
Abstract

A flexible conductive assembly includes a flexible shielded high-current circuit having first and second circuit portions, each with conductive layers and an electromagnetic shield. Contacts are mechanically and electrically coupled to the conductive layers and extend into a connector housing. The housing incorporates electromagnetic shield portions electrically joined to the circuit shields, and a wire seal that protects against environmental ingress while maintaining electrical isolation. By combining flat conductor layers, integrated shielding, and sealed connector structures, the assembly provides a compact, lightweight, and reliable flexible shielded circuit for transmitting high currents with reduced electromagnetic emissions.

Claims (43)

1 . A flexible conductive assembly comprising:

a flexible shielded high-current circuit comprising a first circuit portion and a second circuit portion, wherein each of the first circuit portion and the second circuit portion comprises a first conductive layer, which is a metal sheet, a circuit electromagnetic shield, a first contact mechanically and electrically coupled to the first conductive layer of the first circuit portion, and a second contact mechanically and electrically coupled to the first conductive layer of the second circuit portion; and

a connector comprising a housing comprising a first housing portion, a first electromagnetic shield portion, and a wire seal, wherein:

the first electromagnetic shield portion is electrically coupled to the circuit electromagnetic shield of each of the first circuit portion and the second circuit portion and at least partially surrounds the first contact and the second contact, and

each of the first circuit portion and the second circuit portion at least partially protrudes into the housing and is sealed, relative to the housing, by the wire seal.

2 . The flexible conductive assembly of claim 1 , wherein:

each of the first circuit portion and the second circuit portion further comprises a first insulating layer, a second insulating layer, a third insulating layer, and a second conductive layer,

the first insulating layer, the first conductive layer, the second conductive layer, the second insulating layer, the electromagnetic shield, and the third insulating layer are stacked along a stacking axis,

the first conductive layer and the second conductive layer directly interface and form a stack positioned between the first insulating layer and the second insulating layer, and

the electromagnetic shield is positioned between the second insulating layer and the third insulating layer and is configured to block electromagnetic emissions produced by the stack while transmitting an electric current.

3 . The flexible conductive assembly of claim 2 , wherein the stack is configured to transmit an electric current of more than 400 Amperes.

4 . The flexible conductive assembly of claim 2 , wherein each of the first conductive layer and the second conductive layer comprises aluminum.

5 . The flexible conductive assembly of claim 2 , wherein each of the first conductive layer and the second conductive layer has a thickness, measured along the stacking axis, of at least 400 micrometers.

6 . The flexible conductive assembly of claim 2 , wherein the first conductive layer and the second conductive layer have the same thickness.

7 . The flexible conductive assembly of claim 2 , wherein each of the first insulating layer and the second insulating layer comprises polypropylene (PP).

8 . The flexible conductive assembly of claim 7 , wherein each of the first insulating layer and the second insulating layer further comprises polyethylene (PE) such that the polypropylene (PP) forms a first sublayer while the polyethylene (PE) forms a second sublayer directly interfacing the first sublayer.

9 . The flexible conductive assembly of claim 2 , wherein the electromagnetic shield is a metal sheet having a thickness, measured along the stacking axis, of 20-150 micrometers.

10 . The flexible conductive assembly of claim 2 , wherein the electromagnetic shield of the first circuit portion is mechanically and electrically coupled with the first electromagnetic shield portion.

11 . The flexible conductive assembly of claim 1 , wherein at least a portion of the first contact extends away from the first circuit portion in a direction perpendicular to a plane parallel with a portion of the first circuit portion.

12 . The flexible conductive assembly of claim 1 , wherein each of the first contact and the second contact is formed from copper.

13 . The flexible conductive assembly of claim 1 , wherein:

the connector further comprises a blocker positioned between the first contact and the wire seal,

the first contact is welded to the first conductive layer of the first circuit portion of the flexible shielded high-current circuit, and

the second contact is welded to the first conductive layer of the second circuit portion of the flexible shielded high-current circuit.

14 . The flexible conductive assembly of claim 1 , wherein the housing comprises a first housing portion and a second housing portion removably attached to each other and enclosing the first contact, the second contact, the first electromagnetic shield portion, and a portion of each of the first circuit portion and the second circuit portion extending into the connector.

15 . The flexible conductive assembly of claim 14 , wherein the housing further comprises a circuit seal enclosing a portion of each of the first housing portion, the second housing portion, the first circuit portion, and the second circuit portion.

