IP Library › Granted Patent US 12,721,211
Granted Patent B2
US 12,721,211 · App. 18/036,271 · Granted Aug 25, 2026

Method for producing wiring board

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Quick Facts
Patent No.
US 12,721,211
App. No.
18/036,271
Filed
May 10, 2023
Granted
Aug 25, 2026
Kind
B2
Examiner
CHANG, JAY C
Art Unit
2817
USPC
438/126
Assignments (2)
CHANGE OF NAME Recorded Dec 3, 2025
From: MITSTUI MINING & SMELTING CO., LTD.
To: MITSUI KINZOKU COMPANY, LIMITED
Reel/Frame 073640/0560 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 10, 2023
From: KITABATAKE, YUKIKO; YANAI, TAKENORI; MATSUURA, YOSHINORI
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 063599/0397 →
Priority Claims (1)
JP 2020-187948 · Nov 11, 2020 · national
Continuity (1)
Related Publication 20230420270A1 · Dec 28, 2023
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