Packaged semiconductor device including liquid-cooled lid and methods of forming the same
Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.
1 . A method comprising:
bonding a first integrated circuit die to a first substrate;
forming an encapsulant over the first substrate and the first integrated circuit die;
directly bonding a lid to the first integrated circuit die, wherein the bonding comprises forming dielectric-to-dielectric bonds between a first side of the lid and a backside of the first integrated circuit die, a second side of the lid comprising channels;
after directly bonding the lid to the first integrated circuit die, singulating the lid; and
after singulating the lid, bonding a cooling cover to the second side of the lid, the cooling cover sealing the channels, wherein an entirety of a surface of the cooling cover facing the lid is planar.
2 . The method of claim 1 , further comprising:
attaching the first substrate to a second substrate; and
attaching a ring structure to the lid and the second substrate.
3 . The method of claim 2 , wherein the ring structure is attached to the lid using a first adhesive, wherein the ring structure is attached to the second substrate using a second adhesive.
4 . The method of claim 1 , wherein a width of the cooling cover is greater than a width of the lid after singulating the lid.
5 . The method of claim 1 , further comprising:
bonding a second integrated circuit die to the first substrate, wherein the lid and the cooling cover extend over the second integrated circuit die.
6 . The method of claim 1 , wherein the channels are formed in the lid after bonding the lid to the first integrated circuit die.
7 . The method of claim 1 , wherein bonding the cooling cover to the second side of the lid comprises bonding the cooling cover to the second side of the lid using an adhesive.
8 . A method comprising:
bonding a first integrated circuit die and a second integrated circuit die to a first substrate;
forming an encapsulant over the first substrate, the first integrated circuit die, and the second integrated circuit die;
thinning the encapsulant to expose a back surface of the first integrated circuit die and a back surface of the second integrated circuit die;
bonding a lid to the first integrated circuit die and the second integrated circuit die, wherein the bonding comprises forming dielectric-to-dielectric bonds between a first surface of the lid and the back surface of the first integrated circuit die and between the first surface of the lid and the back surface of the second integrated circuit die;
after bonding the lid to the first integrated circuit die, forming trenches in a second surface of the lid, wherein the trenches extend only partially through the lid;
singulating to form a first package and a second package, the first package comprising the first integrated circuit die, the second package comprising the second integrated circuit die; and
attaching a bottom surface of a cooling cover directly to the second surface of the lid of the first package, the cooling cover extending over the trenches.
9 . The method of claim 8 , wherein the cooling cover has a width greater than a width of the lid.
10 . The method of claim 9 , wherein the cooling cover is attached to the lid by a screw-type fastener, wherein the screw-type fastener extends through the cooling cover, and wherein the lid is free from the screw-type fastener.
11 . The method of claim 8 , wherein the encapsulant is completely covered by the lid.
12 . The method of claim 8 , wherein an edge of the lid is aligned to an edge of the first substrate.
13 . The method of claim 8 , further comprising:
attaching the first substrate to a second substrate; and
attaching a ring structure to the second substrate, wherein the ring structure extends along opposing sidewalls of the cooling cover.
14 . A method comprising:
bonding a first integrated circuit die to a substrate;
forming an encapsulant on the substrate and laterally surrounding the first integrated circuit die;
bonding a lid to the first integrated circuit die by dielectric-to-dielectric bonds, the lid covering the encapsulant, wherein the lid has a first surface facing the first integrated circuit die and a second surface facing away from the first integrated circuit die, wherein the lid comprises a plurality of channels in the second surface; and
attaching a first surface of a cooling cover to the second surface of the lid, wherein an entirety of the first surface of the cooling cover is a planar surface, wherein the planar surface of the cooling cover extends completely over the plurality of channels, wherein the cooling cover is attached to the lid by a screw-type fastener, wherein the screw-type fastener extends through the cooling cover.
15 . The method of claim 14 , further comprising:
bonding a second integrated circuit die to the substrate, wherein forming the encapsulant comprises forming the encapsulant laterally surrounding the second integrated circuit die.
16 . The method of claim 15 , further comprising:
bonding the lid to the second integrated circuit die by dielectric-to-dielectric bonds.
17 . The method of claim 14 , further comprising:
prior to bonding the lid, performing a first singulation on the substrate to form a first package.
18 . The method of claim 17 , further comprising:
performing a second singulation on the lid.
19 . The method of claim 14 , wherein the lid is free of the screw-type fastener.
20 . The method of claim 8 , wherein attaching the cooling cover is performed after singulating to form the first package and the second package.