16 . The flexible conductive assembly of claim 15 , wherein:

the circuit seal comprises a blocker and a wire seal, and

a portion of the blocker is positioned between the first circuit portion and the second circuit portion and a portion of the blocker extends from the first housing portion to the second housing portion.

17 . The flexible conductive assembly of claim 16 , wherein the first housing portion, the second housing portion, and blocker each comprise a set of ribs interfacing and compressed against the first circuit portion or the second circuit portion.

18 . The flexible conductive assembly of claim 1 , wherein:

the first housing portion comprises connector alignment protrusions,

the first contact comprises connector alignment notches, and

the connector alignment protrusions protrude into a volume defined by the connector alignment notches.

19 . The flexible conductive assembly of claim 1 , wherein the flexible conductive assembly further comprises a first terminal position assurance (TPA) device positioned between the first contact and the second circuit portion and mechanically coupled with the first housing portion, thereby securing the first contact to the first housing portion.

20 . A method of forming a flexible conductive assembly comprising a flexible shielded high-current circuit, the method comprising:

welding a first contact to a first conductive layer of a first circuit portion comprising an electromagnetic shield, a first insulating layer, a second insulating layer a third insulating layer, and a second conductive layer, wherein the first insulating layer, the first conductive layer, the second conductive layer, the second insulating layer, the electromagnetic shield, and the third insulating layer are stacked along a stacking axis;

welding a second contact to a first conductive layer of a second circuit portion comprising an electromagnetic shield, a first insulating layer, a second insulating layer, a third insulating layer and a second conductive layer, wherein the first insulating layer, the first conductive layer, the second conductive layer, the second insulating layer, the electromagnetic shield, and the third insulating layer are stacked along a stacking axis;

positioning the first contact within a first housing portion comprising a first electromagnetic shield portion, a first connector opening, and a second connector opening such that a portion of the first contact extends into the first connector opening and a portion of the first circuit portion extends out of the first housing portion;

welding the electromagnetic shield of the first circuit portion to the first electromagnetic shield portion;

positioning the second contact within the first housing portion such that a portion of the second contact extends into the second connector opening and a portion of the second circuit portion extends out of the first housing portion;

welding the electromagnetic shield of the second circuit portion to the first electromagnetic shield portion; and

