IP Library › Granted Patent US 12,721,072
Granted Patent B2
US 12,721,072 · App. 18/582,983 · Granted Aug 25, 2026

Processing method of bonded wafer

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Quick Facts
Patent No.
US 12,721,072
App. No.
18/582,983
Filed
Feb 21, 2024
Granted
Aug 25, 2026
Kind
B2
Art Unit
2818
USPC
438/795
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 21, 2024
From: TANAKA, HAYATO; IGA, HAYATO
To: DISCO CORPORATION
Reel/Frame 066512/0795 →
Priority Claims (1)
JP 2023-032487 · Mar 3, 2023 · national
Continuity (1)
Related Publication 20240297052A1 · Sep 5, 2024
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