IP Library › Granted Patent US 12,721,228
Granted Patent B2
US 12,721,228 · App. 18/420,210 · Granted Aug 25, 2026

Semiconductor package including a plurality of semiconductor chips in a stacked structure

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Quick Facts
Patent No.
US 12,721,228
App. No.
18/420,210
Filed
Jan 23, 2024
Granted
Aug 25, 2026
Kind
B2
Examiner
ANYA, IGWE U
Art Unit
2891
USPC
257/734
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2024
From: AHN, DUHYOUNG; KANG, MINSEOK; MOON, SUNGWOOK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 066218/0757 →
Priority Claims (2)
KR 10-2023-0013883 · Feb 1, 2023 · national
KR 10-2023-0065879 · May 22, 2023 · national
Continuity (1)
Related Publication 20240258275A1 · Aug 1, 2024
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