attaching a second housing portion comprising a second electromagnetic shield portion with first housing portion such that the second electromagnetic shield portion is positioned between a portion of the second circuit portion and the second housing portion and the second electromagnetic shield portion electrically contacts the first electromagnetic shield portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 14, 2025
From: GALLIGAN, LEWIS; FISHER, ANDREW; COAKLEY, KEVIN; SEBASTIAN, MUTHU; ORTIZ, JEAN-PAUL; CANTU-CHAVEZ, ARTURO; TERLAAK, MARK; FINDLAY, WILL; COOK, GARY; JEON, JAMES; RIZWANULLAH, MOHAMMAD
To: CELLINK CORPORATION
Reel/Frame 072564/0487 →
Continuity (4)
Provisional Application 63768736 · Mar 7, 2025
Provisional Application 63756860 · Feb 11, 2025
Provisional Application 63706091 · Oct 11, 2024
Related Publication 20260106053A1 · Apr 16, 2026
References Cited (76)
US 3750278A · Baker et al. · 1973 [cited by applicant]
US 4818840A · Booth et al. · 1989 [cited by applicant]
US 5262594A · Edwin et al. · 1993 [cited by applicant]
US 5387113A · Dickerson · 1995 [cited by examiner]
US 5645932A · Uchibori · 1997 [cited by applicant]
US 6010771A · Isen et al. · 2000 [cited by applicant]
US 6036809A · Kelly et al. · 2000 [cited by applicant]
US 6332909B1 · Teshima et al. · 2001 [cited by applicant]
US 6787732B1 · Xuan et al. · 2004 [cited by applicant]
US 6881923B2 · Battaglia · 2005 [cited by applicant]
US 6992001B1 · Lin · 2006 [cited by applicant]
US 7497004B2 · Cote et al. · 2009 [cited by applicant]
US 7633035B2 · Kirmeier · 2009 [cited by applicant]
US 8510934B2 · Brand et al. · 2013 [cited by applicant]
US 8931166B2 · Marttila · 2015 [cited by applicant]
US 9214607B1 · Andrews · 2015 [cited by applicant]
US 9671352B2 · Woo et al. · 2017 [cited by applicant]
US 9692030B2 · Schüssler et al. · 2017 [cited by applicant]
US 9730333B2 · Li et al. · 2017 [cited by applicant]
US 10008403B2 · Rumsby et al. · 2018 [cited by applicant]
US 10842025B1 · Lane · 2020 [cited by applicant]
US 20010006766A1 · O'Brien et al. · 2001 [cited by applicant]
US 20020046856A1 · Alcoe · 2002 [cited by applicant]
US 20020050489A1 · Ikegami et al. · 2002 [cited by applicant]
US 20030062347A1 · Song et al. · 2003 [cited by applicant]
US 20060032665A1 · Ice · 2006 [cited by applicant]
US 20070171129A1 · Coleman et al. · 2007 [cited by applicant]
US 20070193027A1 · Takakusaki et al. · 2007 [cited by applicant]
US 20080017971A1 · Hollis · 2008 [cited by applicant]
US 20080083715A1 · Kirmeier · 2008 [cited by applicant]
US 20080128397A1 · Gandhi · 2008 [cited by applicant]
US 20090007421A1 · Chen et al. · 2009 [cited by applicant]
US 20100031996A1 · Basol · 2010 [cited by applicant]
US 20110001670A1 · Coleman et al. · 2011 [cited by applicant]
US 20110089212A1 · Schmid et al. · 2011 [cited by applicant]
US 20120164490A1 · Itoi et al. · 2012 [cited by applicant]
US 20120171527A1 · Hiroma · 2012 [cited by applicant]
US 20120227907A1 · Arakawa et al. · 2012 [cited by applicant]
US 20130055555A1 · Forster et al. · 2013 [cited by applicant]
US 20130260191A1 · Takahashi et al. · 2013 [cited by applicant]
US 20140268780A1 · Wang et al. · 2014 [cited by applicant]
US 20150023584A1 · Rudin · 2015 [cited by applicant]
US 20150228956A1 · Schüssler et al. · 2015 [cited by applicant]
US 20150270190A1 · Kim et al. · 2015 [cited by applicant]
US 20160181579A1 · Geshi et al. · 2016 [cited by applicant]
US 20160207287A1 · Kim · 2016 [cited by applicant]
US 20160315304A1 · Biskup · 2016 [cited by applicant]
US 20160366768A1 · Matsuda · 2016 [cited by applicant]
US 20170012331A1 · Ng et al. · 2017 [cited by applicant]
US 20170214033A1 · Takano et al. · 2017 [cited by applicant]
US 20180034023A1 · Newman et al. · 2018 [cited by applicant]
US 20180205048A1 · Enomoto et al. · 2018 [cited by applicant]
US 20180294536A1 · Kruszelnicki · 2018 [cited by applicant]
US 20190097204A1 · Liposky et al. · 2019 [cited by applicant]
US 20190181419A1 · Suba et al. · 2019 [cited by applicant]
US 20190296281A1 · Elsberry · 2019 [cited by applicant]
US 20190312251A1 · Matthews · 2019 [cited by applicant]
US 20190341585A1 · Shi et al. · 2019 [cited by applicant]
US 20200220120A1 · Day et al. · 2020 [cited by applicant]
US 20210066683A1 · Lane · 2021 [cited by applicant]
US 20210086306A1 · Lane · 2021 [cited by applicant]
US 20210091363A1 · Lane · 2021 [cited by applicant]
US 20210092837A1 · Lane · 2021 [cited by applicant]
US 20210092851A1 · Lane · 2021 [cited by applicant]
US 20210092853A1 · Lane · 2021 [cited by applicant]
US 20210092854A1 · Lane · 2021 [cited by applicant]
US 20220247134A1 · Hagi et al. · 2022 [cited by applicant]
US 20230087124A1 · Nie · 2023 [cited by examiner]
US 20230136576A1 · Prasad et al. · 2023 [cited by applicant]
US 20230378700A1 · Bohan · 2023 [cited by examiner]
CN 203715762U · 2014 [cited by applicant]
EP 3496180A1 · 2019 [cited by applicant]
KR 20150058939A · 2015 [cited by applicant]
WO 2019150740A1 · 2019 [cited by applicant]
“Products: Contacting Solutions for Printed Circuit Boards”, Wurth Elektronik ICS GmbH & Co. KG, 2025; Retrieved on Sep. 30, 2025 at https://www.powerelement.com/en/products. [cited by applicant]
Nagarajan Palavesam et al; “Roll-to-roll processing of film substrates for hybrid integrated flexible electronics” Flexible and Printed Electronics, Feb. 2018. [cited by applicant]