IP Library › Granted Patent US 12,729,334
Granted Patent B2
US 12,729,334 · App. 17/779,130 · Granted Sep 8, 2026

Curable composition set and article

Inventors: Nozomi Matsubara (Tokyo, JP); Yuki Nakamura (Tokyo, JP); Naoki Furukawa (Tokyo, JP); Hiroshi Yokota (Tokyo, JP); Tsuyoshi Morimoto (Tokyo, JP)
C09K5/14C08F222/1063C08F290/062C08K3/08C08K3/22C08K5/13C08K13/02C08K2003/0812C08K2003/2227C08K2201/001H05K7/2039
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Quick Facts
Patent No.
US 12,729,334
App. No.
17/779,130
Filed
May 24, 2022
Granted
Sep 8, 2026
Kind
B2
Art Unit
1767
USPC
524/430
Abstract

A curable composition set containing: a first liquid containing an oxidizing agent; and a second liquid containing a reducing agent, wherein at least one of the first liquid and the second liquid contains a compound represented by the following formula (1): wherein R 11 and R 12 each independently represent a hydrogen atom or a methyl group, and R 13 represents a divalent group having a polyoxyalkylene chain, and wherein at least one of the first liquid and the second liquid contains a thermally conductive filler.

Claims (19)

1 . A curable composition set comprising:

a first liquid comprising an oxidizing agent; and

a second liquid comprising a reducing agent,

wherein the first liquid and the second liquid each further comprise a compound represented by the following formula (1):

wherein R 11 and R 12 each independently represent a hydrogen atom or a methyl group, and R 13 represents a divalent group having a polyoxyalkylene chain,

wherein the first liquid and the second liquid each still further comprise a thermally conductive filler having a thermal conductivity of 10 W/m·K or higher, and

wherein a content of the thermally conductive filler is 60% by mass or more based on the sum of the first liquid and the second liquid.

2 . The curable composition set according to claim 1 , wherein the polyoxyalkylene chain comprises a structural unit represented by the following formula (2):

3 . The curable composition set according to claim 1 , wherein the polyoxyalkylene chain comprises a structural unit represented by the following formula (3):

4 . The curable composition set according to claim 1 , wherein the polyoxyalkylene chain is a copolymer chain comprising a structural unit represented by the following formula (2) and a structural unit represented by the following formula (3):

5 . The curable composition set according to claim 4 , wherein the copolymer chain is a random copolymer chain.

6 . The curable composition set according to claim 1 , wherein the compound represented by the formula (1) has a weight average molecular weight of 5000 or more.

7 . The curable composition set according to claim 1 , wherein the polyoxyalkylene chain has 100 or more of oxyalkylene groups.

8 . The curable composition set according to claim 1 , wherein the compound represented by the formula (1) has a viscosity at 25° C. of 1000 Pa·s or less.

9 . The curable composition set according to claim 1 , further comprising an oxidation inhibitor.

10 . The curable composition set according to claim 9 , wherein the oxidation inhibitor is a phenol-based oxidation inhibitor.

11 . The curable composition set according to claim 1 , wherein a content of the compound represented by the formula (1) is 1 to 20% by mass based on the sum of the first liquid and the second liquid.

12 . The curable composition set according to claim 1 , wherein both of the first liquid and the second liquid further comprise an additional polymerizable compound having one (meth)acryloyl group.

13 . The curable composition set according to claim 12 , wherein a content of the additional polymerizable compound is 1 to 20% by mass based on the sum of the first liquid and the second liquid.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
CHANGE OF NAME Recorded Apr 11, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063284/0307 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2022
From: MATSUBARA, NOZOMI; NAKAMURA, YUKI; FURUKAWA, NAOKI; YOKOTA, HIROSHI; MORIMOTO, TSUYOSHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 060128/0825 →
Priority Claims (2)
JP 2019-216616 · Nov 29, 2019 · national
JP 2020-019070 · Feb 6, 2020 · national
Continuity (1)
Related Publication 20230016868A1 · Jan 19, 2023
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