IP Library › Granted Patent US 12,745,349
Granted Patent B2
US 12,745,349 · App. 18/792,851 · Granted Sep 22, 2026

Electronic device comprising interposer printed circuit board

Inventors: Myungkyoon Chung (Suwon-si, KR); Sunyoung Im (Suwon-si, KR); Dohyeong Park (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H05K1/144H05K1/145H05K2201/096H05K2201/10378
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Quick Facts
Patent No.
US 12,745,349
App. No.
18/792,851
Granted
Sep 22, 2026
Kind
B2
Abstract

An electronic device including an interposer printed circuit board (PCB) may comprise: an interposer PCB including at least two vias; a first PCB including a first direct connection unit including a power supply circuit and configured to directly connect the power supply circuit to a first via, and a first extension connection unit comprising a conductive material configured to connect a second via through a wire extending from the first direct connection unit; and a second PCB including a second direct connection unit including a load circuit and configured to directly connect the load circuit to the second via, and a second extension connection unit comprising a conductive material configured to connect the first via through a wire extending from the second direct connection unit.

Claims (36)

1 . An electronic device comprising:

an interposer printed circuit board (PCB) comprising at least two vias;

a first PCB comprising a first direct connection unit comprising a power supply circuit and configured to directly connect the power supply circuit to a first via, and a first extension connection unit comprising a conductive material configured to connect a second via through a wire extending from the first direct connection unit; and

a second PCB comprising a second direct connection unit comprising a load circuit and configured to directly connect the load circuit to the second via, and a second extension connection unit comprising a conductive material configured to connect the first via through a wire extending from the second direct connection unit.

2 . The electronic device according to claim 1 ,

wherein the first PCB comprises a first conductive path comprising at least one conductor configured to electrically connect the power supply circuit and the first direct connection unit at a first node.

3 . The electronic device according to claim 2 ,

wherein the second PCB comprises a second conductive path comprising at least one conductor configured to electrically connect the load circuit and the second direct connection unit at a second node.

4 . The electronic device according to claim 2 ,

wherein the first PCB comprises a plurality of stacked PCBs.

5 . The electronic device according to claim 4 ,

wherein the first conductive path comprises penetrating electrodes for the plurality of PCBs, and wires for the respective PCBs.

6 . The electronic device according to claim 3 ,

wherein the second PCB comprises a plurality of stacked PCBs.

7 . The electronic device according to claim 6 ,

wherein the second conductive path comprises penetrating electrodes for the plurality of PCBs, and wires for the respective PCBs.

8 . The electronic device according to claim 3 ,

wherein the first via and the second extension connection unit are connected in series between the first node and the second node.

9 . The electronic device according to claim 3 ,

wherein the second via and the first extension connection unit are connected in series between the first node and the second node.

10 . The electronic device according to claim 1 ,

wherein the first extension connection unit extends in the form of a bridge from the first direct connection unit.

11 . The electronic device according to claim 1 ,

wherein the second extension connection unit extends in the form of a bridge from the second direct connection unit.

12 . The electronic device according to claim 1 ,

wherein the first PCB comprises:

a first contact area connected to the first via; and

a second contact area connected to the second via.

13 . The electronic device according to claim 12 ,

wherein the first contact area and/or the second contact area comprises one or more via connection areas.

14 . The electronic device according to claim 1 ,

wherein the second PCB comprises:

a third contact area connected to the first via; and

a fourth contact area connected to the second via.

15 . The electronic device according to claim 14 ,

wherein the third contact area and/or the fourth contact area comprises one or more via connection areas.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2024
From: CHUNG, MYUNGKYOON; IM, SUNYOUNG; PARK, DOHYEONG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 068292/0814 →
Priority Claims (1)
KR 10-2022-0014973 · Feb 4, 2022 · national
Continuity (2)
Continuation PCTKR2023001560 · Feb 3, 2023
Related Publication 20240397625A1 · Nov 28, 2024
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