Power module pack
Disclosed is a power module pack including a first cooling plate, a second cooling plate stacked on and coupled to the first cooling plate, and power modules interposed between the first cooling plate and the second cooling plate. Each of the power modules has a lower surface soldered to an upper surface of the first cooling plate.
1 . A power module pack ( 10 ) comprising:
a first cooling plate ( 111 );
a second cooling plate ( 121 ) stacked on and coupled to the first cooling plate ( 111 ); and
one or more power modules ( 20 ) interposed between the first cooling plate ( 111 ) and the second cooling plate ( 121 ),
wherein each of the one or more power modules ( 20 ) has a lower surface soldered to an upper surface of the first cooling plate ( 111 ),
wherein one or more engraved grooves ( 211 ) recessed inward are formed in an upper surface of each of the one or more power modules ( 20 ), and
wherein embossed projections ( 121 -B) protruding outward are formed, respectively, at positions each corresponding to the one or more engraved grooves ( 211 ) of each of the one or more power modules ( 20 ) on a lower surface of the second cooling plate ( 121 ).
2 . The power module pack ( 10 ) of claim 1 , wherein a preform solder ( 130 ) is disposed between the lower surface of each of the one or more power modules ( 20 ) and the upper surface of the first cooling plate ( 111 ), and
each of the one or more power modules ( 20 ) is soldered to the first cooling plate ( 111 ) by the preform solder ( 130 ).
3 . The power module pack ( 10 ) of claim 2 , wherein an upper surface of the preform solder ( 130 ) has a same shape and width as a lower surface of a circuit board ( 201 ) of each of the one or more power modules ( 20 ).
4 . The power module pack ( 10 ) of claim 1 , wherein an engraved pattern (GP) recessed inward is formed at a position corresponding to a position where each of the one or more power modules ( 20 ) is disposed, on the upper surface of the first cooling plate ( 111 ).
5 . The power module pack of claim 1 , wherein one or more engraved grooves recessed inward are formed in an upper surface of each of the one or more power modules,
embossed projections protruding outward are formed, respectively, at positions each corresponding to the one or more engraved grooves of each of the one or more power modules on a lower surface of the second cooling plate, and
each embossed projection of the second cooling plate is inserted into each engraved groove of each of the one or more power modules, such that a position of each of the one or more power modules is fixed.
6 . The power module pack of claim 1 , wherein a plurality of heat dissipation fins ( 111 -P) protruding outward are provided on a lower surface of the first cooling plate ( 111 ).
7 . The power module pack ( 10 ) of claim 1 , further comprising:
a first cover ( 112 ) stacked on and coupled to a lower surface of the first cooling plate ( 111 ) to form a first coolant flow channel (C 1 ) through which a coolant flows between the first cooling plate ( 111 ) and the first cover ( 112 ); and
a second cover ( 122 ) stacked on and coupled to an upper surface of the second cooling plate ( 121 ) to form a second coolant flow channel (C 2 ) through which a coolant flows between the second cooling plate ( 121 ) and the second cover ( 122 ).
8 . The power module pack of claim 7 , wherein the first cover ( 112 ), the first cooling plate ( 111 ), the second cooling plate ( 121 ), and the second cover ( 122 ) are provided with bolt coupling parts ( 112 -C, 111 -C, 121 -C, 122 -C) protruding laterally, respectively, and
the bolt coupling parts ( 112 -C, 111 -C, 121 -C, 122 -C) of the first cover 112 ), the first cooling plate ( 111 ), the second cooling plate ( 121 ), and the second cover ( 122 ) are stacked and arranged in a line and are coupled to each other at a time through one bolt.
9 . A soldering pressure jig ( 40 ) for soldering the power module pack ( 10 ) of claim 1 , comprising:
a lower jig ( 420 ) on which the one or more power modules ( 20 ) are disposed; and
an upper jig ( 410 ) fastened to the lower jig ( 420 ),
wherein a plurality of through holes ( 411 ) passing through the upper jig ( 410 ) are formed at positions of the upper jig ( 410 ) corresponding to a position of each of the one or more power modules ( 20 ), and
ball plungers ( 430 ) penetrate through the through holes ( 411 ) to pressurize an upper portion of each of the one or more power modules ( 20 ).
10 . The soldering pressure jig ( 40 ) of claim 9 , wherein a pressure applied to each of the one or more power modules ( 20 ) is adjustable using the ball plunger ( 430 ).
11 . The soldering pressure jig ( 40 ) of claim 9 , wherein a plurality of vent holes ( 412 ) penetrating through the upper jig ( 410 ) are formed in the upper jig ( 410 ), and
wherein the plurality of vent holes ( 412 ) are formed outside each of the one or more power modules ( 20 ).